Inventor · disambiguated record
John E. Pillion
Also filed as: PILLION JOHN E
11 granted patents·4 pending applications·372 citations·filing 1997–2014
91Inventor score
Top patents by PatentIndex Score
15 records- 0195US6596148B1Regeneration of plating baths and system thereforeMYKROLIS CORP·Filed 2000·Granted Jul 22, 2003·66 cites·32 claims
- 0291US6942779B2Method and system for regenerating of plating bathsMYKROLIS CORP·Filed 2002·Granted Sep 13, 2005·36 cites·31 claims
- 0390US6391209B1Regeneration of plating bathsMYKROLIS CORP·Filed 2000·Granted May 21, 2002·104 cites·34 claims
- 0485US7249628B2Apparatus for conditioning the temperature of a fluidENTEGRIS INC·Filed 2002·Granted Jul 31, 2007·58 cites·19 claims
- 0585US6428852B1Process for coating a solid surface with a liquid compositionMYKROLIS CORP·Filed 1999·Granted Aug 6, 2002·61 cites·21 claims
- 0675US6617079B1Process and system for determining acceptibility of a fluid dispenseMYKROLIS CORP·Filed 2000·Granted Sep 9, 2003·23 cites·24 claims
- 0764US2008067074A1Device and method for increasing mass transport at liquid-solid diffusion boundary layerWU QUNWEI·Filed 2007·Application pending·0 cites
- 0860US6964187B2Vacuum sensorMYKROLIS CORP·Filed 2002·Granted Nov 15, 2005·3 cites·6 claims
- 0959US7316728B2Method and apparatus for treating fluidsENTEGRIS INC·Filed 2003·Granted Jan 8, 2008·8 cites·10 claims
- 1054US10175133B2Sensor with protective layerENTEGRIS INC·Filed 2014·Granted Jan 8, 2019·0 cites·29 claims
- 1153US2007289732A1Apparatus for conditioning the temperature of a fluidPILLION JOHN E·Filed 2007·Application pending·0 cites
- 1251US7311808B2Device and method for increasing mass transport at liquid-solid diffusion boundary layerENTEGRIS INC·Filed 2003·Granted Dec 25, 2007·0 cites·27 claims
- 1348US5844125AMethod and apparatus for measuring moisture content in a gasMILLIPORE CORP·Filed 1997·Granted Dec 1, 1998·13 cites·18 claims
- 1436US2004224511A1Metal polishingFiled 2002·Application pending·0 cites
- 1536US2004197541A1Selective electroless deposition and interconnects made therefromFiled 2002·Application pending·0 cites
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