Inventor · disambiguated record
Wen-Hwa Chen
Also filed as: CHEN WEN G · CHEN WEN-HWA
11 granted patents·3 pending applications·89 citations·filing 1999–2020
88Inventor score
Files withCHIPMOS TECHNOLOGIES INC4CHANG KING JEN2IND TECH RES INST2AEROSPACE IND DEVELOPMENT CORPORATION1AMCAD BIOMED CORP1
Top patents by PatentIndex Score
14 records- 0182US8134823B2Stacked capacitor structure and manufacturing method thereofCHEN WEN-HWA·Filed 2009·Granted Mar 13, 2012·17 cites·7 claims
- 0274US8948474B2Quantification method of the feature of a tumor and an imaging method of the sameCHANG KING JEN·Filed 2010·Granted Feb 3, 2015·7 cites·9 claims
- 0364US7999350B2Electrode structure of memory capacitorIND TECH RES INST·Filed 2008·Granted Aug 16, 2011·3 cites·10 claims
- 0459US8374892B2Method for retrieving a tumor contour of an image processing systemAMCAD BIOMED CORP·Filed 2010·Granted Feb 12, 2013·2 cites·6 claims
- 0559US6034425AFlat multiple-chip module micro ball grid array packagingCHIPMOS TECHNOLOGIES INC·Filed 1999·Granted Mar 7, 2000·26 cites·10 claims
- 0657US6023097AStacked multiple-chip module micro ball grid array packagingCHIPMOS TECHNOLOGIES INC·Filed 1999·Granted Feb 8, 2000·24 cites·8 claims
- 0754US8747925B2Pharmaceutical composition for treating diabetesLEE CHEN-CHIA·Filed 2009·Granted Jun 10, 2014·0 cites·16 claims
- 0850US2007134277A1Pharmaceutical formulation for sulfur-containing drugs in liquid dosage formsCHILDRENS MEDICAL CENTER·Filed 2005·Application pending·0 cites
- 0948US6781225B2Glueless integrated circuit system in a packaging moduleCHIPMOS TECHNOLOGIES INC·Filed 2002·Granted Aug 24, 2004·4 cites·3 claims
- 1040US2009184393A1Memory capacitor and manufacturing method thereofIND TECH RES INST·Filed 2008·Application pending·0 cites
- 1135US11259635B2Seat and seatback linkage mechanismAEROSPACE IND DEVELOPMENT CORPORATION·Filed 2020·Granted Mar 1, 2022·0 cites·8 claims
- 1234US6137174AHybrid ASIC/memory module packageCHIPMOS TECHNOLOGIES INC·Filed 1999·Granted Oct 24, 2000·6 cites·8 claims
- 1333US8572006B2Method for multi-layer classifierCHANG KING JEN·Filed 2010·Granted Oct 29, 2013·0 cites·20 claims
- 1432US2002050378A1Double-layered multiple chip module packageFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →