Inventor · disambiguated record
Hideyuki Arakawa
Also filed as: ARAKAWA HIDEYUKI
13 granted patents·2 pending applications·288 citations·filing 1974–2012
90Inventor score
Files withRENESAS TECH CORP6KANEGAFUCHI CHEMICAL IND3ARAKAWA HIDEYUKI1MISUMI KAZUYUKI1MITSUBISHI ELECTRIC CORP1
Top patents by PatentIndex Score
15 records- 0194US7456091B2Semiconductor device and method of manufacturing the sameRENESAS TECH CORP·Filed 2006·Granted Nov 25, 2008·106 cites·4 claims
- 0294US6774494B2Semiconductor device and manufacturing method thereofRENESAS TECH CORP·Filed 2001·Granted Aug 10, 2004·129 cites·6 claims
- 0381US7622799B2Semiconductor device, interposer chip and manufacturing method of semiconductor deviceRENESAS TECH CORP·Filed 2006·Granted Nov 24, 2009·12 cites·2 claims
- 0475US6564989B2Wire bonding method and wire bonding apparatusMITSUBISHI ELECTRIC CORP·Filed 2001·Granted May 20, 2003·24 cites·13 claims
- 0555US8881966B2Method of manufacturing semiconductor device, and wire bonderMISUMI KAZUYUKI·Filed 2009·Granted Nov 11, 2014·1 cites·19 claims
- 0651US7659635B2Semiconductor device and method of manufacturing the sameRENESAS TECH CORP·Filed 2008·Granted Feb 9, 2010·0 cites·2 claims
- 0749US9230937B2Semiconductor device and a manufacturing method thereofSUMITOMO KAORI·Filed 2012·Granted Jan 5, 2016·1 cites·13 claims
- 0849US5132330AMethod for manufacturing expandable styrene type polymer particlesKANEGAFUCHI CHEMICAL IND·Filed 1991·Granted Jul 21, 1992·10 cites·4 claims
- 0947US7943433B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2009·Granted May 17, 2011·0 cites·13 claims
- 1042US2008054052A1Method of manufacturing semiconductor deviceARAKAWA HIDEYUKI·Filed 2007·Application pending·0 cites
- 1141US7763966B2Resin molded semiconductor device and differential amplifier circuitRENESAS TECH CORP·Filed 2008·Granted Jul 27, 2010·0 cites·2 claims
- 1240US2006216863A1Method of manufacturing semiconductor deviceRENESAS TECH CORP·Filed 2006·Application pending·0 cites
- 1336US4013608AMethod of producing polymer solutions of polymers or copolymers of vinyl chloride seriesKANEGAFUCHI CHEMICAL IND·Filed 1975·Granted Mar 22, 1977·4 cites·15 claims
- 1428US8415245B2Method of manufacturing semiconductor device and semiconductor deviceTAKATA YASUKI·Filed 2010·Granted Apr 9, 2013·0 cites·18 claims
- 1528US3956425AModifier for vinylidene chloride resinKANEGAFUCHI CHEMICAL IND·Filed 1974·Granted May 11, 1976·1 cites·5 claims
Join the waitlist — get patent alerts
Get an alert when Hideyuki Arakawa files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →