Inventor · disambiguated record
Shih-Ching Chen
Also filed as: CHEN SHIH H · CHEN SHIH- CHING
35 granted patents·15 pending applications·204 citations·filing 1996–2024
96Inventor score
Files withSILICONWARE PRECISION INDUSTRIES CO LTD17UNITED SEMICONDUCTOR CORP4CAMBRIOS FILM SOLUTIONS CORP3CHANG TING-CHANG3SECURITAG ASSEMBLY GROUP CO LTD3
Top patents by PatentIndex Score
50 records- 0192US6354316B1Skeleton for umbrella tentFiled 2000·Granted Mar 12, 2002·56 cites·2 claims
- 0289US9754868B2Substrate structure, electronic package and method for fabricating the electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Sep 5, 2017·8 cites·6 claims
- 0386US6802329B2Top setting-up mechanism for folding tentFiled 2003·Granted Oct 12, 2004·37 cites·4 claims
- 0483US9875949B2Electronic package having circuit structure with plurality of metal layers, and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Jan 23, 2018·5 cites·24 claims
- 0580US6397433B1Knuckle assemblyFiled 2000·Granted Jun 4, 2002·28 cites·1 claims
- 0677US11353996B2Touch-sensing cover and manufacturing method thereofTPK UNIVERSAL SOLUTIONS LTD·Filed 2019·Granted Jun 7, 2022·2 cites·8 claims
- 0773US9601403B2Electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Mar 21, 2017·2 cites·19 claims
- 0868US10543367B2Transcranial burst electrostimulation apparatus and its applicationsUNIV TAIPEI MEDICAL·Filed 2015·Granted Jan 28, 2020·3 cites·13 claims
- 0966US11050207B2Crimping apparatus and system for crimping a flexible printed circuitSECURITAG ASSEMBLY GROUP CO LTD·Filed 2020·Granted Jun 29, 2021·0 cites·5 claims
- 1064US8427879B2Method for enabling a SONOS transistor to be used as both a switch and a memoryCHANG TING-CHANG·Filed 2009·Granted Apr 23, 2013·3 cites·8 claims
- 1163US8431399B2Method to restore cartilaginous phenotype of chondrocytes after cultured and expanded in vitroTSAI YU-HUI·Filed 2010·Granted Apr 30, 2013·1 cites·20 claims
- 1261US11513638B2Silver nanowire protection layer structure and manufacturing method thereofCAMBRIOS FILM SOLUTIONS CORP·Filed 2020·Granted Nov 29, 2022·0 cites·20 claims
- 1360US8592794B2Resistance random access memory element and method for making the sameCHANG TING-CHANG·Filed 2011·Granted Nov 26, 2013·1 cites·6 claims
- 1460US7835192B2Method for programming a nonvolatile memoryACER INC·Filed 2008·Granted Nov 16, 2010·1 cites·12 claims
- 1558US2024264219A1Circuit board for semiconductor testing and method of manufacturing the sameMPI CORP·Filed 2024·Application pending·0 cites
- 1655US9735075B2Electronic module and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Aug 15, 2017·0 cites·9 claims
- 1754US11249572B2Touch panelCAMBRIOS FILM SOLUTIONS CORP·Filed 2020·Granted Feb 15, 2022·0 cites·20 claims
- 1853US10403596B2Method of fabricating packaging structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Sep 3, 2019·0 cites·9 claims
- 1952US10461002B2Fabrication method of electronic moduleSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Oct 29, 2019·0 cites·11 claims
- 2052US10096541B2Method for fabricating electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Oct 9, 2018·0 cites·9 claims
- 2152US2016005695A1Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Application pending·0 cites
- 2252US2019109092A1Positioning structure having positioning unitSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Application pending·0 cites
- 2351US2006144434A1Tent structure foldableCHEN SHIH-CHING·Filed 2004·Application pending·0 cites
- 2449US6238996B1Method of forming a shallow trench isolation structureUNITED MICROELECTRONICS CORP·Filed 1999·Granted May 29, 2001·20 cites·8 claims
- 2549US2015035164A1Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 2648US6171955B1Method for forming hemispherical grained silicon structureUNITED SEMICONDUCTOR CORP·Filed 1999·Granted Jan 9, 2001·13 cites·15 claims
- 2748US2018287324A1Crimping apparatus and system for crimping a flexible printed circuitSECURITAG ASSEMBLY GROUP CO LTD·Filed 2018·Application pending·0 cites
- 2846US11612744B2Head cap with channel identificationUNIV TAIPEI MEDICAL·Filed 2020·Granted Mar 28, 2023·0 cites·9 claims
- 2946US2017148761A1Method of fabricating semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Application pending·0 cites
- 3045US10014641B2Crimping apparatus and system for crimping a flexible printed circuitSECURITAG ASSEMBLY GROUP CO LTD·Filed 2015·Granted Jul 3, 2018·0 cites·11 claims
- 3145US2016163632A1Packaging structure and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Application pending·0 cites
- 3245US2022301739A1Optically consistent transparent conductor and manufacturing method thereofCAMBRIOS FILM SOLUTIONS CORP·Filed 2021·Application pending·0 cites
- 3343US9899309B2Electronic package and semiconductor substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Feb 20, 2018·0 cites·16 claims
- 3442US10434707B2Touch substrate manufactured by three-dimensional printing and method for manufacturing the sameTPK UNIVERSAL SOLUTIONS LTD·Filed 2017·Granted Oct 8, 2019·0 cites·8 claims
- 3542US6121109AMethod of forming hemispherical grain polysilicon over lower electrode capacitorUNITED SEMICONDUCTOR CORP·Filed 1998·Granted Sep 19, 2000·9 cites·29 claims
- 3642US2007103446A1Wiring of touch panelTRENDON TOUCH TECHNOLOGY CORP·Filed 2005·Application pending·0 cites
- 3741US11852679B2Circuit board for semiconductor testMPI CORP·Filed 2022·Granted Dec 26, 2023·0 cites·13 claims
- 3841US5658833AMethod and dummy disc for uniformly depositing silicon nitrideUNITED MICROELECTRONICS CORP·Filed 1996·Granted Aug 19, 1997·8 cites·5 claims
- 3941US2015035163A1Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 4039US8907228B2Circuit structure of electronic device and its manufacturing methodHUANG WEN-FU·Filed 2012·Granted Dec 9, 2014·0 cites·20 claims
- 4138US9607974B2Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Mar 28, 2017·0 cites·6 claims
- 4238US2011262486A1Bone implant and manufacturing method thereofUNIV TAIPEI MEDICAL·Filed 2010·Application pending·0 cites
- 4338US2005088268A1Silicon steel structureFiled 2003·Application pending·0 cites
- 4437US10242972B2Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Mar 26, 2019·0 cites·27 claims
- 4536US8208307B2Operation method of memory deviceCHANG TING-CHANG·Filed 2010·Granted Jun 26, 2012·0 cites·10 claims
- 4635US6187630B1Method for forming hemispherical silicon grains on designated areas of silicon layerUNITED SEMICONDUCTOR CORP·Filed 1999·Granted Feb 13, 2001·3 cites·13 claims
- 4734US2013030045A1Method of preventing and treating osteoporosisTSAI YU-HUI·Filed 2012·Application pending·0 cites
- 4833US6239040B1Method of coating amorphous silicon filmUNITED MICROELECTRONICS CORP·Filed 1998·Granted May 29, 2001·3 cites·20 claims
- 4933US2016307833A1Electronic packaging structure and method for fabricating electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Application pending·0 cites
- 5031US6204121B1Method for bottom electrode of capacitorUNITED SEMICONDUCTOR CORP·Filed 1998·Granted Mar 20, 2001·1 cites·13 claims
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