Inventor · disambiguated record
George E. White
Also filed as: WHITE GEORGE · WHITE GEORGE E · WHITE GEORGE EUGENE
26 granted patents·1 pending application·1,018 citations·filing 1985–2010
97Inventor score
Top patents by PatentIndex Score
27 records- 0197US7795995B2Liquid crystalline polymer and multilayer polymer-based passive signal processing components for RF/wireless multi-band applicationsGEORGIA TECH RES INST·Filed 2005·Granted Sep 14, 2010·62 cites·33 claims
- 0296US8013688B2Liquid crystalline polymer and multilayer polymer-based passive signal processing components for RF/wireless multi-band applicationsGEORGIA TECH RES INST·Filed 2010·Granted Sep 6, 2011·24 cites·22 claims
- 0396US7068124B2Integrated passive devices fabricated utilizing multi-layer, organic laminatesGEORGIA TECH RES INST·Filed 2005·Granted Jun 27, 2006·39 cites·32 claims
- 0494US6900708B2Integrated passive devices fabricated utilizing multi-layer, organic laminatesGEORGIA TECH RES INST·Filed 2003·Granted May 31, 2005·79 cites·34 claims
- 0593US7489914B2Multi-band RF transceiver with passive reuse in organic substratesGEORGIA TECH RES INST·Filed 2005·Granted Feb 10, 2009·48 cites·20 claims
- 0692US8345433B2Heterogeneous organic laminate stack ups for high frequency applicationsAVX CORP·Filed 2005·Granted Jan 1, 2013·25 cites·8 claims
- 0791US5898222ACapped copper electrical interconnectsIBM·Filed 1997·Granted Apr 27, 1999·95 cites·30 claims
- 0890US6987307B2Stand-alone organic-based passive devicesGEORGIA TECH RES INST·Filed 2003·Granted Jan 17, 2006·58 cites·9 claims
- 0989US7808434B2Systems and methods for integrated antennae structures in multilayer organic-based printed circuit devicesAVX CORP·Filed 2007·Granted Oct 5, 2010·18 cites·21 claims
- 1089US7260890B2Methods for fabricating three-dimensional all organic interconnect structuresGEORGIA TECH RES INST·Filed 2003·Granted Aug 28, 2007·35 cites·19 claims
- 1189US5549808AMethod for forming capped copper electrical interconnectsIBM·Filed 1995·Granted Aug 27, 1996·113 cites·30 claims
- 1288US5757079AMethod for repairing defective electrical connections on multi-layer thin film (MLTF) electronic packages and the resulting MLTF structureIBM·Filed 1995·Granted May 26, 1998·90 cites·8 claims
- 1387US7989895B2Integration using package stacking with multi-layer organic substratesAVX CORP·Filed 2007·Granted Aug 2, 2011·15 cites·11 claims
- 1485US7805834B2Method for fabricating three-dimensional all organic interconnect structuresGEORGIA TECH RES INST·Filed 2007·Granted Oct 5, 2010·10 cites·20 claims
- 1584US5534466AMethod of making area direct transfer multilayer thin film structureIBM·Filed 1995·Granted Jul 9, 1996·76 cites·19 claims
- 1681US5545927ACapped copper electrical interconnectsIBM·Filed 1995·Granted Aug 13, 1996·50 cites·8 claims
- 1778US4616522ASteering column energy absorbing release bushing and deforming bracketCHRYSLER CORP·Filed 1985·Granted Oct 14, 1986·44 cites·2 claims
- 1875US7439840B2Methods and apparatuses for high-performing multi-layer inductorsJACKET MICRO DEVICES INC·Filed 2006·Granted Oct 21, 2008·12 cites·20 claims
- 1965US5747095AMethod for repairing defective electrical connections on multi-layer thin film (MLTF) electronic packagesIBM·Filed 1997·Granted May 5, 1998·28 cites·10 claims
- 2063US7874519B2Spacecraft three-axis attitude acquisition from sun direction measurementLORAL SPACE SYSTEMS INC·Filed 2007·Granted Jan 25, 2011·6 cites·15 claims
- 2162US6444919B1Thin film wiring scheme utilizing inter-chip site surface wiringIBM·Filed 1995·Granted Sep 3, 2002·29 cites·21 claims
- 2260US5705857ACapped copper electrical interconnectsIBM·Filed 1996·Granted Jan 6, 1998·20 cites·5 claims
- 2356US6225035B1Method for forming a thick-film resistorMOTOROLA INC·Filed 1998·Granted May 1, 2001·20 cites·5 claims
- 2447US5464682AMinimal capture pads applied to ceramic vias in ceramic substratesIBM·Filed 1993·Granted Nov 7, 1995·13 cites·15 claims
- 2535US5916451AMinimal capture pads applied to ceramic vias in ceramic substratesIBM·Filed 1995·Granted Jun 29, 1999·4 cites·16 claims
- 2634US2002158305A1Organic substrate having integrated passive componentsFiled 2001·Application pending·0 cites
- 2733US5483105AModule input-output pad having stepped set-backIBM·Filed 1994·Granted Jan 9, 1996·5 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →