Inventor · disambiguated record
Cheng-Chung Lin
Also filed as: LIN CHENG-CHUNG
48 granted patents·4 pending applications·595 citations·filing 1999–2022
98Inventor score
Files withTAIWAN SEMICONDUCTOR MFG22TAIWAN SEMICONDUCTOR MFG CO LTD7HWANG CHIEN LING4LIN CHENG-CHUNG4VIA LABS INC3
Top patents by PatentIndex Score
52 records- 0196US8441124B2Cu pillar bump with non-metal sidewall protection structureWU YI-WEN·Filed 2010·Granted May 14, 2013·25 cites·20 claims
- 0296US8258055B2Method of forming semiconductor dieHWANG CHIEN LING·Filed 2010·Granted Sep 4, 2012·38 cites·16 claims
- 0396US8104666B1Thermal compressive bonding with separate die-attach and reflow processesHWANG CHIEN LING·Filed 2010·Granted Jan 31, 2012·29 cites·18 claims
- 0495US8823166B2Pillar bumps and process for making sameLIN CHENG-CHUNG·Filed 2010·Granted Sep 2, 2014·25 cites·10 claims
- 0595US8317077B2Thermal compressive bonding with separate die-attach and reflow processesHWANG CHIEN LING·Filed 2012·Granted Nov 27, 2012·22 cites·15 claims
- 0695US7176137B2Method for multiple spacer width controlTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Feb 13, 2007·101 cites·20 claims
- 0793US9378926B2Electron beam lithography methods including time division multiplex loadingTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Jun 28, 2016·10 cites·20 claims
- 0892US8609526B2Preventing UBM oxidation in bump formation processesLIU CHUNG-SHI·Filed 2010·Granted Dec 17, 2013·16 cites·20 claims
- 0990US8941085B2Electron beam lithography systems and methods including time division multiplex loadingTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 27, 2015·9 cites·18 claims
- 1088US8900922B2Fine-pitch package-on-package structures and methods for forming the sameLIN CHENG-CHUNG·Filed 2012·Granted Dec 2, 2014·11 cites·14 claims
- 1186US6407013B1Soft plasma oxidizing plasma method for forming carbon doped silicon containing dielectric layer with enhanced adhesive propertiesTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Jun 18, 2002·43 cites·13 claims
- 1286US6383935B1Method of reducing dishing and erosion using a sacrificial layerTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted May 7, 2002·45 cites·16 claims
- 1386US6372661B1Method to improve the crack resistance of CVD low-k dielectric constant materialTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Apr 16, 2002·60 cites·32 claims
- 1485US8177862B2Thermal compressive bond headHWANG CHIEN LING·Filed 2010·Granted May 15, 2012·7 cites·15 claims
- 1583US6943077B2Selective spacer layer deposition method for forming spacers with different widthsTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Sep 13, 2005·24 cites·21 claims
- 1682US9449931B2Pillar bumps and process for making sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Sep 20, 2016·4 cites·20 claims
- 1781US8674496B2System and method for fine pitch PoP structureLIN CHENG-CHUNG·Filed 2012·Granted Mar 18, 2014·5 cites·20 claims
- 1879US11386030B2Connection interface conversion chip, connection interface conversion device and operation methodVIA LABS INC·Filed 2020·Granted Jul 12, 2022·1 cites·26 claims
- 1978US9287171B2Method of making a conductive pillar bump with non-metal sidewall protection structureTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Mar 15, 2016·3 cites·20 claims
- 2078US8560997B1Conditional cell placementYANG PING-LIN·Filed 2012·Granted Oct 15, 2013·6 cites·20 claims
- 2177US8823167B2Copper pillar bump with non-metal sidewall protection structure and method of making the sameWU YI-WEN·Filed 2012·Granted Sep 2, 2014·3 cites·20 claims
- 2275US8227334B2Doping minor elements into metal bumpsCHENG MING-DA·Filed 2010·Granted Jul 24, 2012·3 cites·18 claims
- 2373US6746900B1Method for forming a semiconductor device having high-K gate dielectric materialTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Jun 8, 2004·17 cites·25 claims
- 2472US6645864B1Physical vapor deposition of an amorphous silicon liner to eliminate resist poisoningTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Nov 11, 2003·18 cites·28 claims
- 2571US8269549B2Power supply circuit for PCI-E slotLIN CHENG-CHUNG·Filed 2011·Granted Sep 18, 2012·3 cites·4 claims
- 2671US8053894B2Surface treatment of metal interconnect linesTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Nov 8, 2011·3 cites·24 claims
- 2770US6955984B2Surface treatment of metal interconnect linesTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Oct 18, 2005·12 cites·34 claims
- 2867US11768786B2Connection interface conversion chip, connection interface conversion device and operation methodVIA LABS INC·Filed 2022·Granted Sep 26, 2023·0 cites·28 claims
- 2965US9846755B2Method for cell placement in semiconductor layout and system thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 19, 2017·1 cites·20 claims
- 3065US9281288B2System and method for fine pitch PoP structureTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Mar 8, 2016·1 cites·20 claims
- 3165US8592300B2Interface structure for copper-copper peeling integrityTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Nov 26, 2013·2 cites·20 claims
- 3263US11270052B2System and method of timing characterization for semiconductor circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 8, 2022·0 cites·20 claims
- 3363US7271103B2Surface treated low-k dielectric as diffusion barrier for copper metallizationTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Sep 18, 2007·8 cites·12 claims
- 3461US10824784B2System and method of timing characterization for semiconductor circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 3, 2020·0 cites·20 claims
- 3559USD458054SRackSUN SHINE LIN IND CO LTD·Filed 2001·Granted Jun 4, 2002·10 cites·1 claims
- 3658US9362899B2Clock regeneratorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jun 7, 2016·1 cites·14 claims
- 3758US6794295B1Method to improve stability and reliability of CVD low K dielectricTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Sep 21, 2004·6 cites·18 claims
- 3856US8344506B2Interface structure for copper-copper peeling integrityTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Jan 1, 2013·0 cites·14 claims
- 3953USD464501SComputer deskSUN SHINE LIN IND CO LTD·Filed 2001·Granted Oct 22, 2002·8 cites·1 claims
- 4052US9286970B2Memory circuit for pre-charging and write drivingTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Mar 15, 2016·1 cites·17 claims
- 4150US9202662B2Charged particle lithography system with a long shape illumination beamTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 1, 2015·0 cites·20 claims
- 4250US8432259B2Picking systemHUANG CHUN-HUI·Filed 2011·Granted Apr 30, 2013·3 cites·17 claims
- 4349US6197706B1Low temperature method to form low k dielectricTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Mar 6, 2001·4 cites·20 claims
- 4448US2006113616A1Selective spacer layer deposition method for forming spacers with different widthsLIU AI-SEN·Filed 2005·Application pending·0 cites
- 4548US2012286423A1Doping Minor Elements into Metal BumpsCHENG MING-DA·Filed 2012·Application pending·0 cites
- 4647US9495495B2Scan cell assignmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 15, 2016·0 cites·20 claims
- 4743US11176074B2Chip and interface conversion deviceVIA LABS INC·Filed 2020·Granted Nov 16, 2021·0 cites·19 claims
- 4843US2010201490A1Display device and display system thereofHUANG CHUN-HUI·Filed 2009·Application pending·0 cites
- 4940US9679915B2Integrated circuit with well and substrate contactsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jun 13, 2017·0 cites·20 claims
- 5036US6171170B1Musical rotating luminous deviceFiled 1999·Granted Jan 9, 2001·7 cites·7 claims
Showing the top 50 of 52 patent records by PatentIndex Score.
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