Inventor · disambiguated record
John Charles Ehmke
Also filed as: EHMKE JOHN C · EHMKE JOHN CHARLES
30 granted patents·4 pending applications·427 citations·filing 1992–2024
96Inventor score
Top patents by PatentIndex Score
34 records- 0194US6391675B1Method and apparatus for switching high frequency signalsRAYTHEON CO·Filed 1999·Granted May 21, 2002·112 cites·11 claims
- 0291US10427932B2Hermetically sealed MEMS device and its fabricationTEXAS INSTRUMENTS INC·Filed 2018·Granted Oct 1, 2019·6 cites·6 claims
- 0391US9966194B2MEMS electrostatic actuator device for RF varactor applicationsTEXAS INSTRUMENTS INC·Filed 2016·Granted May 8, 2018·6 cites·19 claims
- 0489US6856014B1Method for fabricating a lid for a wafer level packaged optical MEMS deviceTEXAS INSTRUMENTS INC·Filed 2003·Granted Feb 15, 2005·65 cites·25 claims
- 0585US9567213B1Hermetically-sealed MEMS device and its fabricationTEXAS INSTRUMENTS INC·Filed 2015·Granted Feb 14, 2017·4 cites·9 claims
- 0684US6633079B2Wafer level interconnectionRAYTHEON CO·Filed 2002·Granted Oct 14, 2003·41 cites·20 claims
- 0783US6803534B1Membrane for micro-electro-mechanical switch, and methods of making and using itRAYTHEON CO·Filed 2001·Granted Oct 12, 2004·63 cites·30 claims
- 0880US10759658B2Hermetic vertical shear weld wafer bondingTEXAS INSTRUMENTS INC·Filed 2018·Granted Sep 1, 2020·1 cites·19 claims
- 0976US11858806B2Vertical shear weld wafer bondingTEXAS INSTRUMENTS INC·Filed 2021·Granted Jan 2, 2024·0 cites·18 claims
- 1076US6512300B2Water level interconnectionRAYTHEON CO·Filed 2001·Granted Jan 28, 2003·24 cites·4 claims
- 1174US9140898B2Hermetically sealed MEMS device and its fabricationTEXAS INSTRUMENTS INC·Filed 2013·Granted Sep 22, 2015·4 cites·21 claims
- 1271US9796585B2Leak detection using cavity surface quality factorTEXAS INSTRUMENTS INC·Filed 2016·Granted Oct 24, 2017·1 cites·11 claims
- 1370US10392246B2Through-substrate conductor supportTEXAS INSTRUMENTS INC·Filed 2017·Granted Aug 27, 2019·1 cites·6 claims
- 1469US10750645B2Transparent display panel coolingTEXAS INSTRUMENTS INC·Filed 2018·Granted Aug 18, 2020·1 cites·11 claims
- 1568US6147582ASubstrate supported three-dimensional micro-coilRAYTHEON CO·Filed 1999·Granted Nov 14, 2000·24 cites·6 claims
- 1667US7449765B2Semiconductor device and method of fabricationTEXAS INSTRUMENTS INC·Filed 2006·Granted Nov 11, 2008·2 cites·19 claims
- 1766US6700172B2Method and apparatus for switching high frequency signalsRAYTHEON CO·Filed 2001·Granted Mar 2, 2004·11 cites·12 claims
- 1866US2020391993A1Vertical shear weld wafer bondingTEXAS INSTRUMENTS INC·Filed 2020·Application pending·0 cites
- 1964US2025320115A1Mems devices singulated by plasma etchTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 2063US7977208B2Method and apparatus for packaging circuit devicesRAYTHEON CO·Filed 2010·Granted Jul 12, 2011·1 cites·11 claims
- 2163US7535093B1Method and apparatus for packaging circuit devicesRAYTHEON CO·Filed 2002·Granted May 19, 2009·9 cites·8 claims
- 2262US11084717B2Through-substrate conductor supportTEXAS INSTRUMENTS INC·Filed 2019·Granted Aug 10, 2021·0 cites·10 claims
- 2361US11835739B2Dark mirror thin filmsTEXAS INSTRUMENTS INC·Filed 2020·Granted Dec 5, 2023·0 cites·20 claims
- 2459US7867874B2Method and apparatus for packaging circuit devicesRAYTHEON CO·Filed 2009·Granted Jan 11, 2011·1 cites·9 claims
- 2558US6501431B1Method and apparatus for increasing bandwidth of a stripline to slotline transitionRAYTHEON CO·Filed 2001·Granted Dec 31, 2002·15 cites·30 claims
- 2655US11167983B2Selective wafer removal process for wafer bonding applicationsTEXAS INSTRUMENTS INC·Filed 2019·Granted Nov 9, 2021·0 cites·8 claims
- 2754US11000915B2Stabilized transient liquid phase metal bonding material for hermetic wafer level packaging of MEMS devicesTEXAS INSTRUMENTS INC·Filed 2016·Granted May 11, 2021·0 cites·16 claims
- 2854US9890036B2Hermetically sealed MEMS device and its fabricationTEXAS INSTRUMENTS INC·Filed 2017·Granted Feb 13, 2018·0 cites·9 claims
- 2950US5536680ASelf-aligned bump bond infrared focal plane array architectureTEXAS INSTRUMENTS INC·Filed 1995·Granted Jul 16, 1996·14 cites·12 claims
- 3047US2024282716A1Structure and method for bonded wafer barrierTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 3146US6359290B1Self-aligned bump bond infrared focal plane array architectureRAYTHEON CO·Filed 1996·Granted Mar 19, 2002·12 cites·12 claims
- 3243US5298733AInfrared focal plane array with integral slot shield using spin-on epoxy and method of making sameTEXAS INSTRUMENTS INC·Filed 1992·Granted Mar 29, 1994·9 cites·21 claims
- 3340US2006243384A1Method for adhesive bonding in electronic packagingTEXAS INSTRUMENTS INC·Filed 2005·Application pending·0 cites
- 3422US5834775AIntegral slot shield for infrared focal plane arraysRAYTHEON TI SYST INC·Filed 1996·Granted Nov 10, 1998·0 cites·28 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →