Inventor · disambiguated record
Hideyuki Seike
Also filed as: SEIKE HIDEYUKI
10 granted patents·1 pending application·21 citations·filing 2012–2018
83Inventor score
Files withTDK CORP11
Top patents by PatentIndex Score
11 records- 0193US9818736B1Method for producing semiconductor packageTDK CORP·Filed 2017·Granted Nov 14, 2017·11 cites·4 claims
- 0273US8933336B2Coating and electronic componentTDK CORP·Filed 2012·Granted Jan 13, 2015·3 cites·7 claims
- 0372US9257402B2Terminal structure, and semiconductor element and module substrate comprising the sameTDK CORP·Filed 2013·Granted Feb 9, 2016·3 cites·7 claims
- 0468US9070606B2Terminal structure and semiconductor deviceTDK CORP·Filed 2013·Granted Jun 30, 2015·2 cites·6 claims
- 0566US9640500B2Terminal structure and semiconductor deviceTDK CORP·Filed 2013·Granted May 2, 2017·2 cites·9 claims
- 0655US10354973B2Method for producing semiconductor chipTDK CORP·Filed 2018·Granted Jul 16, 2019·0 cites·11 claims
- 0753US8787028B2Terminal structure, printed circuit board, module board, electronic device, and method for manufacturing terminal structureTDK CORP·Filed 2012·Granted Jul 22, 2014·0 cites·11 claims
- 0852US10163847B2Method for producing semiconductor packageTDK CORP·Filed 2017·Granted Dec 25, 2018·0 cites·19 claims
- 0950US2013192873A1Structure body and electronic component and printed wiring board including the sameTDK CORP·Filed 2012·Application pending·0 cites
- 1049US9177687B2Coating and electronic componentTDK CORP·Filed 2012·Granted Nov 3, 2015·0 cites·17 claims
- 1147US8970037B2Terminal structure, and semiconductor element and module substrate comprising the sameTDK CORP·Filed 2013·Granted Mar 3, 2015·0 cites·5 claims
Join the waitlist — get patent alerts
Get an alert when Hideyuki Seike files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →