Inventor · disambiguated record
Jon Chadwick
Also filed as: CHADWICK JON D · Chadwick Jon
14 granted patents·175 citations·filing 1995–2019
90Inventor score
Top patents by PatentIndex Score
14 records- 0197US10882740B2Wafer-level package with enhanced performance and manufacturing method thereofQORVO US INC·Filed 2019·Granted Jan 5, 2021·25 cites·16 claims
- 0297US9613831B2Encapsulated dies with enhanced thermal performanceRF MICRO DEVICES INC·Filed 2015·Granted Apr 4, 2017·64 cites·27 claims
- 0394US9960145B2Flip chip module with enhanced propertiesQORVO US INC·Filed 2016·Granted May 1, 2018·15 cites·25 claims
- 0476US10773952B2Wafer-level package with enhanced performanceQORVO US INC·Filed 2017·Granted Sep 15, 2020·2 cites·22 claims
- 0574US10020206B2Encapsulated dies with enhanced thermal performanceRF MICRO DEVICES INC·Filed 2016·Granted Jul 10, 2018·2 cites·19 claims
- 0670US5581132APeak demand limiter and sequencerFiled 1995·Granted Dec 3, 1996·65 cites·7 claims
- 0769US11069590B2Wafer-level fan-out package with enhanced performanceQORVO US INC·Filed 2019·Granted Jul 20, 2021·1 cites·20 claims
- 0869US10486963B2Wafer-level package with enhanced performanceQORVO US INC·Filed 2017·Granted Nov 26, 2019·1 cites·22 claims
- 0956US11063021B2Microelectronics package with vertically stacked diesQORVO US INC·Filed 2019·Granted Jul 13, 2021·0 cites·20 claims
- 1055US10755992B2Wafer-level packaging for enhanced performanceQORVO US INC·Filed 2018·Granted Aug 25, 2020·0 cites·24 claims
- 1154US10804179B2Wafer-level package with enhanced performanceQORVO US INC·Filed 2018·Granted Oct 13, 2020·0 cites·17 claims
- 1254US10490471B2Wafer-level packaging for enhanced performanceQORVO US INC·Filed 2018·Granted Nov 26, 2019·0 cites·22 claims
- 1353US10804246B2Microelectronics package with vertically stacked diesQORVO US INC·Filed 2018·Granted Oct 13, 2020·0 cites·22 claims
- 1451US10109550B2Wafer-level package with enhanced performanceQORVO US INC·Filed 2017·Granted Oct 23, 2018·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →