Inventor · disambiguated record
Ying-Chih Chan
Also filed as: CHAN YING-CHIH
8 granted patents·2 pending applications·21 citations·filing 2008–2015
82Inventor score
Top patents by PatentIndex Score
10 records- 0185US9337136B2Method of fabricating a through-holed interposerUNIMICRON TECHNOLOGY CORP·Filed 2015·Granted May 10, 2016·4 cites·3 claims
- 0278US8981570B2Through-holed interposer, packaging substrate, and methods of fabricating the sameUNIMICRON TECHNOLOGY CORP·Filed 2013·Granted Mar 17, 2015·3 cites·8 claims
- 0375US8502370B2Stack package structure and fabrication method thereofCHAN YING-CHIH·Filed 2012·Granted Aug 6, 2013·10 cites·20 claims
- 0466US9408313B2Packaging substrate and method of fabricating the sameUNIMICRON TECHNOLOGY CORP·Filed 2014·Granted Aug 2, 2016·2 cites·5 claims
- 0566US9111818B2Packaging substrateUNIMICRON TECHNOLOGY CORP·Filed 2013·Granted Aug 18, 2015·2 cites·19 claims
- 0652US9460992B2Packaging substrate having a through-holed interposerUNIMICRON TECHNOLOGY CORP·Filed 2015·Granted Oct 4, 2016·0 cites·6 claims
- 0752US9224683B2Method of fabricating packaging substrate having a through-holed interposerUNIMICRON TECHNOLOGY CORP·Filed 2015·Granted Dec 29, 2015·0 cites·2 claims
- 0845US2010096750A1Packaging substratePHOENIX PREC TECHNOLOGY CORP·Filed 2008·Application pending·0 cites
- 0941US2013249083A1Packaging substrateUNIMICRON TECHNOLOGY CORP·Filed 2013·Application pending·0 cites
- 1037US9491871B2Carrier substrateUNIMICRON TECHNOLOGY CORP·Filed 2015·Granted Nov 8, 2016·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →