Inventor · disambiguated record
Konstantine Karavakis
Also filed as: KARAVAKIS KONSTANTINE · KARAVAKIS KONSTANTINE N
74 granted patents·14 pending applications·3,238 citations·filing 1994–2023
99Inventor score
Top patents by PatentIndex Score
88 records- 0199US7872344B2Microelectronic assemblies having compliant layersTESSERA INC·Filed 2006·Granted Jan 18, 2011·64 cites·21 claims
- 0299US5590460AMethod of making multilayer circuitTESSERA INC·Filed 1994·Granted Jan 7, 1997·172 cites·34 claims
- 0398US7408260B2Microelectronic assemblies having compliant layersTESSERA INC·Filed 2006·Granted Aug 5, 2008·52 cites·23 claims
- 0498US6847101B2Microelectronic package having a compliant layer with bumped protrusionsTESSERA INC·Filed 2002·Granted Jan 25, 2005·129 cites·47 claims
- 0598US6211572B1Semiconductor chip package with fan-in leadsTESSERA INC·Filed 1996·Granted Apr 3, 2001·282 cites·21 claims
- 0696US9706650B1Catalytic laminate apparatus and methodSIERRA CIRCUITS INC·Filed 2016·Granted Jul 11, 2017·15 cites·25 claims
- 0796US7491069B1Self-cleaning socket for microelectronic devicesCENTIPEDE SYSTEMS INC·Filed 2008·Granted Feb 17, 2009·68 cites·9 claims
- 0896US6086386AFlexible connectors for microelectronic elementsTESSERA INC·Filed 1997·Granted Jul 11, 2000·248 cites·46 claims
- 0996US5971253AMicroelectronic component mounting with deformable shell terminalsTESSERA INC·Filed 1996·Granted Oct 26, 1999·196 cites·19 claims
- 1096US5929517ACompliant integrated circuit package and method of fabricating the sameTESSERA INC·Filed 1994·Granted Jul 27, 1999·185 cites·16 claims
- 1195US6012224AMethod of forming compliant microelectronic mounting deviceTESSERA INC·Filed 1997·Granted Jan 11, 2000·157 cites·19 claims
- 1294US6946859B2Probe structures using clamped substrates with compliant interconnectorsCELERITY RES INC·Filed 2003·Granted Sep 20, 2005·59 cites·12 claims
- 1394US6274820B1Electrical connections with deformable contactsTESSERA INC·Filed 2000·Granted Aug 14, 2001·52 cites·41 claims
- 1494US5776796AMethod of encapsulating a semiconductor packageTESSERA INC·Filed 1996·Granted Jul 7, 1998·173 cites·47 claims
- 1594US5706174ACompliant microelectrionic mounting deviceTESSERA INC·Filed 1997·Granted Jan 6, 1998·142 cites·13 claims
- 1693US5663106AMethod of encapsulating die and chip carrierTESSERA INC·Filed 1994·Granted Sep 2, 1997·173 cites·47 claims
- 1792US6603209B1Compliant integrated circuit packageTESSERA INC·Filed 1999·Granted Aug 5, 2003·96 cites·25 claims
- 1892US6266874B1Methods of making microelectronic components having electrophoretically deposited layersTESSERA INC·Filed 1998·Granted Jul 31, 2001·62 cites·16 claims
- 1991US9922951B1Integrated circuit wafer integration with catalytic laminate or adhesiveSIERRA CIRCUITS INC·Filed 2016·Granted Mar 20, 2018·7 cites·20 claims
- 2091US6465878B2Compliant microelectronic assembliesTESSERA INC·Filed 2001·Granted Oct 15, 2002·40 cites·27 claims
- 2190US5777379ASemiconductor assemblies with reinforced peripheral regionsTESSERA INC·Filed 1995·Granted Jul 7, 1998·88 cites·23 claims
- 2289US11638354B2Process for fabrication of a printed circuit board using a semi-additive process and removable backing foilCATLAM LLC·Filed 2020·Granted Apr 25, 2023·2 cites·16 claims
- 2389US10849233B2Process for forming traces on a catalytic laminateSIERRA CIRCUITS INC·Filed 2017·Granted Nov 24, 2020·5 cites·22 claims
- 2488US7834447B2Compliant thermal contactorCENTIPEDE SYSTEMS INC·Filed 2007·Granted Nov 16, 2010·16 cites·16 claims
- 2588US6847107B2Image forming apparatus with improved transfer efficiencyTESSERA INC·Filed 2002·Granted Jan 25, 2005·31 cites·8 claims
- 2688US6204455B1Microelectronic component mounting with deformable shell terminalsTESSERA INC·Filed 1999·Granted Mar 20, 2001·80 cites·20 claims
- 2788US5629239AManufacture of semiconductor connection components with frangible lead sectionsTESSERA INC·Filed 1995·Granted May 13, 1997·83 cites·23 claims
- 2887US7112879B2Microelectronic assemblies having compliant layersTESSERA INC·Filed 2004·Granted Sep 26, 2006·25 cites·10 claims
- 2987US6239386B1Electrical connections with deformable contactsTESSERA INC·Filed 1996·Granted May 29, 2001·48 cites·36 claims
- 3086US8338925B2Microelectronic assemblies having compliant layersFJELSTAD JOSEPH·Filed 2010·Granted Dec 25, 2012·5 cites·20 claims
- 3185US9398703B2Via in a printed circuit boardKARAVAKIS KONSTANTINE·Filed 2014·Granted Jul 19, 2016·6 cites·9 claims
- 3285US9380700B2Method for forming traces of a printed circuit boardKARAVAKIS KONSTANTINE·Filed 2014·Granted Jun 28, 2016·9 cites·19 claims
- 3385US6423907B1Components with releasable leadsTESSERA INC·Filed 2000·Granted Jul 23, 2002·28 cites·13 claims
- 3484US6763579B2Method of making components with releasable leadsTESSERA INC·Filed 2003·Granted Jul 20, 2004·24 cites·6 claims
- 3583US6664484B2Components with releasable leadsTESSERA INC·Filed 2002·Granted Dec 16, 2003·23 cites·12 claims
- 3681US10765012B2Process for printed circuit boards using backing foilSIERRA CIRCUITS INC·Filed 2017·Granted Sep 1, 2020·2 cites·20 claims
- 3781US8004296B2Probe head apparatus for testing semiconductorsCENTIPEDE SYSTEMS INC·Filed 2008·Granted Aug 23, 2011·10 cites·4 claims
- 3881US5821609ASemiconductor connection component with frangible lead sectionsTESSERA INC·Filed 1997·Granted Oct 13, 1998·52 cites·3 claims
- 3980US7114250B2Method of making components with releasable leadsTESSERA INC·Filed 2004·Granted Oct 3, 2006·18 cites·11 claims
- 4079US12513827B2Semi-additive process for catalytic printed circuit boardsCATLAM LLC·Filed 2023·Granted Dec 30, 2025·0 cites·8 claims
- 4179US6998864B2Structures for testing circuits and methods for fabricating the structuresCELERITY RES INC·Filed 2005·Granted Feb 14, 2006·8 cites·14 claims
- 4279US6557253B1Method of making components with releasable leadsTESSERA INC·Filed 2000·Granted May 6, 2003·19 cites·21 claims
- 4378US5597470AMethod for making a flexible lead for a microelectronic deviceTESSERA INC·Filed 1995·Granted Jan 28, 1997·53 cites·27 claims
- 4477US6370032B1Compliant microelectronic mounting deviceTESSERA INC·Filed 1999·Granted Apr 9, 2002·38 cites·20 claims
- 4577US5966587AMethods of making semiconductor assemblies with reinforced peripheral regionsTESSERA INC·Filed 1998·Granted Oct 12, 1999·36 cites·11 claims
- 4676US9942981B2Circuit board apparatus and methodSIERRA CIRCUITS INC·Filed 2017·Granted Apr 10, 2018·1 cites·32 claims
- 4775US9631279B2Methods for forming embedded tracesBAHL KENNETH S·Filed 2014·Granted Apr 25, 2017·2 cites·20 claims
- 4875US7719816B2Compliant thermal contactorCENTIPEDE SYSTEMS INC·Filed 2007·Granted May 18, 2010·6 cites·22 claims
- 4974US6924654B2Structures for testing circuits and methods for fabricating the structuresCELERITY RES INC·Filed 2003·Granted Aug 2, 2005·15 cites·3 claims
- 5072US11477893B2Catalytic laminate with conductive traces formed during laminationCATLAM LLC·Filed 2020·Granted Oct 18, 2022·0 cites·18 claims
Showing the top 50 of 88 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →