Inventor · disambiguated record
Ming-Lun Ho
Also filed as: HO MING-LUN
6 granted patents·2 pending applications·89 citations·filing 2003–2005
82Inventor score
Top patents by PatentIndex Score
8 records- 0180US7019407B2Flip chip package structureADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Mar 28, 2006·31 cites·8 claims
- 0279US7002246B2Chip package structure with dual heat sinksADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Feb 21, 2006·29 cites·9 claims
- 0374US7291924B2Flip chip stacked packageADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Nov 6, 2007·23 cites·21 claims
- 0472US7098071B2Method for flip chip bonding by utilizing an interposer with embedded bumpsADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Aug 29, 2006·5 cites·16 claims
- 0542US2005282311A1Flip-chip substrate and flip-chip bonding process thereofCHEN YU-WEN·Filed 2005·Application pending·0 cites
- 0636US2004119171A1[flip-chip substrate and flip-chip bonding process thereof]Filed 2003·Application pending·0 cites
- 0733US7220619B2Process of cutting electronic packageADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted May 22, 2007·1 cites·14 claims
- 0832US7811492B2Process and apparatus for trimming polymeric partsPACTIV CORP·Filed 2004·Granted Oct 12, 2010·0 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →