Inventor · disambiguated record
Cheng-Yin Lee
Also filed as: LEE CHENG Y · LEE CHENG-YIN
23 granted patents·23 pending applications·1,461 citations·filing 1999–2014
97Inventor score
Top patents by PatentIndex Score
46 records- 0196US7642133B2Method of making a semiconductor package and method of making a semiconductor deviceADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Jan 5, 2010·183 cites·25 claims
- 0296US7589408B2Stackable semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Sep 15, 2009·59 cites·20 claims
- 0396US7061079B2Chip package structure and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Jun 13, 2006·144 cites·19 claims
- 0496US6879594B1System and method for loop avoidance in multi-protocol label switchingNORTEL NETWORKS LTD·Filed 2000·Granted Apr 12, 2005·208 cites·20 claims
- 0596US6728777B1Method for engineering paths for multicast trafficNORTEL NETWORKS LTD·Filed 2000·Granted Apr 27, 2004·195 cites·15 claims
- 0695US6985959B1Constraint route dissemination using distributed route exchangesNORTEL NETWORKS LTD·Filed 2000·Granted Jan 10, 2006·131 cites·44 claims
- 0793US7719094B2Semiconductor package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted May 18, 2010·35 cites·15 claims
- 0893US7417329B2System-in-package structureADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Aug 26, 2008·39 cites·17 claims
- 0992US7473629B2Substrate structure having a solder mask and a process for making the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Jan 6, 2009·30 cites·9 claims
- 1092US6915325B1Method and program code for communicating with a mobile node through tunnelsNORTEL NETWORKS LTD·Filed 2001·Granted Jul 5, 2005·103 cites·18 claims
- 1185US7619966B2Hybrid virtual private LAN extensionsALCATEL LUCENT·Filed 2003·Granted Nov 17, 2009·46 cites·16 claims
- 1285US6798739B1Mechanism for splicing treesNORTEL NETWORKS LTD·Filed 2000·Granted Sep 28, 2004·45 cites·13 claims
- 1385US6556544B1Method and system for provisioning network resources for dynamic multicast groupsNORTEL NETWORKS LTD·Filed 1999·Granted Apr 29, 2003·152 cites·36 claims
- 1482US6815833B2Flip chip packageADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Nov 9, 2004·33 cites·50 claims
- 1575US7187070B2Stacked package moduleADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Mar 6, 2007·22 cites·16 claims
- 1665US8110928B2Stacked-type chip package structure and method of fabricating the sameSHEN CHI-CHIH·Filed 2008·Granted Feb 7, 2012·3 cites·10 claims
- 1764US7436855B2Prohibit or avoid route mechanism for path setupALCATEL LUCENT·Filed 2003·Granted Oct 14, 2008·9 cites·18 claims
- 1863US6724075B2Semiconductor chip package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2001·Granted Apr 20, 2004·8 cites·8 claims
- 1950US7280543B2Extensible OAM support in MPLS/ATM networksALCATEL CANADA INC·Filed 2002·Granted Oct 9, 2007·2 cites·9 claims
- 2050US7122757B2Contact sensor package structureADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Oct 17, 2006·5 cites·13 claims
- 2148US2006140190A1Method and apparatus for configuring a communication pathCIT ALCATEL·Filed 2004·Application pending·0 cites
- 2248US2006133265A1Virtual private networking methods and systemsCIT ALCATEL·Filed 2004·Application pending·0 cites
- 2348US2014312496A1Semiconductor package and semiconductor deviceADVANCED SEMICONDUCTOR ENG·Filed 2014·Application pending·0 cites
- 2447US2006130135A1Virtual private network connection methods and systemsCIT ALCATEL·Filed 2004·Application pending·0 cites
- 2547US2006029033A1Method for forwarding traffic having a predetermined category of transmission service in a connectionless communications networkCIT ALCATEL·Filed 2004·Application pending·0 cites
- 2646US7619992B2Low latency working VPLSALCATEL LUCENT·Filed 2005·Granted Nov 17, 2009·0 cites·7 claims
- 2746US2004218542A1Ethernet path verificationFiled 2004·Application pending·0 cites
- 2845US7442580B2Manufacturing method of a package structureADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Oct 28, 2008·0 cites·8 claims
- 2945US2004165600A1Customer site bridged emulated LAN services via provider provisioned connectionsCIT ALCATEL·Filed 2003·Application pending·0 cites
- 3045US2009065911A1Semiconductor package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2008·Application pending·0 cites
- 3144US2008023816A1Semiconductor packageWENG GWO-LIANG·Filed 2007·Application pending·0 cites
- 3244US2005181543A1Semiconductor package module and manufacturing method thereofFiled 2005·Application pending·0 cites
- 3344US2003223357A1Scalable path protection for meshed networksFiled 2002·Application pending·0 cites
- 3442US2007090508A1Multi-chip package structureLIN CHIAN-CHI·Filed 2006·Application pending·0 cites
- 3542US2006182120A1IP to VPLS interworkingCIT ALCATEL·Filed 2005·Application pending·0 cites
- 3641US2007052082A1Multi-chip package structureLEE CHENG-YIN·Filed 2006·Application pending·0 cites
- 3741US2007090507A1Multi-chip package structureLIN CHIAN-CHI·Filed 2006·Application pending·0 cites
- 3840US2007072341A1Die package and method for making the sameTAI WEI-CHANG·Filed 2006·Application pending·0 cites
- 3940US2007278696A1Stackable semiconductor packageLU YUNG-LI·Filed 2006·Application pending·0 cites
- 4039US2006110849A1Method for stacking BGA packages and structure from the sameLEE CHENG-YIN·Filed 2005·Application pending·0 cites
- 4139US2004113266A1[semiconductor package module and manufacturing mehod thereof]Filed 2003·Application pending·0 cites
- 4237US6785245B1Method and apparatus for controlling fanout of a multicast treeNORTEL NETWORKS LTD·Filed 1999·Granted Aug 31, 2004·9 cites·35 claims
- 4337US2004065964A1Semiconductor package with thermal enhance film and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2003·Application pending·0 cites
- 4437US2007252284A1Stackable semiconductor packageSU PO-CHING·Filed 2006·Application pending·0 cites
- 4537US2004080036A1System in package structureADVANCED SEMICONDUCTOR ENG·Filed 2003·Application pending·0 cites
- 4637US2007075441A1Chip package structureADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
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