Inventor · disambiguated record
Steven Eskildsen
Also filed as: ESKILDSEN STEVEN · ESKILDSEN STEVEN R
25 granted patents·3 pending applications·256 citations·filing 1992–2020
95Inventor score
Files withMICRON TECHNOLOGY INC11INTEL CORP10ABDULLA MOSTAFA NAGUIB2SCHENCK ROBERT NAYLOR2ESKILDSEN STEVEN1
Top patents by PatentIndex Score
28 records- 0185US8198717B1Signal shifting to allow independent control of identical stacked memory modulesSCHENCK ROBERT NAYLOR·Filed 2009·Granted Jun 12, 2012·15 cites·5 claims
- 0284US10153221B1Face down dual sided chip scale memory packageMICRON TECHNOLOGY INC·Filed 2017·Granted Dec 11, 2018·5 cites·28 claims
- 0384US6605875B2Integrated circuit die having bond pads near adjacent sides to allow stacking of dice without regard to dice sizeINTEL CORP·Filed 1999·Granted Aug 12, 2003·74 cites·11 claims
- 0475US7533457B2Packaging method for circuit boardINTEL CORP·Filed 2005·Granted May 19, 2009·7 cites·18 claims
- 0572US8536716B1Supply voltage or ground connections for integrated circuit deviceABDULLA MOSTAFA NAGUIB·Filed 2009·Granted Sep 17, 2013·4 cites·26 claims
- 0671US6547570B2IC package with quick connect featureINTEL CORP·Filed 2001·Granted Apr 15, 2003·18 cites·20 claims
- 0768US8952515B1Signal shifting to allow independent control of identical stacked memory modulesSCHENCK ROBERT NAYLOR·Filed 2012·Granted Feb 10, 2015·2 cites·21 claims
- 0868US8531849B1Supply voltage or ground connections including bond pad interconnects for integrated circuit deviceABDULLA MOSTAFA NAGUIB·Filed 2010·Granted Sep 10, 2013·2 cites·19 claims
- 0966US6704204B1IC package with edge connect contactsINTEL CORP·Filed 1998·Granted Mar 9, 2004·37 cites·18 claims
- 1064US11385949B2Apparatus having a multiplexer for passive input/output expansionMICRON TECHNOLOGY INC·Filed 2020·Granted Jul 12, 2022·0 cites·21 claims
- 1164US6489557B2Implementing micro BGA™ assembly techniques for small dieINTEL CORP·Filed 1999·Granted Dec 3, 2002·34 cites·18 claims
- 1257US10846158B2Apparatus having multiplexers for passive input/output expansion and methods of their operationMICRON TECHNOLOGY INC·Filed 2018·Granted Nov 24, 2020·0 cites·22 claims
- 1356US8749074B2Package including an interposer having at least one topological featureESKILDSEN STEVEN·Filed 2009·Granted Jun 10, 2014·2 cites·16 claims
- 1454US11347415B2Selection component that is configured based on an architecture associated with memory devicesMICRON TECHNOLOGY INC·Filed 2020·Granted May 31, 2022·0 cites·20 claims
- 1554US6356456B2Low pin count card retainerINTEL CORP·Filed 1998·Granted Mar 12, 2002·16 cites·11 claims
- 1653US8860496B2Methods for receiving and transmitting voltage through the use of supply voltage or ground connections including bond pad interconnects for integrated circuit devicesMICRON TECHNOLOGY INC·Filed 2013·Granted Oct 14, 2014·0 cites·15 claims
- 1752US10366934B2Face down dual sided chip scale memory packageMICRON TECHNOLOGY INC·Filed 2018·Granted Jul 30, 2019·0 cites·15 claims
- 1852US8999763B2Package including an interposer having at least one topological featureMICRON TECHNOLOGY INC·Filed 2014·Granted Apr 7, 2015·0 cites·14 claims
- 1952US8829693B2Supply voltage or ground connections for integrated circuit deviceMICRON TECHNOLOGY INC·Filed 2013·Granted Sep 9, 2014·0 cites·21 claims
- 2050US9269403B2Independent control of stacked electronic modulesMICRON TECHNOLOGY INC·Filed 2015·Granted Feb 23, 2016·0 cites·23 claims
- 2149US2016172336A1Independent control of stacked electronic modulesMICRON TECHNOLOGY INC·Filed 2016·Application pending·0 cites
- 2247US5336456AMethod of producing a scribelined layout structure for plastic encapsulated circuitsINTEL CORP·Filed 1992·Granted Aug 9, 1994·20 cites·4 claims
- 2345US7823279B2Method for using an in package power supply to supply power to an integrated circuit and to a componentINTEL CORP·Filed 2002·Granted Nov 2, 2010·1 cites·8 claims
- 2445US2011012670A1Providing in package power supplies for integrated circuitsESKILDSEN STEVEN R·Filed 2010·Application pending·0 cites
- 2543US10877678B2Selection component that is configured based on an architecture associated with memory devicesMICRON TECHNOLOGY INC·Filed 2018·Granted Dec 29, 2020·0 cites·20 claims
- 2641US6250934B1IC package with quick connect featureINTEL CORP·Filed 1998·Granted Jun 26, 2001·8 cites·3 claims
- 2740US6655022B1Implementing micro BGA assembly techniques for small dieINTEL CORP·Filed 1998·Granted Dec 2, 2003·11 cites·11 claims
- 2830US2005067694A1Spacerless die stackingFiled 2003·Application pending·0 cites
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