Inventor · disambiguated record
Hiroyuki Oi
Also filed as: OI HIROYUKI
4 granted patents·1 pending application·38 citations·filing 1999–2003
75Inventor score
Top patents by PatentIndex Score
5 records- 0169US6830985B2Method and apparatus for producing bonded dielectric separation waferSUMITOMO MITSUBISHI SILICON·Filed 2001·Granted Dec 14, 2004·18 cites·7 claims
- 0247US6472289B2Dielectrically separated wafer and method of manufacturing the sameMITSUBISHI MATERIAL SILICON·Filed 2001·Granted Oct 29, 2002·3 cites·2 claims
- 0342US6562692B1Dielectric isolated wafer and its production methodMITSUBISHI MATERIAL SILICON·Filed 1999·Granted May 13, 2003·13 cites·8 claims
- 0433US6815774B1Dielectrically separated wafer and method of the sameMITSUBISHI MATERIAL SILICON·Filed 1999·Granted Nov 9, 2004·4 cites·4 claims
- 0533US2003124853A1Anisotropic etching method and apparatusMITSUBISHI MATERIAL SILICON·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →