Inventor · disambiguated record
Katsunori Ochi
Also filed as: OCHI KATSUNORI
22 granted patents·1,345 citations·filing 1989–1997
97Inventor score
Files withMITSUBISHI ELECTRIC CORP22
Top patents by PatentIndex Score
22 records- 0196US5272374AProduction method for an IC card and its IC cardMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Dec 21, 1993·106 cites·11 claims
- 0295US4974120AIC cardMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Nov 27, 1990·157 cites·3 claims
- 0393US5735040AMethod of making IC cardMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Apr 7, 1998·122 cites·8 claims
- 0490US5416358AIC card including frame with lateral hole for injecting encapsulating resinMITSUBISHI ELECTRIC CORP·Filed 1993·Granted May 16, 1995·116 cites·11 claims
- 0589US5250341AIC cardMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Oct 5, 1993·69 cites·16 claims
- 0687US5173840AMolded ic cardMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Dec 22, 1992·118 cites·9 claims
- 0785US5244840AMethod for manufacturing an encapsulated IC card having a molded frame and a circuit boardMITSUBISHI ELECTRIC CORP·Filed 1992·Granted Sep 14, 1993·100 cites·2 claims
- 0883US5949135AModule mounted with semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Sep 7, 1999·76 cites·4 claims
- 0982US5671123AIC card with a discharge pattern and a ground pattern separated from each otherMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Sep 23, 1997·51 cites·20 claims
- 1080US5677568AThin IC cardMITSUBISHI ELECTRIC CORP·Filed 1992·Granted Oct 14, 1997·62 cites·7 claims
- 1178US5886874AIC cardMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Mar 23, 1999·44 cites·9 claims
- 1278US5498388AProduction method for an IC cardMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Mar 12, 1996·54 cites·4 claims
- 1371US5520863AMethod of making IC cardMITSUBISHI ELECTRIC CORP·Filed 1994·Granted May 28, 1996·29 cites·1 claims
- 1468US5912806AIC card of simple structureMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Jun 15, 1999·37 cites·8 claims
- 1566US5079673AIc card moduleMITSUBISHI ELECTRIC CORP·Filed 1990·Granted Jan 7, 1992·37 cites·6 claims
- 1664US5877548ATerminal configuration in semiconductor IC deviceMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Mar 2, 1999·31 cites·11 claims
- 1764US5719746AIC cardMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Feb 17, 1998·30 cites·13 claims
- 1864US5184209AIc card and manufacturing method thereforMITSUBISHI ELECTRIC CORP·Filed 1990·Granted Feb 2, 1993·34 cites·27 claims
- 1959US5889327ASemiconductor device with a package having a plurality of bump electrodes and module with a plurality of semiconductor devicesMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Mar 30, 1999·25 cites·10 claims
- 2058US5346576AMethod of manufacturing IC cardMITSUBISHI ELECTRIC CORP·Filed 1993·Granted Sep 13, 1994·15 cites·10 claims
- 2148US5410182AHigh density semiconductor device having inclined chip mountingMITSUBISHI ELECTRIC CORP·Filed 1993·Granted Apr 25, 1995·18 cites·14 claims
- 2247US6031278AIC card and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Feb 29, 2000·14 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →