Inventor · disambiguated record
John A. Welsh
Also filed as: WELSH JOHN A
19 granted patents·2 pending applications·498 citations·filing 1982–2005
95Inventor score
Files withIBM21
Top patents by PatentIndex Score
21 records- 0196US6204453B1Two signal one power plane circuit boardIBM·Filed 1998·Granted Mar 20, 2001·173 cites·6 claims
- 0290US6453549B1Method of filling plated through holesIBM·Filed 1999·Granted Sep 24, 2002·73 cites·12 claims
- 0384US7353590B2Method of forming printed circuit cardIBM·Filed 2005·Granted Apr 8, 2008·10 cites·15 claims
- 0479US6201194B1Multi-voltage plane, multi-signal plane circuit card with photoimageable dielectricIBM·Filed 1998·Granted Mar 13, 2001·43 cites·13 claims
- 0576US6750405B1Two signal one power plane circuit boardIBM·Filed 2000·Granted Jun 15, 2004·19 cites·2 claims
- 0676US6009620AMethod of making a printed circuit board having filled holesIBM·Filed 1998·Granted Jan 4, 2000·41 cites·34 claims
- 0768US4599134APlasma etching with tracerIBM·Filed 1985·Granted Jul 8, 1986·23 cites·12 claims
- 0866US6524654B1Method of controlling the spread of an adhesive on a circuitized organic substrateIBM·Filed 2000·Granted Feb 25, 2003·10 cites·12 claims
- 0964US6099959AMethod of controlling the spread of an adhesive on a circuitized organic substrateIBM·Filed 1998·Granted Aug 8, 2000·23 cites·2 claims
- 1062US4971715APhenolic-free stripping composition and use thereofIBM·Filed 1988·Granted Nov 20, 1990·18 cites·18 claims
- 1158US6986198B2Method of forming printed circuit cardIBM·Filed 2003·Granted Jan 17, 2006·6 cites·6 claims
- 1257US4810326AInterlaminate adhesion between polymeric materials and electrolytic copper surfacesIBM·Filed 1987·Granted Mar 7, 1989·18 cites·8 claims
- 1357US4618477AUniform plasma for drill smear removal reactorIBM·Filed 1985·Granted Oct 21, 1986·16 cites·31 claims
- 1456US6432182B1Treatment solution for reducing adhesive resin bleedIBM·Filed 2000·Granted Aug 13, 2002·5 cites·8 claims
- 1544US4431685ADecreasing plated metal defectsIBM·Filed 1982·Granted Feb 14, 1984·7 cites·16 claims
- 1638US5114518AMethod of making multilayer circuit boards having conformal Insulating layersIBM·Filed 1990·Granted May 19, 1992·8 cites·4 claims
- 1735US2001041308A1Method of reducing defects in I/C card and resulting cardIBM·Filed 2001·Application pending·0 cites
- 1833US2001016462A1Wire bonding method and apparatusIBM·Filed 2001·Application pending·0 cites
- 1932US6274291B1Method of reducing defects in I/C card and resulting cardIBM·Filed 1998·Granted Aug 14, 2001·4 cites·10 claims
- 2028US4918574AMultilayer circuit board with reduced susceptability to shorts caused by trapped impuritiesIBM·Filed 1988·Granted Apr 17, 1990·0 cites·7 claims
- 2126US6488198B1Wire bonding method and apparatusIBM·Filed 1999·Granted Dec 3, 2002·1 cites·3 claims
Join the waitlist — get patent alerts
Get an alert when John A. Welsh files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →