Inventor · disambiguated record
Mitsuhiro Saitou
Also filed as: SAITOU MITSUHIRO
25 granted patents·4 pending applications·504 citations·filing 1993–2020
97Inventor score
Top patents by PatentIndex Score
29 records- 0195US6242787B1Semiconductor device and manufacturing method thereofDENSO CORP·Filed 1996·Granted Jun 5, 2001·155 cites·27 claims
- 0288US7843700B2Semiconductor deviceDENSO CORP·Filed 2005·Granted Nov 30, 2010·17 cites·16 claims
- 0386US9320178B2Electronic control unit and method of manufacturing the sameOOTA SHINSUKE·Filed 2012·Granted Apr 19, 2016·9 cites·6 claims
- 0482US7531852B2Electronic unit with a substrate where an electronic circuit is fabricatedDENSO CORP·Filed 2005·Granted May 12, 2009·11 cites·14 claims
- 0576US11708232B2Stacking apparatus and stacking methodTOSHIBA KK·Filed 2020·Granted Jul 25, 2023·1 cites·11 claims
- 0671US6081040ASemiconductor device having alignment markDENSO CORP·Filed 1998·Granted Jun 27, 2000·39 cites·30 claims
- 0769US7212036B2Driving apparatus of H bridge circuit and protection method of the sameDENSO CORP·Filed 2005·Granted May 1, 2007·6 cites·4 claims
- 0868US8179688B2Semiconductor deviceFUKUDA YUTAKA·Filed 2010·Granted May 15, 2012·2 cites·16 claims
- 0964US6953987B2Composite integrated circuit device having restricted heat conductionDENSO CORP·Filed 2003·Granted Oct 11, 2005·13 cites·15 claims
- 1063US5562973ACeramic multi-layer wiring boardNIPPON DENSO CO·Filed 1995·Granted Oct 8, 1996·27 cites·7 claims
- 1162US6104078ADesign for a semiconductor device having elements isolated by insulating regionsDENSO CORP·Filed 1997·Granted Aug 15, 2000·29 cites·19 claims
- 1262US5739546ASemiconductor waferNIPPON DENSO CO·Filed 1996·Granted Apr 14, 1998·32 cites·1 claims
- 1358US5593722AMethod of producing thick multi-layer substratesNIPPON DENSO CO·Filed 1996·Granted Jan 14, 1997·19 cites·22 claims
- 1458US5439732ACeramic multi-layer wiring boardNIPPON DENSO CO·Filed 1994·Granted Aug 8, 1995·26 cites·12 claims
- 1556US5982604APower supply apparatus for electronic control unit in automotive vehicleDENSO CORP·Filed 1998·Granted Nov 9, 1999·32 cites·11 claims
- 1655US5977651ADrive circuit for vehicle occupant safety apparatusDENSO CORP·Filed 1997·Granted Nov 2, 1999·21 cites·13 claims
- 1748US6731001B2Semiconductor device including bonded wire based to electronic part and method for manufacturing the sameDENSO CORP·Filed 2001·Granted May 4, 2004·3 cites·31 claims
- 1848US5629702AAnalog to digital converterNIPPON DENSO CO·Filed 1994·Granted May 13, 1997·12 cites·10 claims
- 1947US2012120610A1Semiconductor deviceSAITOU MITSUHIRO·Filed 2012·Application pending·0 cites
- 2044US5719522AReference voltage generating circuit having reduced current consumption with varying loadsNIPPON DENSO CO·Filed 1997·Granted Feb 17, 1998·9 cites·24 claims
- 2142US2007075419A1Semiconductor device having metallic lead and electronic device having lead frameDENSO CORP·Filed 2006·Application pending·0 cites
- 2242US2010254093A1Electronic control unit and method of manufacturing the sameDENSO CORP·Filed 2010·Application pending·0 cites
- 2340US6034556ASample-and-hold circuit including operational amplifier as an input circuitDENSO CORP·Filed 1998·Granted Mar 7, 2000·7 cites·19 claims
- 2439US6157246ALoad driving circuit with boosting timing controlDENSO CORP·Filed 1998·Granted Dec 5, 2000·9 cites·18 claims
- 2538US5483217AElectronic circuit deviceNIPPON DENSO CO·Filed 1993·Granted Jan 9, 1996·8 cites·9 claims
- 2637US5554947AWave-shaping circuit with feedback circuit for adjusting central voltage level of input alternating signalNIPPON DENSO CO·Filed 1994·Granted Sep 10, 1996·5 cites·7 claims
- 2734US5917246ASemiconductor package with pocket for sealing materialNIPPON DENSO CO·Filed 1996·Granted Jun 29, 1999·6 cites·30 claims
- 2832US5554881AConstitution of an electrode arrangement in a semiconductor elementNIPPON DENSO CO·Filed 1994·Granted Sep 10, 1996·6 cites·17 claims
- 2932US2012326292A1Electronic control unitOHASHI YUTAKA·Filed 2012·Application pending·0 cites
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