Inventor · disambiguated record
Shu Qin
Also filed as: QIN SHU
50 granted patents·2 pending applications·327 citations·filing 1994–2024
98Inventor score
Top patents by PatentIndex Score
52 records- 0196US9281471B2Phase change memory stack with treated sidewallsMICRON TECHNOLOGY INC·Filed 2014·Granted Mar 8, 2016·14 cites·13 claims
- 0295US10153190B2Devices, systems and methods for electrostatic force enhanced semiconductor bondingMICRON TECHNOLOGY INC·Filed 2014·Granted Dec 11, 2018·15 cites·26 claims
- 0395US9673256B2Phase change memory stack with treated sidewallsMICRON TECHNOLOGY INC·Filed 2016·Granted Jun 6, 2017·9 cites·20 claims
- 0495US8981334B1Memory cells having regions containing one or both of carbon and boronMICRON TECHNOLOGY INC·Filed 2013·Granted Mar 17, 2015·10 cites·12 claims
- 0593US9093367B2Methods of forming doped regions in semiconductor substratesMICRON TECHNOLOGY INC·Filed 2013·Granted Jul 28, 2015·11 cites·7 claims
- 0693US7737010B2Method of photoresist strip for plasma doping process of semiconductor manufacturingMICRON TECHNOLOGY INC·Filed 2006·Granted Jun 15, 2010·22 cites·15 claims
- 0792US10177198B2Phase change memory stack with treated sidewallsMICRON TECHNOLOGY INC·Filed 2017·Granted Jan 8, 2019·6 cites·17 claims
- 0892US7592212B2Methods for determining a dose of an impurity implanted in a semiconductor substrateMICRON TECHNOLOGY INC·Filed 2007·Granted Sep 22, 2009·19 cites·22 claims
- 0991US9306159B2Phase change memory stack with treated sidewallsMICRON TECHNOLOGY INC·Filed 2014·Granted Apr 5, 2016·10 cites·14 claims
- 1087US10079340B2Phase change memory stack with treated sidewallsMICRON TECHNOLOGY INC·Filed 2016·Granted Sep 18, 2018·6 cites·23 claims
- 1186US2024363384A1Devices, systems and methods for electrostatic force enhanced semiconductor bondingMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1284US10224479B2Phase change memory stack with treated sidewallsMICRON TECHNOLOGY INC·Filed 2018·Granted Mar 5, 2019·4 cites·16 claims
- 1384US9136282B2Memories and methods of forming thin-film transistors using hydrogen plasma dopingMICRON TECHNOLOGY INC·Filed 2015·Granted Sep 15, 2015·3 cites·20 claims
- 1484US6946403B2Method of making a MEMS electrostatic chuckAXCELIS TECH INC·Filed 2003·Granted Sep 20, 2005·32 cites·49 claims
- 1583US7476556B2Systems and methods for plasma processing of microfeature workpiecesMICRON TECHNOLOGY INC·Filed 2005·Granted Jan 13, 2009·5 cites·25 claims
- 1682US12040211B2Devices, systems and methods for electrostatic force enhanced semiconductor bondingMICRON TECHNOLOGY INC·Filed 2023·Granted Jul 16, 2024·0 cites·19 claims
- 1782US10720574B2Phase change memory stack with treated sidewallsMICRON TECHNOLOGY INC·Filed 2019·Granted Jul 21, 2020·1 cites·20 claims
- 1882US10546895B2Phase change memory stack with treated sidewallsMICRON TECHNOLOGY INC·Filed 2019·Granted Jan 28, 2020·2 cites·17 claims
- 1982US9786475B2Systems and methods for plasma processing of microfeature workpiecesMICRON TECHNOLOGY INC·Filed 2014·Granted Oct 10, 2017·1 cites·9 claims
- 2082US8642135B2Systems and methods for plasma doping microfeature workpiecesQIN SHU·Filed 2005·Granted Feb 4, 2014·7 cites·23 claims
- 2181US11508573B2Plasma doping of gap fill materialsMICRON TECHNOLOGY INC·Filed 2020·Granted Nov 22, 2022·1 cites·30 claims
- 2277US7072166B2Clamping and de-clamping semiconductor wafers on a J-R electrostatic chuck having a micromachined surface by using force delay in applying a single-phase square wave AC clamping voltageAXCELIS TECH INC·Filed 2003·Granted Jul 4, 2006·19 cites·27 claims
- 2376US11574834B2Devices, systems and methods for electrostatic force enhanced semiconductor bondingMICRON TECHNOLOGY INC·Filed 2021·Granted Feb 7, 2023·0 cites·20 claims
- 2476US11114328B2Devices, systems and methods for electrostatic force enhanced semiconductor bondingMICRON TECHNOLOGY INC·Filed 2018·Granted Sep 7, 2021·1 cites·8 claims
- 2574US12040182B2Plasma doping of gap fill materialsMICRON TECHNOLOGY INC·Filed 2022·Granted Jul 16, 2024·0 cites·20 claims
- 2674US8940592B2Memories and methods of forming thin-film transistors using hydrogen plasma dopingMICRON TECHNOLOGY INC·Filed 2013·Granted Jan 27, 2015·2 cites·23 claims
- 2774US8324088B2Sputtering-less ultra-low energy ion implantationQIN SHU·Filed 2011·Granted Dec 4, 2012·2 cites·23 claims
- 2874US7935618B2Sputtering-less ultra-low energy ion implantationMICRON TECHNOLOGY INC·Filed 2007·Granted May 3, 2011·3 cites·19 claims
- 2972US9385317B2Memory cells and methods of forming memory cellsMICRON TECHNOLOGY INC·Filed 2015·Granted Jul 5, 2016·1 cites·10 claims
- 3070US5508227APlasma ion implantation hydrogenation process utilizing voltage pulse applied to substrateUNIV NORTHEASTERN·Filed 1994·Granted Apr 16, 1996·45 cites·11 claims
- 3169US11658033B2Methods of forming assemblies having heavily doped regionsMICRON TECHNOLOGY INC·Filed 2020·Granted May 23, 2023·0 cites·10 claims
- 3268US8497194B2Methods of forming doped regions in semiconductor substratesMICRON TECHNOLOGY INC·Filed 2012·Granted Jul 30, 2013·1 cites·8 claims
- 3368US7072165B2MEMS based multi-polar electrostatic chuckAXCELIS TECH INC·Filed 2003·Granted Jul 4, 2006·11 cites·47 claims
- 3468US6947274B2Clamping and de-clamping semiconductor wafers on an electrostatic chuck using wafer inertial confinement by applying a single-phase square wave AC clamping voltageAXCELIS TECH INC·Filed 2003·Granted Sep 20, 2005·11 cites·20 claims
- 3567US8975603B2Systems and methods for plasma doping microfeature workpiecesMICRON TECHNOLOGY INC·Filed 2014·Granted Mar 10, 2015·1 cites·18 claims
- 3667US6905984B2MEMS based contact conductivity electrostatic chuckAXCELIS TECH INC·Filed 2003·Granted Jun 14, 2005·11 cites·26 claims
- 3766US7682930B2Method of forming elevated photosensor and resulting structureAPTINA IMAGING CORP·Filed 2006·Granted Mar 23, 2010·3 cites·13 claims
- 3862US8671879B2Systems and methods for plasma processing of microfeature workpiecesQIN SHU·Filed 2009·Granted Mar 18, 2014·0 cites·23 claims
- 3962US5883016AApparatus and method for hydrogenating polysilicon thin film transistors by plasma immersion ion implantationUNIV NORTHEASTERN·Filed 1996·Granted Mar 16, 1999·28 cites·32 claims
- 4061US10879071B2Methods of forming assemblies including semiconductor material with heavily-doped and lightly-doped regionsMICRON TECHNOLOGY INC·Filed 2019·Granted Dec 29, 2020·0 cites·15 claims
- 4161US7235493B2Low-k dielectric process for multilevel interconnection using mircocavity engineering during electric circuit manufactureMICRON TECHNOLOGY INC·Filed 2004·Granted Jun 26, 2007·9 cites·22 claims
- 4260US8524572B2Methods of processing units comprising crystalline materials, and methods of forming semiconductor-on-insulator constructionsQIN SHU·Filed 2011·Granted Sep 3, 2013·1 cites·5 claims
- 4357US8426763B2Rapid thermal processing systems and methods for treating microelectronic substratesQIN SHU·Filed 2009·Granted Apr 23, 2013·0 cites·18 claims
- 4456US9496495B2Memory cells and methods of forming memory cellsMICRON TECHNOLOGY INC·Filed 2016·Granted Nov 15, 2016·0 cites·9 claims
- 4555US10256098B2Integrated assemblies containing germaniumMICRON TECHNOLOGY INC·Filed 2015·Granted Apr 9, 2019·0 cites·14 claims
- 4655US8709927B2Methods of implanting dopant ionsQIN SHU·Filed 2012·Granted Apr 29, 2014·0 cites·20 claims
- 4754US9257646B2Methods of forming memory cells having regions containing one or both of carbon and boronMICRON TECHNOLOGY INC·Filed 2015·Granted Feb 9, 2016·0 cites·11 claims
- 4854US8822877B2Rapid thermal processing systems and methods for treating microelectronic substratesMICRON TECHNOLOGY INC·Filed 2013·Granted Sep 2, 2014·0 cites·15 claims
- 4944US8329567B2Methods of forming doped regions in semiconductor substratesLIU JENNIFER LEQUN·Filed 2010·Granted Dec 11, 2012·0 cites·6 claims
- 5044US8293659B2Method for fabricating dielectric layer with improved insulating propertiesQIN SHU·Filed 2011·Granted Oct 23, 2012·0 cites·17 claims
Showing the top 50 of 52 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →