Inventor · disambiguated record
Andrew R. Southworth
Also filed as: SOUTHWORTH ANDREW · SOUTHWORTH ANDREW R
21 granted patents·6 pending applications·21 citations·filing 2018–2023
91Inventor score
Files withRAYTHEON CO27
Top patents by PatentIndex Score
27 records- 0189US10631405B1Additive manufacturing technology (AMT) inverted pad interfaceRAYTHEON CO·Filed 2019·Granted Apr 21, 2020·8 cites·19 claims
- 0288US10839992B1Thick film resistors having customizable resistances and methods of manufactureRAYTHEON CO·Filed 2019·Granted Nov 17, 2020·5 cites·20 claims
- 0386US11122692B1Preparation of solder bump for compatibility with printed electronics and enhanced via reliabilityRAYTHEON CO·Filed 2020·Granted Sep 14, 2021·2 cites·12 claims
- 0478US10813210B2Radio frequency circuit comprising at least one substrate with a conductively filled trench therein for electrically isolating a first circuit portion from a second circuit portionRAYTHEON CO·Filed 2018·Granted Oct 20, 2020·2 cites·17 claims
- 0574US11482795B2Segmented patch phased array radiatorRAYTHEON CO·Filed 2020·Granted Oct 25, 2022·1 cites·17 claims
- 0674US11089687B2Additive manufacturing technology (AMT) low profile signal dividerRAYTHEON CO·Filed 2019·Granted Aug 10, 2021·2 cites·9 claims
- 0772US10849219B2SNAP-RF interconnectionsRAYTHEON CO·Filed 2019·Granted Nov 24, 2020·1 cites·4 claims
- 0872US2023121347A1Additive manufacturing technology microwave vertical launchRAYTHEON CO·Filed 2022·Application pending·0 cites
- 0972US2023209728A1Method for forming channels in printed circuit boards by stacking slotted layersRAYTHEON CO·Filed 2023·Application pending·0 cites
- 1070US12021306B2Low profile phased arrayRAYTHEON CO·Filed 2021·Granted Jun 25, 2024·0 cites·8 claims
- 1170US11632856B2Wall for isolation enhancementRAYTHEON CO·Filed 2021·Granted Apr 18, 2023·0 cites·7 claims
- 1268US11375609B2Method of manufacturing radio frequency interconnectionsRAYTHEON CO·Filed 2020·Granted Jun 28, 2022·0 cites·8 claims
- 1367US11470725B2Method for fabricating Z-axis vertical launchRAYTHEON CO·Filed 2021·Granted Oct 11, 2022·0 cites·8 claims
- 1467US11107610B2Thick film resistors having customizable resistances and methods of manufactureRAYTHEON CO·Filed 2020·Granted Aug 31, 2021·0 cites·20 claims
- 1567US2021400820A1Preparation of solder bump for compatibility with printed electronics and enhanced via reliabilityRAYTHEON CO·Filed 2021·Application pending·0 cites
- 1662US11089673B2Wall for isolation enhancementRAYTHEON CO·Filed 2019·Granted Aug 10, 2021·0 cites·6 claims
- 1760US11606865B2Method for forming channels in printed circuit boards by stacking slotted layersRAYTHEON CO·Filed 2019·Granted Mar 14, 2023·0 cites·8 claims
- 1859US11145952B2Advanced communications arrayRAYTHEON CO·Filed 2019·Granted Oct 12, 2021·0 cites·13 claims
- 1959US11109489B2Apparatus for fabricating Z-axis vertical launch within a printed circuit boardRAYTHEON CO·Filed 2019·Granted Aug 31, 2021·0 cites·13 claims
- 2056US11158955B2Low profile phased arrayRAYTHEON CO·Filed 2018·Granted Oct 26, 2021·0 cites·10 claims
- 2156US2019150296A1Additive manufacturing technology microwave vertical launchRAYTHEON CO·Filed 2018·Application pending·0 cites
- 2254US11171101B2Process for removing bond film from cavities in printed circuit boardsRAYTHEON CO·Filed 2020·Granted Nov 9, 2021·0 cites·20 claims
- 2352US11145977B2Interlocking modular beamformerRAYTHEON CO·Filed 2019·Granted Oct 12, 2021·0 cites·16 claims
- 2451US11444365B2Radio-frequency (RF)-interface and modular plateRAYTHEON CO·Filed 2020·Granted Sep 13, 2022·0 cites·16 claims
- 2544US2021066830A1Stripline edge snap radio-frequency connectionRAYTHEON CO·Filed 2019·Application pending·0 cites
- 2643US2020367357A1Flat-wire copper vertical launch microwave interconnection methodRAYTHEON CO·Filed 2020·Application pending·0 cites
- 2742US11653484B2Printed circuit board automated layup systemRAYTHEON CO·Filed 2019·Granted May 16, 2023·0 cites·23 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →