Inventor · disambiguated record
Paul Deaton
Also filed as: DEATON PAUL · DEATON PAUL L
15 granted patents·4 pending applications·1,329 citations·filing 1991–2019
95Inventor score
Top patents by PatentIndex Score
19 records- 0198US9829805B2Vapor deposition deposited photoresist, and manufacturing and lithography systems thereforAPPLIED MATERIALS INC·Filed 2016·Granted Nov 28, 2017·14 cites·12 claims
- 0298US9632411B2Vapor deposition deposited photoresist, and manufacturing and lithography systems thereforAPPLIED MATERIALS INC·Filed 2013·Granted Apr 25, 2017·26 cites·8 claims
- 0398US8536068B2Atomic layer deposition of photoresist materials and hard mask precursorsWEIDMAN TIMOTHY W·Filed 2011·Granted Sep 17, 2013·373 cites·34 claims
- 0498US8465903B2Radiation patternable CVD filmWEIDMAN TIMOTHY W·Filed 2011·Granted Jun 18, 2013·450 cites·20 claims
- 0595US7794544B2Control of gas flow and delivery to suppress the formation of particles in an MOCVD/ALD systemAPPLIED MATERIALS INC·Filed 2007·Granted Sep 14, 2010·49 cites·14 claims
- 0694US7775508B2Ampoule for liquid draw and vapor draw with a continuous level sensorAPPLIED MATERIALS INC·Filed 2006·Granted Aug 17, 2010·28 cites·23 claims
- 0790US5960555AMethod and apparatus for purging the back side of a substrate during chemical vapor processingAPPLIED MATERIALS INC·Filed 1997·Granted Oct 5, 1999·92 cites·24 claims
- 0884US5178681ASuspension system for semiconductor reactorsAPPLIED MATERIALS INC·Filed 1991·Granted Jan 12, 1993·97 cites·15 claims
- 0980US6048403AMulti-ledge substrate support for a thermal processing chamberAPPLIED MATERIALS INC·Filed 1998·Granted Apr 11, 2000·52 cites·18 claims
- 1077US6123766AMethod and apparatus for achieving temperature uniformity of a substrateAPPLIED MATERIALS INC·Filed 1997·Granted Sep 26, 2000·37 cites·15 claims
- 1173US6133152ACo-rotating edge ring extension for use in a semiconductor processing chamberAPPLIED MATERIALS INC·Filed 1997·Granted Oct 17, 2000·43 cites·22 claims
- 1271US11685265B2Vehicle trailer with parasitic chargingDEATON PAUL·Filed 2019·Granted Jun 27, 2023·4 cites·8 claims
- 1368US5322567AParticulate reduction baffle with wafer catcher for chemical-vapor-deposition apparatusAPPLIED MATERIALS INC·Filed 1991·Granted Jun 21, 1994·38 cites·19 claims
- 1466US9236467B2Atomic layer deposition of hafnium or zirconium alloy filmsAPPLIED MATERIALS INC·Filed 2014·Granted Jan 12, 2016·1 cites·12 claims
- 1560US6035100AReflector cover for a semiconductor processing chamberAPPLIED MATERIALS INC·Filed 1997·Granted Mar 7, 2000·25 cites·22 claims
- 1656US2005252449A1Control of gas flow and delivery to suppress the formation of particles in an MOCVD/ALD systemNGUYEN SON T·Filed 2005·Application pending·0 cites
- 1740US2013115778A1Dry Etch ProcessesXUE JUN·Filed 2012·Application pending·0 cites
- 1839US2013113085A1Atomic Layer Deposition Of Films Using Precursors Containing Hafnium Or ZirconiumMICHAELSON TIMOTHY·Filed 2011·Application pending·0 cites
- 1936US2002160606A1Method for material removal from an in-process microelectronic substrateFiled 2002·Application pending·0 cites
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