Inventor · disambiguated record
Kyung Jin Heo
Also filed as: HEO KYUNG JIN
2 granted patents·2 pending applications·10 citations·filing 2008–2013
55Inventor score
Top patents by PatentIndex Score
4 records- 0179US9005456B2Method for manufacturing printed circuit boardSAMSUNG ELECTRO MECH·Filed 2013·Granted Apr 14, 2015·6 cites·16 claims
- 0278US8759986B2Substrate structure and method of manufacturing the sameLEE CHUL MIN·Filed 2011·Granted Jun 24, 2014·4 cites·6 claims
- 0349US2010155108A1Electroless nickel plating solution composition, flexible printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 0440US2008257742A1Method of manufacturing printed circuit board for semiconductor packageSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →