Inventor · disambiguated record
Jean-Luc Landreville
Also filed as: LANDREVILLE JEAN-LUC
7 granted patents·3 pending applications·87 citations·filing 2000–2010
85Inventor score
Top patents by PatentIndex Score
10 records- 0183US6302702B1Connecting devices and method for interconnecting circuit componentsIBM·Filed 2000·Granted Oct 16, 2001·30 cites·9 claims
- 0280US7826228B2Piston reset apparatus for a multichip module and method for resetting pistons in the sameIBM·Filed 2008·Granted Nov 2, 2010·11 cites·4 claims
- 0376US6957794B2Anti-vibration and anti-tilt structureIBM·Filed 2002·Granted Oct 25, 2005·30 cites·9 claims
- 0472US7405940B1Piston reset apparatus for a multichip module and method for resetting pistons in the sameIBM·Filed 2007·Granted Jul 29, 2008·6 cites·1 claims
- 0557US8162199B2Mold shave apparatus and injection molded soldering processBOURCHARD ERIC E·Filed 2009·Granted Apr 24, 2012·1 cites·4 claims
- 0657US7066740B2Area array package with low inductance connecting deviceIBM·Filed 2003·Granted Jun 27, 2006·7 cites·25 claims
- 0754US2008156849A1Mold shave apparatus and injection molded soldering processIBM·Filed 2007·Application pending·0 cites
- 0846US6652290B2Connecting devices and method for interconnecting circuit componentsIBM·Filed 2001·Granted Nov 25, 2003·2 cites·2 claims
- 0934US2005263571A1Injection molded continuously solidified solder method and apparatusBELANGER LUC·Filed 2004·Application pending·0 cites
- 1031US2011042784A1Mechanical Barrier Element for Improved Thermal Reliability of Electronic ComponentsIBM·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →