Inventor · disambiguated record
Shigeki Katogi
Also filed as: KATOGI SHIGEKI
24 granted patents·14 pending applications·78 citations·filing 1995–2013
94Inventor score
Files withHITACHI CHEMICAL CO LTD9MITSUKURA KAZUYUKI9KAWAMORI TAKASHI7KATOGI SHIGEKI4MASUKO TAKASHI3
Top patents by PatentIndex Score
38 records- 0191US7851131B2Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic partHITACHI CHEMICAL CO LTD·Filed 2008·Granted Dec 14, 2010·13 cites·21 claims
- 0288US8373283B2Adhesive composition, film-like adhesive, adhesive sheet and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2009·Granted Feb 12, 2013·13 cites·11 claims
- 0384US8258017B2Photosensitive adhesiveMASUKO TAKASHI·Filed 2008·Granted Sep 4, 2012·12 cites·9 claims
- 0476US8323873B2Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic partKAWAMORI TAKASHI·Filed 2010·Granted Dec 4, 2012·2 cites·21 claims
- 0576US8293453B2Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic partKAWAMORI TAKASHI·Filed 2010·Granted Oct 23, 2012·2 cites·9 claims
- 0675US10175577B2Photosensitive resin composition, method for manufacturing patterned cured film, and electronic componentHITACHI CHEMICAL CO LTD·Filed 2013·Granted Jan 8, 2019·4 cites·10 claims
- 0775US8445177B2Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic partKAWAMORI TAKASHI·Filed 2010·Granted May 21, 2013·2 cites·14 claims
- 0869US9274422B2Photosensitive resin composition, method for forming pattern-cured film using photosensitive resin composition, and electronic componentMINEGISHI TOMONORI·Filed 2012·Granted Mar 1, 2016·2 cites·18 claims
- 0968US9309446B2Photosensitive adhesive composition, film-like adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor deviceMITSUKURA KAZUYUKI·Filed 2012·Granted Apr 12, 2016·3 cites·24 claims
- 1065US7795325B2Adhesive composition, adhesive composition for circuit connection, connected body semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2009·Granted Sep 14, 2010·0 cites·9 claims
- 1162US8293847B2Film-like adhesive, adhesive sheet, and semiconductor device using sameMASUKO TAKASHI·Filed 2006·Granted Oct 23, 2012·2 cites·12 claims
- 1261US8138268B2Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor deviceKATOGI SHIGEKI·Filed 2005·Granted Mar 20, 2012·2 cites·13 claims
- 1359US8518303B2Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor deviceKATOGI SHIGEKI·Filed 2006·Granted Aug 27, 2013·2 cites·15 claims
- 1457US8673539B2Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic partKAWAMORI TAKASHI·Filed 2012·Granted Mar 18, 2014·0 cites·4 claims
- 1557US7576141B2Adhesive composition, adhesive composition for circuit connection, connected body semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2005·Granted Aug 18, 2009·2 cites·13 claims
- 1653US8278024B2Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic partKAWAMORI TAKASHI·Filed 2010·Granted Oct 2, 2012·0 cites·20 claims
- 1753US2013140083A1Adhesive composition, film-like adhesive, adhesive sheet, circuit connection structure, method for connecting circuit members, use of adhesive composition, use of film-like adhesive and use of adhesive sheetHITACHI CHEMICAL CO LTD·Filed 2012·Application pending·0 cites
- 1851US8309658B2Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor deviceKATOGI SHIGEKI·Filed 2011·Granted Nov 13, 2012·0 cites·10 claims
- 1951US5811218APhotoinitiator compositions including amino acids, coumarin and titanocene and photosensitive materials using the sameHITACHI CHEMICAL CO LTD·Filed 1995·Granted Sep 22, 1998·17 cites·4 claims
- 2050US8507323B2Method of producing semiconductor device with patterned photosensitive adhesiveMASUKO TAKASHI·Filed 2012·Granted Aug 13, 2013·0 cites·9 claims
- 2149US2014144481A1Solar cell moduleHAYASHI HIROKI·Filed 2011·Application pending·0 cites
- 2248US8962986B2Conductive adhesive, solar cell, method for manufacturing solar cell, and solar cell moduleHAYASHI HIROKI·Filed 2010·Granted Feb 24, 2015·0 cites·12 claims
- 2348US8696942B2Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor deviceKATOGI SHIGEKI·Filed 2012·Granted Apr 15, 2014·0 cites·13 claims
- 2448US8349700B2Photosensitive adhesive, semiconductor device and method for manufacturing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2008·Granted Jan 8, 2013·0 cites·10 claims
- 2546US9395626B2Photosensitive resin composition, method for manufacturing patterned cured film, and electronic componentHITACHI CHEMICAL CO LTD·Filed 2012·Granted Jul 19, 2016·0 cites·13 claims
- 2646US2011159238A1Photosensitive adhesive composition, photosensitive film adhesive, adhesive pattern, semiconductor wafer with adhesive, semiconductor device and electronic componentKAWAMORI TAKASHI·Filed 2009·Application pending·0 cites
- 2746US2011223397A1Semiconductor device and method for manufacturing the sameKAWAMORI TAKASHI·Filed 2009·Application pending·0 cites
- 2842US2012048606A1Adhesive composition, film-like adhesive, and connection structure for circuit memberIZAWA HIROYUKI·Filed 2008·Application pending·0 cites
- 2941US2011151195A1Photosensitive adhesive composition, and film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer and semiconductor device using the photosensitive adhesive compositionMITSUKURA KAZUYUKI·Filed 2009·Application pending·0 cites
- 3040US2011121435A1Photosensitive adhesive composition, filmy adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device, and process for producing semiconductor deviceMITSUKURA KAZUYUKI·Filed 2009·Application pending·0 cites
- 3139US2010143673A1Photosensitive adhesive composition, film-like adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device and semiconductor device manufacturing methodMITSUKURA KAZUYUKI·Filed 2008·Application pending·0 cites
- 3239US2010295190A1Photosensitive adhesive composition, film-like adhesive, adhesive sheet, method for forming adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device and method for manufacturing semiconductor deviceMITSUKURA KAZUYUKI·Filed 2008·Application pending·0 cites
- 3337US2013075142A1Adhesive composition, use thereof, connection structure for circuit members, and method for producing sameIZAWA HIROYUKI·Filed 2011·Application pending·0 cites
- 3432US2012256326A1Adhesive composition, semiconductor device making use thereof, and production method thereofMITSUKURA KAZUYUKI·Filed 2010·Application pending·0 cites
- 3531US2012263946A1Semiconductor device, method for manufacturing semiconductor device, and semiconductor wafer provided with adhesive layerMITSUKURA KAZUYUKI·Filed 2010·Application pending·0 cites
- 3631US2012248634A1Method for manufacturing film-like adhesive, adhesive sheet, semiconductor device, and method for manufacturing semiconductor deviceMITSUKURA KAZUYUKI·Filed 2010·Application pending·0 cites
- 3731US2012133061A1Photosensitive adhesive, and film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, and semiconductor device, which are made using sameMITSUKURA KAZUYUKI·Filed 2010·Application pending·0 cites
- 3828US9837572B2Solar cell module and method of manufacturing thereofMOMOZAKI AYA·Filed 2012·Granted Dec 5, 2017·0 cites·7 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →