Inventor · disambiguated record
Masatsugu Akiba
Also filed as: AKIBA MASATSUGU
15 granted patents·54 citations·filing 1993–2008
91Inventor score
Top patents by PatentIndex Score
15 records- 0172US7977418B2Bisphenol monoester-based stabilizer composition, thermoplastic polymer composition and method of manufacturing the same, thermoplastic polymer molded product, and method of stabilizing thermoplastic polymerSUMITOMO CHEMICAL CO·Filed 2008·Granted Jul 12, 2011·2 cites·6 claims
- 0265US8536258B2Stabilizer and method of manufacturing the same, thermoplastic polymer composition using the same, and method of stabilizing thermoplastic polymerSOMA RYOJI·Filed 2008·Granted Sep 17, 2013·1 cites·6 claims
- 0363US5326881AUnsaturated imide compounds containing alicyclic structure, process for producing the same and intermediate thereforSUMITOMO CHEMICAL CO·Filed 1993·Granted Jul 5, 1994·5 cites·2 claims
- 0453US5719225AFiller-containing resin composition suitable for injection molding and transfer moldingSUMITOMO CHEMICAL CO·Filed 1995·Granted Feb 17, 1998·15 cites·24 claims
- 0550US8076402B2Bisphenol monoester compoundSOMA RYOJI·Filed 2008·Granted Dec 13, 2011·0 cites·8 claims
- 0648US5750789AUnsaturated imide compounds containing alicyclic structure, process for producing the same and intermediate thereforSUMITOMO CHEMICAL CO·Filed 1995·Granted May 12, 1998·2 cites·14 claims
- 0743US5780145AFiller-containing resin composition suitable for injection molding and transfer moldingSUMITOMO CHEMICAL CO·Filed 1997·Granted Jul 14, 1998·8 cites·25 claims
- 0838US5939473AEpoxy resin, resin composition, and resin-encapsulated semiconductor deviceSUMITOMO CHEMICAL CO·Filed 1996·Granted Aug 17, 1999·6 cites·24 claims
- 0937US6011130AEpoxy resin composition and process for producing the sameSUMITOMO CHEMICAL CO·Filed 1997·Granted Jan 4, 2000·4 cites·12 claims
- 1037US5939509AEpoxy resin, resin composition, and resin-encapsulated semiconductor deviceSUMITOMO CHEMICAL CO·Filed 1997·Granted Aug 17, 1999·5 cites·8 claims
- 1135US5646204AEpoxy resin composition and resin-encapsulated semiconductor deviceSUMITOMO CHEMICAL CO·Filed 1995·Granted Jul 8, 1997·5 cites·9 claims
- 1234US5498687AUnsaturated imide compounds containing alicyclic structure, process for producing the same and intermediate thereforSUMITOMO CHEMICAL CO·Filed 1995·Granted Mar 12, 1996·0 cites·15 claims
- 1331US5854370AEpoxy resin stilbenes and process for producing the same by photoisomerizationSUMITOMO CHEMICAL CO·Filed 1997·Granted Dec 29, 1998·1 cites·10 claims
- 1431US5444165AUnsaturated imide compounds containing alicyclic structure, process for producing the same and intermediate thereforSUMITOMO CHEMICAL CO·Filed 1994·Granted Aug 22, 1995·0 cites·6 claims
- 1530US5705596AEpoxy resin and process for producing the sameSUMITOMO CHEMICAL CO·Filed 1996·Granted Jan 6, 1998·0 cites·14 claims
Join the waitlist — get patent alerts
Get an alert when Masatsugu Akiba files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →