Inventor · disambiguated record
Liang-Chen Lin
Also filed as: LIN LIANG-CHEN
23 granted patents·3 pending applications·187 citations·filing 1998–2025
94Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD11TAIWAN SEMICONDUCTOR MFG9AU OPTRONICS CORP1HOU FU-TSAI1MOSEL VITELIC INC1
Top patents by PatentIndex Score
26 records- 0195US7719122B2System-in-package packaging for minimizing bond wire contamination and yield lossTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted May 18, 2010·72 cites·6 claims
- 0291US7659632B2Solder bump structure and method of manufacturing sameTAIWAN SEMINCONDUCTOR MFG CO L·Filed 2006·Granted Feb 9, 2010·30 cites·20 claims
- 0390US9385079B2Methods for forming stacked capacitors with fuse protectionTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jul 5, 2016·14 cites·20 claims
- 0489US7397127B2Bonding and probing pad structuresTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Jul 8, 2008·19 cites·17 claims
- 0587US11315860B2Semiconductor package and manufacturing process thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 26, 2022·5 cites·20 claims
- 0683US10495687B2Reliability testing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 3, 2019·2 cites·20 claims
- 0781US10014252B2Integrated circuit with multi-level arrangement of e-fuse protected decoupling capacitorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 3, 2018·4 cites·20 claims
- 0878US12283589B2Semiconductor device including cumulative sealing structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 22, 2025·0 cites·20 claims
- 0978US2025255001A1Semiconductor device including cumulative sealing structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1077US11164825B2CoWos interposer with selectable/programmable capacitance arraysTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 2, 2021·2 cites·20 claims
- 1174US7843058B2Flip chip packages with spacers separating heat sinks and substratesTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Nov 30, 2010·6 cites·15 claims
- 1272US8952945B2Display and gate driver thereofAU OPTRONICS CORP·Filed 2013·Granted Feb 10, 2015·2 cites·17 claims
- 1372US7679180B2Bond pad design to minimize dielectric crackingTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Mar 16, 2010·6 cites·14 claims
- 1468US11742276B2Semiconductor package and manufacturing process thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 29, 2023·0 cites·20 claims
- 1568US11676958B2Semiconductor device including cumulative sealing structures and method and system for making of sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 13, 2023·0 cites·20 claims
- 1663US11226363B2Reliability testing method and apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 18, 2022·0 cites·20 claims
- 1762US7939824B2Test structureTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted May 10, 2011·2 cites·19 claims
- 1860US6365455B1Flash memory process using polysilicon spacersMOSEL VITELIC INC·Filed 1998·Granted Apr 2, 2002·21 cites·15 claims
- 1957US7498680B2Test structureTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Mar 3, 2009·1 cites·11 claims
- 2054US2008274569A1Method for forming semiconductor ball grid array packageTAIWAN SEMICONDUCTOR MFG·Filed 2008·Application pending·0 cites
- 2151US8441127B2Bump-on-trace structures with wide and narrow portionsHOU FU-TSAI·Filed 2011·Granted May 14, 2013·1 cites·20 claims
- 2251US2008054455A1Semiconductor ball grid array packageTAIWAN SEMICONDUCTOR MFG·Filed 2006·Application pending·0 cites
- 2345US10847492B2Semiconductor structure and manufacturing method for the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 24, 2020·0 cites·20 claims
- 2444US9711474B2Semiconductor package structure with polymeric layer and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jul 18, 2017·0 cites·20 claims
- 2544US9508617B2Test chip, test board and reliability testing methodSU SHIANG-RUEI·Filed 2012·Granted Nov 29, 2016·0 cites·20 claims
- 2639US8217520B2System-in-package packaging for minimizing bond wire contamination and yield lossTSAO PEI-HAW·Filed 2010·Granted Jul 10, 2012·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →