Inventor · disambiguated record
Tomokazu Shimada
Also filed as: SHIMADA TOMOKAZU
6 granted patents·5 pending applications·23 citations·filing 2005–2024
77Inventor score
Files withMURATA MANUFACTURING CO3HITACHI CHEMICAL CO LTD2ENDO KIMITAKA1KANAMARU MAMIKO1MISHIMA KOUJI1
Top patents by PatentIndex Score
11 records- 0183US7923828B2Structure and method of making interconnect element, and multilayer wiring board including the interconnect elementTESSERA INTERCONNECT MATERIALS INC·Filed 2005·Granted Apr 12, 2011·16 cites·12 claims
- 0267US2025116024A1Plating apparatusMURATA MANUFACTURING CO·Filed 2024·Application pending·0 cites
- 0367US2025116029A1Plating apparatusMURATA MANUFACTURING CO·Filed 2024·Application pending·0 cites
- 0467US2025116025A1Plating apparatusMURATA MANUFACTURING CO·Filed 2024·Application pending·0 cites
- 0566US8859420B2Structure and method of making interconnect element, and multilayer wiring board including the interconnect elementENDO KIMITAKA·Filed 2011·Granted Oct 14, 2014·2 cites·19 claims
- 0665US9944827B2CMP polishing solution and polishing methodMISHIMA KOUJI·Filed 2011·Granted Apr 17, 2018·3 cites·36 claims
- 0762US9318346B2CMP polishing liquid and polishing methodHITACHI CHEMICAL CO LTD·Filed 2014·Granted Apr 19, 2016·1 cites·37 claims
- 0854US10876000B2Thermosetting resin composition, prepreg, laminated board, printed wiring board, and high speed communication-compatible moduleHITACHI CHEMICAL CO LTD·Filed 2017·Granted Dec 29, 2020·0 cites·20 claims
- 0954US8883031B2CMP polishing liquid and polishing methodKANAMARU MAMIKO·Filed 2010·Granted Nov 11, 2014·1 cites·35 claims
- 1041US2005224256A1Interlayer member used for producing multilayer wiring board and method of producing the sameNORTH CORP·Filed 2005·Application pending·0 cites
- 1141US2008264678A1Member for Interconnecting Wiring Films and Method for Producing the SameTESSERA INTERCONNECT MATERIALS·Filed 2005·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →