Inventor · disambiguated record
Guo-Cheng Liao
Also filed as: LIAO GUO-CHENG
19 granted patents·10 pending applications·19 citations·filing 2006–2025
90Inventor score
Top patents by PatentIndex Score
29 records- 0182US12261350B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Mar 25, 2025·0 cites·20 claims
- 0280US2025226569A1Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 0378US9978705B2Semiconductor substrate and semiconductor package structure having the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted May 22, 2018·2 cites·34 claims
- 0476US9117697B2Semiconductor substrate and method for making the sameADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Aug 25, 2015·4 cites·20 claims
- 0575US10971798B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Apr 6, 2021·1 cites·21 claims
- 0674US10847470B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Nov 24, 2020·2 cites·3 claims
- 0774US9437565B2Semiconductor substrate and semiconductor package structure having the sameADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Sep 6, 2016·2 cites·18 claims
- 0872US11721884B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Aug 8, 2023·0 cites·12 claims
- 0969US7763982B2Package substrate strip, metal surface treatment method thereof and chip package structureADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Jul 27, 2010·4 cites·16 claims
- 1065US8115104B2Circuit board with buried conductive trace formed thereon and method for manufacturing the sameLIAO GUO CHENG·Filed 2009·Granted Feb 14, 2012·4 cites·18 claims
- 1159US2025239512A1Package structureADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 1253US2025240893A1Package structureADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 1351US11670836B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Jun 6, 2023·0 cites·15 claims
- 1451US11362049B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jun 14, 2022·0 cites·19 claims
- 1550US11296001B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Apr 5, 2022·0 cites·20 claims
- 1650US7816608B2CTS and inspecting method thereofADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Oct 19, 2010·0 cites·7 claims
- 1750US2009288861A1Circuit board with buried conductive trace formed thereon and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2009·Application pending·0 cites
- 1849US7999389B2Via hole structure with a conductive layer formed thereinADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Aug 16, 2011·0 cites·15 claims
- 1949US2014001621A1Semiconductor packages having increased input/output capacity and related methodsADVANCED SEMICONDUCTOR ENG·Filed 2013·Application pending·0 cites
- 2048US11107777B2Substrate structure and semiconductor package structure including the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Aug 31, 2021·0 cites·11 claims
- 2147US2008060194A1Method for fabricating passive circuit in circuit substrateADVANCED SEMICONDUCTOR ENG·Filed 2007·Application pending·0 cites
- 2247US2008179740A1Package substrate, method of fabricating the same and chip packageADVANCED SEMICONDUCTOR ENG·Filed 2008·Application pending·0 cites
- 2346US2008157305A1Chip package structureADVANCED SEMICONDUCTOR ENG·Filed 2007·Application pending·0 cites
- 2444US11217509B2Semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Jan 4, 2022·0 cites·5 claims
- 2544US8531017B2Semiconductor packages having increased input/output capacity and related methodsLIAO GUO-CHENG·Filed 2011·Granted Sep 10, 2013·0 cites·20 claims
- 2644US7994429B2Manufacturing method and structure for a substrate with vertically embedded capacitorADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Aug 9, 2011·0 cites·11 claims
- 2742US2007235870A1Common Assembly Substrate and Applications ThereofADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
- 2839US11404799B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Aug 2, 2022·0 cites·19 claims
- 2939US2021225741A1Lead frame and assembly structureADVANCED SEMICONDUCTOR ENG·Filed 2020·Application pending·0 cites
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