Inventor · disambiguated record
Yu-Mei Hsu
Also filed as: HSU YU-MEI
10 granted patents·1 pending application·26 citations·filing 2003–2013
83Inventor score
Top patents by PatentIndex Score
11 records- 0173US7619307B1Leadframe-based semiconductor package having arched bend in a supporting bar and leadframe for the packagePOWERTECH TECHNOLOGY INC·Filed 2008·Granted Nov 17, 2009·7 cites·14 claims
- 0267US9084958B2Collecting device for gases and aerosol, methods of making, and methods of useWU CHANG-YU·Filed 2011·Granted Jul 21, 2015·2 cites·13 claims
- 0360US8049339B2Semiconductor package having isolated inner leadPOWERTECH TECHNOLOGY INC·Filed 2008·Granted Nov 1, 2011·2 cites·16 claims
- 0457US7750444B2Lead-on-chip semiconductor package and leadframe for the packagePOWERTECH TECHNOLOGY INC·Filed 2008·Granted Jul 6, 2010·1 cites·20 claims
- 0557USD568607STool boxHSU YU-MEI·Filed 2006·Granted May 13, 2008·13 cites·1 claims
- 0656US7723828B2Semiconductor package with leads on a chip having multi-row of bonding padsPOWERTECH TECHNOLOGY INC·Filed 2008·Granted May 25, 2010·1 cites·8 claims
- 0750US9126140B2Collecting device for gases and aerosol, methods of making, and method of useUNIV FLORIDA·Filed 2013·Granted Sep 8, 2015·0 cites·20 claims
- 0847US7812430B2Leadframe and semiconductor package having downset baffle paddlesPOWERTECH TECHNOLOGY INC·Filed 2008·Granted Oct 12, 2010·0 cites·18 claims
- 0945US7821112B2Semiconductor device with wire-bonding on multi-zigzag fingersPOWERTECH TECHNOLOGY INC·Filed 2008·Granted Oct 26, 2010·0 cites·20 claims
- 1044US8240029B2Method for forming an isolated inner lead from a leadframeFAN WEN-JENG·Filed 2008·Granted Aug 14, 2012·0 cites·20 claims
- 1133US2005050195A1Control method for setting up operation time of wireless connection deviceINVENTEC CORP·Filed 2003·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →