Inventor · disambiguated record
Taejoon Han
Also filed as: HAN TAEJOON
17 granted patents·4 pending applications·591 citations·filing 2000–2017
93Inventor score
Top patents by PatentIndex Score
21 records- 0196US9252238B1Semiconductor structures with coplanar recessed gate layers and fabrication methodsGLOBALFOUNDRIES INC·Filed 2014·Granted Feb 2, 2016·427 cites·20 claims
- 0294US6823815B2Wafer area pressure control for plasma confinementLAM RES CORP·Filed 2002·Granted Nov 30, 2004·76 cites·17 claims
- 0390US6492774B1Wafer area pressure control for plasma confinementLAM RES CORP·Filed 2000·Granted Dec 10, 2002·45 cites·17 claims
- 0485US9147680B2Integrated circuits having replacement metal gates with improved threshold voltage performance and methods for fabricating the sameGLOBALFOUNDRIES INC·Filed 2013·Granted Sep 29, 2015·10 cites·19 claims
- 0581US9040380B2Integrated circuits having laterally confined epitaxial material overlying fin structures and methods for fabricating sameGLOBALFOUNDRIES INC·Filed 2013·Granted May 26, 2015·6 cites·20 claims
- 0681US7782591B2Methods of and apparatus for reducing amounts of particles on a wafer during wafer de-chuckingLAM RES CORP·Filed 2007·Granted Aug 24, 2010·9 cites·18 claims
- 0772US10215704B2Computed tomography using intersecting views of plasma using optical emission spectroscopy during plasma processingTOKYO ELECTRON LTD·Filed 2017·Granted Feb 26, 2019·2 cites·26 claims
- 0871US8283255B2In-situ photoresist strip during plasma etching of active hard maskCHO SANGJUN·Filed 2007·Granted Oct 9, 2012·4 cites·18 claims
- 0967US8940641B1Methods for fabricating integrated circuits with improved patterning schemesGLOBALFOUNDRIES INC·Filed 2013·Granted Jan 27, 2015·2 cites·20 claims
- 1065US7470627B2Wafer area pressure control for plasma confinementLAM RES CORP·Filed 2004·Granted Dec 30, 2008·7 cites·18 claims
- 1157US9401263B2Feature etching using varying supply of power pulsesGLOBALFOUNDRIES INC·Filed 2013·Granted Jul 26, 2016·1 cites·20 claims
- 1254US2007128849A1Waferless automatic cleaning after barrier removalLAM RES CORP·Filed 2007·Application pending·0 cites
- 1346US9034767B1Facilitating mask pattern formationGLOBALFOUNDRIES INC·Filed 2013·Granted May 19, 2015·0 cites·20 claims
- 1446US7001529B2Pre-endpoint techniques in photoresist etchingLAM RES CORP·Filed 2003·Granted Feb 21, 2006·2 cites·25 claims
- 1545US8912633B2In-situ photoresist strip during plasma etching of active hard maskCHO SANGJUN·Filed 2012·Granted Dec 16, 2014·0 cites·20 claims
- 1643US2008105825A1Laser scanning apparatus and method using diffractive optical elementsHAN TAEJOON·Filed 2006·Application pending·0 cites
- 1741US2008064214A1Semiconductor processing including etched layer passivation using self-assembled monolayerLAM RES CORP·Filed 2006·Application pending·0 cites
- 1839US2015024584A1Methods for forming integrated circuits with reduced replacement metal gate height variabilityGLOBAL FOUNDRIES INC·Filed 2013·Application pending·0 cites
- 1938US10503850B2Generation of a map of a substrate using iterative calculations of non-measured attribute dataTOKYO ELECTRON LTD·Filed 2017·Granted Dec 10, 2019·0 cites·17 claims
- 2037US8124516B2Trilayer resist organic layer etchKANG SEAN S·Filed 2006·Granted Feb 28, 2012·0 cites·18 claims
- 2131US7211518B2Waferless automatic cleaning after barrier removalLAM RES CORP·Filed 2004·Granted May 1, 2007·0 cites·12 claims
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