Inventor · disambiguated record
Syed Sajid Ahmad
Also filed as: AHMAD SYED S · AHMAD SYED SAJID
55 granted patents·4 pending applications·1,161 citations·filing 1986–2006
99Inventor score
Top patents by PatentIndex Score
59 records- 0196US6331448B1Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and methods of designing and fabricating such leadframesMICRON TECHNOLOGY INC·Filed 2000·Granted Dec 18, 2001·90 cites·19 claims
- 0295US6483044B1Interconnecting substrates for electrical coupling of microelectronic componentsMICRON TECHNOLOGY INC·Filed 2000·Granted Nov 19, 2002·74 cites·19 claims
- 0394US5994784ADie positioning in integrated circuit packagingMICRON TECHNOLOGY INC·Filed 1997·Granted Nov 30, 1999·135 cites·12 claims
- 0493US6329705B1Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and method of designing and fabricating such leadframesMICRON TECHNOLOGY INC·Filed 1998·Granted Dec 11, 2001·112 cites·17 claims
- 0589US4810523APressure-sensitive adhesivesNEUTRON PRODUCTS INC·Filed 1986·Granted Mar 7, 1989·75 cites·20 claims
- 0688US7928579B2Devices including sloped vias in a substrate and devices including spring-like deflecting contactsMICRON TECHNOLOGY INC·Filed 2006·Granted Apr 19, 2011·14 cites·30 claims
- 0788US6017776AMethod of attaching a leadframe to singulated semiconductor diceMICRON TECHNOLOGY INC·Filed 1997·Granted Jan 25, 2000·62 cites·56 claims
- 0887US6569753B1Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating sameMICRON TECHNOLOGY INC·Filed 2000·Granted May 27, 2003·74 cites·70 claims
- 0987US5616953ALead frame surface finish enhancementMICRON TECHNOLOGY INC·Filed 1994·Granted Apr 1, 1997·88 cites·24 claims
- 1084US6946732B2Stabilizers for flip-chip type semiconductor devices and semiconductor device components and assemblies including the sameMICRON TECHNOLOGY INC·Filed 2001·Granted Sep 20, 2005·22 cites·29 claims
- 1182US7041533B1Stereolithographic method for fabricating stabilizers for semiconductor devicesMICRON TECHNOLOGY INC·Filed 2000·Granted May 9, 2006·19 cites·40 claims
- 1282US6525408B2Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating sameMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 25, 2003·53 cites·21 claims
- 1381US6436732B2Apparatus for applying viscous materials to a lead frameMICRON TECHNOLOGY INC·Filed 2001·Granted Aug 20, 2002·23 cites·8 claims
- 1480US6500697B2Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and methods of designing and fabricating such leadframesMICRON TECHNOLOGY INC·Filed 2001·Granted Dec 31, 2002·20 cites·19 claims
- 1578US6312977B1Method of attaching a leadframe to singulated semiconductor diceFiled 2000·Granted Nov 6, 2001·16 cites·45 claims
- 1671US6013535AMethod for applying adhesives to a lead frameMICRON TECHNOLOGY INC·Filed 1997·Granted Jan 11, 2000·30 cites·32 claims
- 1769US6796028B2Method of Interconnecting substrates for electrical coupling of microelectronic componentsMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 28, 2004·10 cites·6 claims
- 1867US6528867B1Integrated circuit devices including connection components mechanically and electrically attached to semiconductor diceMICRON TECHNOLOGY INC·Filed 2000·Granted Mar 4, 2003·12 cites·29 claims
- 1964US6506628B2Method of attaching a leadframe to singulated semiconductor diceMICRON TECHNOLOGY INC·Filed 2001·Granted Jan 14, 2003·7 cites·44 claims
- 2064US6083768AGravitationally-assisted control of spread of viscous material applied to semiconductor assembly componentsMICRON TECHNOLOGY INC·Filed 1996·Granted Jul 4, 2000·19 cites·4 claims
- 2162US6544461B1Test carrier with molded interconnect for testing semiconductor componentsMICRON TECHNOLOGY INC·Filed 2000·Granted Apr 8, 2003·7 cites·21 claims
- 2260US6979598B2Method of attaching a leadframe to singulated semiconductor diceMICRON TECHNOLOGY INC·Filed 2004·Granted Dec 27, 2005·5 cites·68 claims
- 2359US6200833B1Method of attaching a leadframe to singulated semiconductor diceMICRON TECHNOLOGY INC·Filed 1999·Granted Mar 13, 2001·14 cites·45 claims
- 2458US6998334B2Semiconductor devices with permanent polymer stencil and method for manufacturing the sameMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 14, 2006·19 cites·73 claims
- 2558US6353326B2Test carrier with molded interconnect for testing semiconductor componentsMICRON TECHNOLOGY INC·Filed 1998·Granted Mar 5, 2002·15 cites·21 claims
- 2657US6706559B2Method of attaching a leadframe to singulated semiconductor diceMICRON TECHNOLOGY INC·Filed 2002·Granted Mar 16, 2004·4 cites·44 claims
- 2754US7169693B2Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating sameMICRON TECHNOLOGY INC·Filed 2003·Granted Jan 30, 2007·9 cites·49 claims
- 2854US7095106B2Collars, support structures, and forms for protruding conductive structuresMICRON TECHNOLOGY INC·Filed 2005·Granted Aug 22, 2006·0 cites·28 claims
- 2954US6642730B1Test carrier with molded interconnect for testing semiconductor componentsMICRON TECHNOLOGY INC·Filed 2003·Granted Nov 4, 2003·4 cites·24 claims
- 3054US6204093B1Method and apparatus for applying viscous materials to a lead frameMICRON TECHNOLOGY INC·Filed 1997·Granted Mar 20, 2001·14 cites·14 claims
- 3153US7390740B2Sloped vias in a substrate, spring-like contacts, and methods of makingMICRON TECHNOLOGY INC·Filed 2004·Granted Jun 24, 2008·4 cites·37 claims
- 3253US6983551B2Interconnecting substrates for electrical coupling of microelectronic componentsMICRON TECHNOLOGY INC·Filed 2002·Granted Jan 10, 2006·3 cites·14 claims
- 3353US6982386B2Interconnecting substrates for electrical coupling of microelectronic componentsMICRON TECHNOLOGY INC·Filed 2002·Granted Jan 3, 2006·3 cites·18 claims
- 3451US6911735B2Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating sameMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 28, 2005·7 cites·20 claims
- 3551US6818460B2Method for applying adhesives to a lead frameMICRON TECHNOLOGY INC·Filed 2001·Granted Nov 16, 2004·3 cites·418 claims
- 3651US2005282313A1Methods for modifying semiconductor devices to stabilize the same and semiconductor device assemblyAKRAM SALMAN·Filed 2005·Application pending·0 cites
- 3750US6703260B2Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and methods of designing and fabricating such leadframesMICRON TECHNOLOGY INC·Filed 2002·Granted Mar 9, 2004·2 cites·21 claims
- 3850US6602730B2Method for gravitation-assisted control of spread of viscous material applied to a substrateMICRON TECHNOLOGY INC·Filed 2002·Granted Aug 5, 2003·2 cites·11 claims
- 3950US6316952B1Flexible conductive structures and methodMICRON TECHNOLOGY INC·Filed 1999·Granted Nov 13, 2001·13 cites·25 claims
- 4050US6110761AMethods for simultaneously electrically and mechanically attaching lead frames to semiconductor dice and the resulting elementsMICRON TECHNOLOGY INC·Filed 1998·Granted Aug 29, 2000·13 cites·42 claims
- 4149US6890384B2Apparatus and method for modifying the configuration of an exposed surface of a viscous fluidMICRON TECHNOLOGY INC·Filed 2001·Granted May 10, 2005·2 cites·51 claims
- 4249US6485778B1Method of applying an adhesive material to lead fingers of a lead frameMICRON TECHNOLOGY INC·Filed 2000·Granted Nov 26, 2002·2 cites·20 claims
- 4349US2005255612A1Method of attaching a leadframe to singulated semiconductor diceJIANG TONGBI·Filed 2005·Application pending·0 cites
- 4447US6346152B1Method and apparatus for applying adhesives to a lead frameMICRON TECHNOLOGY INC·Filed 1999·Granted Feb 12, 2002·10 cites·99 claims
- 4546US6919229B2Method for controlling the depth of immersion of a semiconductor element in an exposed surface of a viscous fluidMICRON TECHNOLOGY INC·Filed 2001·Granted Jul 19, 2005·1 cites·89 claims
- 4646US6489681B2Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly componentsMICRON TECHNOLOGY INC·Filed 2001·Granted Dec 3, 2002·1 cites·13 claims
- 4746US6194251B1Die positioning in integrated circuit packagingMICRON TECHNOLOGY INC·Filed 1999·Granted Feb 27, 2001·10 cites·22 claims
- 4843US6040205AApparatus and method for controlling the depth of immersion of a semiconductor element in an exposed surface of a viscous fluidMICRON TECHNOLOGY INC·Filed 1998·Granted Mar 21, 2000·8 cites·30 claims
- 4943US5960712AScreens for use in a screen printing systemMICRON TECHNOLOGY INC·Filed 1998·Granted Oct 5, 1999·9 cites·21 claims
- 5043US2003098499A1Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pad, semiconductor device components including same, and methods for fabricating sameFiled 2002·Application pending·0 cites
Showing the top 50 of 59 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →