Inventor · disambiguated record
Adrian Lis
Also filed as: LIS ADRIAN
8 granted patents·6 pending applications·0 citations·filing 2021–2025
71Inventor score
Files withINFINEON TECHNOLOGIES AG14
Top patents by PatentIndex Score
14 records- 0166US2025233092A1Electronic device having a solder stop featureINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 0264US12300643B2Solder stop feature for electronic devicesINFINEON TECHNOLOGIES AG·Filed 2021·Granted May 13, 2025·0 cites·8 claims
- 0361US2025096069A1Power module and method of fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0459US2025259917A1Power module having a multi-level metallic frame with power terminalsINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0558US12374661B2Power module having vertically aligned first and second substratesINFINEON TECHNOLOGIES AG·Filed 2022·Granted Jul 29, 2025·0 cites·20 claims
- 0658US2024304527A1Power module having a multi-level lead frameINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0756US12224222B2Semiconductor package having a thermally and electrically conductive spacerINFINEON TECHNOLOGIES AG·Filed 2022·Granted Feb 11, 2025·0 cites·25 claims
- 0855US12062589B2Semiconductor packages including recesses to contain solderINFINEON TECHNOLOGIES AG·Filed 2021·Granted Aug 13, 2024·0 cites·20 claims
- 0954US12469770B2Power semiconductor module with rivet or press fit pin and method for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2022·Granted Nov 11, 2025·0 cites·9 claims
- 1054US12183667B2Semiconductor package with power electronics carrier having trench spacing adapted for delaminationINFINEON TECHNOLOGIES AG·Filed 2022·Granted Dec 31, 2024·0 cites·20 claims
- 1154US12113000B2Lead adapters for semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2021·Granted Oct 8, 2024·0 cites·20 claims
- 1254US2024413118A1Solder barrier structure for power modulesINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 1352US12334458B2Package with pad having open notchINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jun 17, 2025·0 cites·14 claims
- 1446US2022415732A1Semiconductor module with shaped external contact for reduced crack formation in the encapsulation bodyINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →