Inventor · disambiguated record
Jonathan L. Rosch
Also filed as: ROSCH JONATHAN · ROSCH JONATHAN L
9 granted patents·3 pending applications·9 citations·filing 2016–2025
81Inventor score
Technology areasH10W
Files withINTEL CORP12
Top patents by PatentIndex Score
12 records- 0194US12014989B2Device and method of very high density routing used with embedded multi-die interconnect bridgeINTEL CORP·Filed 2022·Granted Jun 18, 2024·1 cites·20 claims
- 0289US2025323167A1Device and method of very high density routing used with embedded multi-die interconnect bridgeINTEL CORP·Filed 2025·Application pending·0 cites
- 0384US2024258240A1Device and method of very high density routing used with embedded multi-die interconnect bridgeINTEL CORP·Filed 2024·Application pending·0 cites
- 0480US10734358B2Multi-packaging for single-socketingINTEL CORP·Filed 2018·Granted Aug 4, 2020·3 cites·27 claims
- 0578US12040276B2Device and method of very high density routing used with embedded multi-die interconnect bridgeINTEL CORP·Filed 2022·Granted Jul 16, 2024·0 cites·20 claims
- 0673US10741947B2Plated through hole socketing coupled to a solder ball to engage with a pinINTEL CORP·Filed 2018·Granted Aug 11, 2020·2 cites·23 claims
- 0772US10535590B2Multi-layer solder resists for semiconductor device package surfaces and methods of assembling sameINTEL CORP·Filed 2017·Granted Jan 14, 2020·2 cites·21 claims
- 0868US2023369192A1Dual trace thickness for single layer routingINTEL CORP·Filed 2023·Application pending·0 cites
- 0967US11495555B2Magnetic bilayer structure for a cored or coreless semiconductor packageINTEL CORP·Filed 2018·Granted Nov 8, 2022·1 cites·13 claims
- 1056US11508662B2Device and method of very high density routing used with embedded multi-die interconnect bridgeINTEL CORP·Filed 2016·Granted Nov 22, 2022·0 cites·14 claims
- 1153US11769719B2Dual trace thickness for single layer routingINTEL CORP·Filed 2018·Granted Sep 26, 2023·0 cites·8 claims
- 1246US11276618B2Bi-layer prepreg for reduced dielectric thicknessINTEL CORP·Filed 2018·Granted Mar 15, 2022·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →