Inventor · disambiguated record
Sheng-Shu Yang
Also filed as: YANG SHENG · YANG SHENG-SHU
11 granted patents·9 pending applications·102 citations·filing 2003–2020
87Inventor score
Top patents by PatentIndex Score
20 records- 0192US6972490B2Bonding structure with compliant bumpsIND TECH RES INST·Filed 2004·Granted Dec 6, 2005·65 cites·23 claims
- 0287US10361235B2Image sensorIND TECH RES INST·Filed 2016·Granted Jul 23, 2019·5 cites·16 claims
- 0383US7576430B2Bonding structureTAIWAN TFT LCD ASS·Filed 2007·Granted Aug 18, 2009·10 cites·11 claims
- 0481US7449716B2Bond quality indication by bump structure on substrateTAIWAN TFT LCD ASS·Filed 2007·Granted Nov 11, 2008·11 cites·21 claims
- 0578US7977788B2Contact structure having a compliant bump and a testing areaTAIWAN TFT LCD ASS·Filed 2006·Granted Jul 12, 2011·8 cites·15 claims
- 0666US10825851B2Sensor package structureKINGPAK TECH INC·Filed 2019·Granted Nov 3, 2020·1 cites·7 claims
- 0750US8211788B2Method of fabricating bonding structureCHANG SHYH-MING·Filed 2009·Granted Jul 3, 2012·0 cites·8 claims
- 0849US2015097259A1Conductive via structure, package structure, and package of photosensitive deviceIND TECH RES INST·Filed 2014·Application pending·0 cites
- 0949US2018145107A1Manufacturing method of image sensorIND TECH RES INST·Filed 2017·Application pending·0 cites
- 1049US2008044327A1Apparatus and process for vacuum sublimationIND TECH RES INST·Filed 2007·Application pending·0 cites
- 1145US8164187B2Flip chip device and manufacturing method thereofCHEN WEN-CHIH·Filed 2009·Granted Apr 24, 2012·0 cites·18 claims
- 1245US2011230044A1Contact structure having a compliant bump and a testing area and manufacturing method for the sameTAIWAN TFT LCD ASS·Filed 2011·Application pending·0 cites
- 1343US7611548B2Vertical sublimation apparatusIND TECH RES INST·Filed 2003·Granted Nov 3, 2009·2 cites·15 claims
- 1443US2021057470A1Sensor package structureKINGPAK TECH INC·Filed 2020·Application pending·0 cites
- 1542US2016043239A1Package structureIND TECH RES INST·Filed 2015·Application pending·0 cites
- 1641US2006267197A1Integrated circuit deviceTAIWAN TFT LCD ASS·Filed 2006·Application pending·0 cites
- 1740US8215969B2Contact structure and forming method thereof and connecting structure thereofYANG SHENG-SHU·Filed 2008·Granted Jul 10, 2012·0 cites·42 claims
- 1838US2017153214A1Optical sensing moduleIND TECH RES INST·Filed 2015·Application pending·0 cites
- 1937US2006125111A1Flip chip deviceCHEN WEN-CHIH·Filed 2005·Application pending·0 cites
- 2036US8736083B2Bonding inspection structureYANG SHENG-SHU·Filed 2009·Granted May 27, 2014·0 cites·35 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →