Inventor · disambiguated record
Seung-Kon Mok
Also filed as: MOK SEUNG K · MOK SEUNG-KON
16 granted patents·8 pending applications·412 citations·filing 1994–2023
93Inventor score
Top patents by PatentIndex Score
24 records- 0195US5677569ASemiconductor multi-package stackSAMSUNG ELECTRONICS CO LTD·Filed 1995·Granted Oct 14, 1997·214 cites·14 claims
- 0290US11626373B2Semiconductor packages including antenna patternSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 11, 2023·2 cites·20 claims
- 0386US5965947AStructure of a semiconductor package including chips bonded to die bonding pad with conductive adhesive and chips bonded with non-conductive adhesive containing insulating beadsSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Oct 12, 1999·95 cites·15 claims
- 0484US8759959B2Stacked semiconductor packagesYIM CHOONG-BIN·Filed 2011·Granted Jun 24, 2014·7 cites·10 claims
- 0580US9793309B2Image sensor packageSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Oct 17, 2017·5 cites·18 claims
- 0676US9190401B2Stacked semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Nov 17, 2015·3 cites·19 claims
- 0776US7952199B2Circuit board including solder ball land having hole and semiconductor package having the circuit boardSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted May 31, 2011·4 cites·7 claims
- 0873US12261135B2Semiconductor packages including antenna patternSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Mar 25, 2025·0 cites·20 claims
- 0969US7579583B2Solid-state imaging apparatus, wiring substrate and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Aug 25, 2009·16 cites·60 claims
- 1069US6638638B2Hollow solder structure having improved reliability and method of manufacturing sameSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Oct 28, 2003·11 cites·13 claims
- 1165US5504373ASemiconductor memory moduleSAMSUNG ELECTRONICS CO LTD·Filed 1994·Granted Apr 2, 1996·36 cites·5 claims
- 1257US7667325B2Circuit board including solder ball land having hole and semiconductor package having the circuit boardSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Feb 23, 2010·1 cites·6 claims
- 1353US6963033B2Ball grid array attaching means having improved reliability and method of manufacturing sameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Nov 8, 2005·4 cites·36 claims
- 1447US5621242ASemiconductor package having support film formed on inner leadsSAMSUNG ELECTRONICS CO LTD·Filed 1996·Granted Apr 15, 1997·14 cites·21 claims
- 1546US2008108169A1Ultrathin module for semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 1645US10483150B2Apparatus for stacking semiconductor chips in a semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Nov 19, 2019·0 cites·19 claims
- 1744US2009108447A1Semiconductor device having a fine pitch bondpadSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 1842US2009057845A1Apparatus to saw wafer and having nozzle to remove burrs in scribe lanes, method of sawing wafer, and semiconductor package fabricated by the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 1940US2007190688A1Method for manufacturing semiconductor device with protection layerSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 2038US8803301B2Semiconductor packageCHO KYONG-SOON·Filed 2012·Granted Aug 12, 2014·0 cites·20 claims
- 2138US2004263667A1Solid-state imaging apparatus and method for making the sameFiled 2004·Application pending·0 cites
- 2238US2013193545A1Semiconductor apparatus and image sensor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 2337US2006006511A1Ultrathin module for semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Application pending·0 cites
- 2432US2009315130A1Solid-state imaging apparatus and method for manufacturing the sameRO YOUNG-HOON·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →