Inventor · disambiguated record
Norio Sakai
Also filed as: SAKAI NORIO
103 granted patents·12 pending applications·1,399 citations·filing 1986–2019
99Inventor score
Files withMURATA MANUFACTURING CO96SAKAI NORIO6MITSUBISHI HEAVY IND LTD2CHIKAGAWA OSAMU1FUJITSU LTD1
Top patents by PatentIndex Score
115 records- 0194US10553347B2ModuleMURATA MANUFACTURING CO·Filed 2016·Granted Feb 4, 2020·6 cites·13 claims
- 0292US8031124B2Container with electromagnetic coupling moduleMURATA MANUFACTURING CO·Filed 2009·Granted Oct 4, 2011·24 cites·8 claims
- 0392US7569925B2Module with built-in componentMURATA MANUFACTURING CO·Filed 2006·Granted Aug 4, 2009·27 cites·6 claims
- 0492US6432239B1Method of producing ceramic multilayer substrateMURATA MANUFACTURING CO·Filed 2000·Granted Aug 13, 2002·56 cites·20 claims
- 0591US10410782B2Coil moduleMURATA MANUFACTURING CO·Filed 2016·Granted Sep 10, 2019·7 cites·20 claims
- 0690US7656677B2Multilayer electronic component and structure for mounting multilayer electronic componentMURATA MANUFACTURING CO·Filed 2005·Granted Feb 2, 2010·21 cites·20 claims
- 0789US7750247B2Multilayer substrate with built-in-chip-type electronic component and method for manufacturing the sameMURATA MANUFACTURING CO·Filed 2005·Granted Jul 6, 2010·15 cites·3 claims
- 0889US6468640B2Monolithic ceramic substrate, manufacturing and designing methods therefor, and electronic deviceMURATA MANUFACTURING CO·Filed 2001·Granted Oct 22, 2002·31 cites·7 claims
- 0987US10403431B2Coil component, coil module, and method for manufacturing coil componentMURATA MANUFACTURING CO·Filed 2016·Granted Sep 3, 2019·3 cites·13 claims
- 1087US7446262B2Laminated electronic component and method for producing the sameMURATA MANUFACTURING CO·Filed 2005·Granted Nov 4, 2008·15 cites·15 claims
- 1186US6576999B2Mounting structure for an electronic component having an external terminal electrodeMURATA MANUFACTURING CO·Filed 2001·Granted Jun 10, 2003·30 cites·18 claims
- 1285US6760227B2Multilayer ceramic electronic component and manufacturing method thereofMURATA MANUFACTURING CO·Filed 2003·Granted Jul 6, 2004·41 cites·20 claims
- 1385US5635670AMultilayer electronic componentMURATA MANUFACTURING CO·Filed 1996·Granted Jun 3, 1997·59 cites·16 claims
- 1485US5488765AMethod of measuring characteristics of a multilayer electronic componentMURATA MANUFACTURING CO·Filed 1994·Granted Feb 6, 1996·65 cites·4 claims
- 1583US6815046B2Method of producing ceramic multilayer substrateMURATA MANUFACTURING CO·Filed 2003·Granted Nov 9, 2004·26 cites·19 claims
- 1682US7450395B2Circuit module and circuit device including circuit moduleMURATA MANUFACTURING CO·Filed 2008·Granted Nov 11, 2008·9 cites·8 claims
- 1782US6751101B2Electronic component and method of producing the sameMURATA MANUFACTURING CO·Filed 2001·Granted Jun 15, 2004·32 cites·18 claims
- 1881US5600101AMultilayer electronic component and method of manufacturing the sameMURATA MANUFACTURING CO·Filed 1995·Granted Feb 4, 1997·61 cites·12 claims
- 1980US8720050B2Method for manufacturing multilayer substrate with built-in chip-type electronic componentCHIKAGAWA OSAMU·Filed 2010·Granted May 13, 2014·5 cites·5 claims
- 2080US7851708B2Composite substrate and method for manufacturing composite substrateMURATA MANUFACTURING CO·Filed 2008·Granted Dec 14, 2010·8 cites·15 claims
- 2180US7595997B2Multilayer ceramic electronic component, multilayer ceramic substrate, and method for manufacturing multilayer ceramic electronic componentMURATA MANUFACTURING CO·Filed 2008·Granted Sep 29, 2009·8 cites·11 claims
- 2280US5644107AMethod of manufacturing a multilayer electronic componentMURATA MANUFACTURING CO·Filed 1995·Granted Jul 1, 1997·44 cites·6 claims
- 2379US5635669AMultilayer electronic componentMURATA MANUFACTURING CO·Filed 1995·Granted Jun 3, 1997·59 cites·13 claims
- 2479US5274916AMethod of manufacturing ceramic multilayer electronic componentMURATA MANUFACTURING CO·Filed 1992·Granted Jan 4, 1994·64 cites·8 claims
- 2579US4929295AMethod of manufacturing ceramic laminateMURATA MANUFACTURING CO·Filed 1989·Granted May 29, 1990·28 cites·16 claims
- 2678US6582541B2Monolithic ceramic substrate, manufacturing and designing methods therefor, and electronic deviceMURATA MANUFACTURING CO·Filed 2002·Granted Jun 24, 2003·14 cites·14 claims
- 2777US10553341B2Coil component and module including the sameMURATA MANUFACTURING CO·Filed 2016·Granted Feb 4, 2020·1 cites·20 claims
- 2877US8371026B2Method for manufacturing multilayer ceramic electronic deviceMURATA MANUFACTURING CO·Filed 2008·Granted Feb 12, 2013·6 cites·13 claims
- 2977US5261986AMethod of fabricating ceramic laminated electronic componentMURATA MANUFACTURING CO·Filed 1991·Granted Nov 16, 1993·31 cites·7 claims
- 3076US7649252B2Ceramic multilayer substrateMURATA MANUFACTURING CO·Filed 2004·Granted Jan 19, 2010·19 cites·8 claims
- 3176US5625935AMethod of manufacturing a multilayer electronic componentMURATA MANUFACTURING CO·Filed 1994·Granted May 6, 1997·40 cites·7 claims
- 3276US5493769AMethod of manufacturing electronic component and measuring characteristics of sameMURATA MANUFACTURING CO·Filed 1994·Granted Feb 27, 1996·53 cites·8 claims
- 3375US5604328AMultilayer electronic componentMURATA MANUFACTURING CO·Filed 1995·Granted Feb 18, 1997·33 cites·15 claims
- 3474US5383997AMethod of handling electronic component chipsMURATA MANUFACTURING CO·Filed 1994·Granted Jan 24, 1995·31 cites·8 claims
- 3573US6214508B1Circuit-forming charging powder and multilayer wiring board using the sameMURATA MANUFACTURING CO·Filed 1999·Granted Apr 10, 2001·26 cites·20 claims
- 3672US10056311B2Electronic circuit moduleMURATA MANUFACTURING CO·Filed 2017·Granted Aug 21, 2018·2 cites·8 claims
- 3771US9769917B2Resin multilayer substrateMURATA MANUFACTURING CO·Filed 2014·Granted Sep 19, 2017·2 cites·10 claims
- 3871US8604349B2Multilayer substrate and manufacturing method thereofSAKAI NORIO·Filed 2012·Granted Dec 10, 2013·2 cites·12 claims
- 3971US8248668B2Image processing device, image processing method, and image forming apparatusSAKAI NORIO·Filed 2009·Granted Aug 21, 2012·3 cites·9 claims
- 4071US5622585AMethod of handling electronic component chipsMURATA MANUFACTURING CO·Filed 1995·Granted Apr 22, 1997·25 cites·20 claims
- 4170US6682953B2Method for making a mounting structure for an electronic component having an external terminal electrodeMURATA MANUFACTURING CO·Filed 2003·Granted Jan 27, 2004·12 cites·9 claims
- 4269US6403272B1Circuit-forming charging powder and multilayer wiring board using the sameMURATA MANUFACTURING CO·Filed 2000·Granted Jun 11, 2002·10 cites·10 claims
- 4369US6157789AElectrophotographic apparatusMURATA MANUFACTURING CO·Filed 1999·Granted Dec 5, 2000·19 cites·6 claims
- 4468US10476133B2Electrical element, mobile device, and method for manufacturing electrical elementMURATA MANUFACTURING CO·Filed 2016·Granted Nov 12, 2019·1 cites·20 claims
- 4568US6509531B2Monolithic ceramic electronic component, method for manufacturing the same, and electronic deviceMURATA MANUFACTURING CO·Filed 2001·Granted Jan 21, 2003·14 cites·11 claims
- 4667US5007534ARetainer for chip-type electronic partsMURATA MANUFACTURING CO·Filed 1989·Granted Apr 16, 1991·27 cites·4 claims
- 4766US8299968B2Packaging material with electromagnetic coupling moduleOSAMURA MAKOTO·Filed 2009·Granted Oct 30, 2012·5 cites·7 claims
- 4866US6488795B1Multilayered ceramic substrate and method of producing the sameMURATA MANUFACTURING CO·Filed 2000·Granted Dec 3, 2002·13 cites·18 claims
- 4964US6639311B2Multilayer ceramic electronic component, electronic component aggregate, and method for producing multilayer ceramic electronic componentMURATA MANUFACTURING CO·Filed 2002·Granted Oct 28, 2003·10 cites·9 claims
- 5064US5571594AElectronic component chip holder including two adhesive surfaces having different adhesivenessMURATA MANUFACTURING CO·Filed 1994·Granted Nov 5, 1996·18 cites·26 claims
Showing the top 50 of 115 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →