Inventor · disambiguated record
Rebecca Y. Gorrell
Also filed as: GORRELL REBECCA Y · GORRELL REBECCA YUNG
5 granted patents·365 citations·filing 1997–2002
85Inventor score
Files withIBM5
Top patents by PatentIndex Score
5 records- 0196US6336262B1Process of forming a capacitor with multi-level interconnection technologyIBM·Filed 1997·Granted Jan 8, 2002·174 cites·26 claims
- 0294US6682872B2UV-curable compositions and method of use thereof in microelectronicsIBM·Filed 2002·Granted Jan 27, 2004·90 cites·20 claims
- 0387US6596621B1Method of forming a lead-free tin-silver-copper based solder alloy on an electronic substrateIBM·Filed 2002·Granted Jul 22, 2003·61 cites·20 claims
- 0474US5808853ACapacitor with multi-level interconnection technologyIBM·Filed 1997·Granted Sep 15, 1998·38 cites·22 claims
- 0540US6555912B1Corrosion-resistant electrode structure for integrated circuit decoupling capacitorsIBM·Filed 2001·Granted Apr 29, 2003·2 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →