Inventor · disambiguated record
Kazuhito Matsukawa
Also filed as: MATSUKAWA KAZUHITO
6 granted patents·2 pending applications·65 citations·filing 1993–2009
82Inventor score
Top patents by PatentIndex Score
8 records- 0171US6828163B2Wafer shape evaluating method and device producing method, wafer and wafer selecting methodSHINETSU HANDOTAI KK·Filed 2001·Granted Dec 7, 2004·15 cites·44 claims
- 0266US7582950B2Semiconductor chip having gettering layer, and method for manufacturing the sameRENESAS TECH CORP·Filed 2005·Granted Sep 1, 2009·3 cites·2 claims
- 0358US5306947ASemiconductor device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 1993·Granted Apr 26, 1994·32 cites·7 claims
- 0457US6706636B2Method of regenerating semiconductor waferRENESAS TECH CORP·Filed 2002·Granted Mar 16, 2004·7 cites·14 claims
- 0554US6656775B1Semiconductor substrate, semiconductor device, and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Dec 2, 2003·6 cites·11 claims
- 0652US6461447B1Substrate for epitaxial growthMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Oct 8, 2002·2 cites·3 claims
- 0751US2009286354A1Semiconductor chip having gettering layer, and method for manufacturing the sameRENESAS TECH CORP·Filed 2009·Application pending·0 cites
- 0835US2004007741A1Semiconductor substrate, seminconductor device, and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2003·Application pending·0 cites
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