Inventor · disambiguated record
Hiroshi Koya
Also filed as: KOYA HIROSHI
4 granted patents·1 pending application·67 citations·filing 2000–2003
76Inventor score
Top patents by PatentIndex Score
5 records- 0187US6663708B1Silicon wafer, and manufacturing method and heat treatment method of the sameMITSUBISHI MATERIAL SILICON·Filed 2000·Granted Dec 16, 2003·42 cites·1 claims
- 0270US6428619B1Silicon wafer, and heat treatment method of the same and the heat-treated silicon waferMITSUBISHI MATERIAL SILICON·Filed 2000·Granted Aug 6, 2002·16 cites·11 claims
- 0365US6682597B2Silicon wafer, and heat treatment method of the same and the heat-treated silicon waferMITSUBISHI MATERIAL SILICON·Filed 2002·Granted Jan 27, 2004·7 cites·2 claims
- 0452US6461447B1Substrate for epitaxial growthMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Oct 8, 2002·2 cites·3 claims
- 0539US2004025983A1Method of manufacturing siliconFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →