Inventor · disambiguated record
Tung-Ting Wu
Also filed as: WU TUNG-TING
12 granted patents·3 pending applications·33 citations·filing 2012–2025
87Inventor score
Top patents by PatentIndex Score
15 records- 0196US11075242B2Semiconductor devices for image sensingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 27, 2021·14 cites·20 claims
- 0296US10991746B2High performance image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 27, 2021·7 cites·20 claims
- 0395US11670663B2High performance image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 6, 2023·2 cites·20 claims
- 0489US12414400B2High performance image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 9, 2025·0 cites·20 claims
- 0587US2025311465A1High performance image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0684US12100726B2High performance image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 24, 2024·0 cites·20 claims
- 0784US9299740B2Image sensor with low step height between back-side metal and pixel arrayTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Mar 29, 2016·3 cites·17 claims
- 0882US10074680B2Image sensor with low step height between back-side metal and pixel arrayTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 11, 2018·3 cites·21 claims
- 0981US2024371900A1Semiconductor devices for image sensingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1080US8791571B1System and method for preventing etch arcing during semiconductor processingTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 29, 2014·4 cites·19 claims
- 1177US2024355764A1Device crack-stop structure to prevent damage due to dicing crackTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1273US12057412B2Device crack-stop structure to prevent damage due to dicing crackTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 6, 2024·0 cites·20 claims
- 1372US12136638B2Semiconductor devices for image sensingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 5, 2024·0 cites·20 claims
- 1461US11348881B2Device crack-stop structure to prevent damage due to dicing crackTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 31, 2022·0 cites·20 claims
- 1541US9859326B2Semiconductor devices, image sensors, and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 2, 2018·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →