Inventor · disambiguated record
Masahito Tanabe
Also filed as: TANABE MASAHITO
29 granted patents·6 pending applications·770 citations·filing 1996–2024
97Inventor score
Files withSHINETSU CHEMICAL CO17TOKYO OHKA KOGYO CO LTD12TOPPAN HOLDINGS INC2NEC CORP TOKYO OHKA KOGYO CO L1TOKYO OHIKA KOGYO CO LTD1
Top patents by PatentIndex Score
35 records- 0196US5795702APhotoresist stripping liquid compositions and a method of stripping photoresists using the sameTOKYO OHKA KOGYO CO LTD·Filed 1996·Granted Aug 18, 1998·165 cites·18 claims
- 0295US5792274ARemover solution composition for resist and method for removing resist using the sameTOKYO OHKA KOGYO CO LTD·Filed 1996·Granted Aug 11, 1998·121 cites·7 claims
- 0393US10128143B2Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin waferSHINETSU CHEMICAL CO·Filed 2015·Granted Nov 13, 2018·9 cites·15 claims
- 0492US5905063ARemover solution composition for resist and method for removing resist using the sameTOKYO OHKA KOGYO CO LTD·Filed 1998·Granted May 18, 1999·81 cites·7 claims
- 0591US9646868B2Wafer temporary bonding method and thin wafer manufacturing methodSHINETSU CHEMICAL CO·Filed 2015·Granted May 9, 2017·7 cites·13 claims
- 0689US5968848AProcess for treating a lithographic substrate and a rinse solution for the treatmentTOKYO OHKA KOGYO CO LTD·Filed 1997·Granted Oct 19, 1999·97 cites·12 claims
- 0788US9934996B2Wafer processing bonding arrangement, wafer laminate, and thin wafer manufacturing methodSHINETSU CHEMICAL CO·Filed 2016·Granted Apr 3, 2018·5 cites·12 claims
- 0886US9941145B2Wafer processing temporary bonding arrangement, wafer processing laminate, and thin wafer manufacturing methodSHINETSU CHEMICAL CO·Filed 2016·Granted Apr 10, 2018·4 cites·11 claims
- 0985US6261745B1Post-ashing treating liquid compositions and a process for treatment therewithTOKYO OHKA KOGYO CO LTD·Filed 1999·Granted Jul 17, 2001·71 cites·11 claims
- 1083US6218087B1Photoresist stripping liquid composition and a method of stripping photoresists using the sameTOKYO OHKA KOGYO CO LTD·Filed 2000·Granted Apr 17, 2001·23 cites·10 claims
- 1182US9884979B2Temporary adhesion method and method for producing thin waferSHINETSU CHEMICAL CO·Filed 2016·Granted Feb 6, 2018·3 cites·18 claims
- 1282US6291142B1Photoresist stripping liquid compositions and a method of stripping photoresists using the sameTOKYO OHKA KOGYO CO LTD·Filed 2000·Granted Sep 18, 2001·17 cites·3 claims
- 1382US6068000ASubstrate treatment methodTOKYO OHKA KOGYO CO LTD·Filed 1997·Granted May 30, 2000·62 cites·20 claims
- 1480US9263333B2Wafer processing laminate, wafer processing member, temporary adhering material for processing wafer, and manufacturing method of thin waferSHINETSU CHEMICAL CO·Filed 2013·Granted Feb 16, 2016·4 cites·21 claims
- 1577US6815151B2Rinsing solution for lithography and method for processing substrate with the use of the sameTOKYO OHIKA KOGYO CO LTD·Filed 2001·Granted Nov 9, 2004·19 cites·6 claims
- 1674US10242902B2Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin waferSHINETSU CHEMICAL CO·Filed 2015·Granted Mar 26, 2019·2 cites·15 claims
- 1773US11183417B2Method for manufacturing laminate and method for manufacturing substrateSHINETSU CHEMICAL CO·Filed 2019·Granted Nov 23, 2021·1 cites·18 claims
- 1865US6225034B1Photoresist stripping liquid compositions and a method of stripping photoresists using the sameTOKYO OHKA KOGYO CO LTD·Filed 1998·Granted May 1, 2001·20 cites·8 claims
- 1965US6136505ALiquid coating composition for use in forming antireflective film and photoresist material using said antireflective filmTOKYO OHKA KOGYO CO LTD·Filed 1999·Granted Oct 24, 2000·21 cites·7 claims
- 2064US9448468B2Reflective mask blank and reflective mask, and methods for manufacturing reflective mask blank and reflective maskTOPPAN PRINTING CO LTD·Filed 2014·Granted Sep 20, 2016·1 cites·8 claims
- 2164US9334424B2Temporary adhesive for wafer processing, member for wafer processing using the same, wafer processed body, and method for producing thin waferSHINETSU CHEMICAL CO·Filed 2013·Granted May 10, 2016·1 cites·20 claims
- 2264US6225030B1Post-ashing treating method for substratesTOKYO OHKA KOGYO CO LTD·Filed 1999·Granted May 1, 2001·22 cites·2 claims
- 2362US2024234280A1Substrate with support and semiconductor deviceTOPPAN HOLDINGS INC·Filed 2024·Application pending·0 cites
- 2459US2024224421A1Wiring board unit and method for designing the sameTOPPAN HOLDINGS INC·Filed 2024·Application pending·0 cites
- 2557US2023422412A1Multilayer wiring boardTOPPAN INC·Filed 2023·Application pending·0 cites
- 2655US6132928ACoating solution for forming antireflective coating filmTOKYO OHKA KOGYO CO LTD·Filed 1998·Granted Oct 17, 2000·14 cites·6 claims
- 2754US12187989B2Cleaning solution for temporary adhesive for substrates, substrate cleaning method, and cleaning method for support or substrateSHINETSU CHEMICAL CO·Filed 2020·Granted Jan 7, 2025·0 cites·4 claims
- 2854US12168759B2Detergent composition, substrate cleaning method, and cleaning method for support or substrateSHINETSU CHEMICAL CO·Filed 2020·Granted Dec 17, 2024·0 cites·3 claims
- 2950US10796939B2Temporary adhesive film roll for substrate processing, method for manufacturing thin waferSHINETSU CHEMICAL CO·Filed 2018·Granted Oct 6, 2020·0 cites·21 claims
- 3047US2022372353A1Temporary adhesive material for substrate processing and method for manufacturing laminateSHINETSU CHEMICAL CO·Filed 2020·Application pending·0 cites
- 3145US10950481B2Method for manufacturing thin substrateSHINETSU CHEMICAL CO·Filed 2019·Granted Mar 16, 2021·0 cites·5 claims
- 3244US2023178412A1Temporary adhesion method, device wafer processing method, laminate for temporary adhesion, and laminate for device wafer processingSHINETSU CHEMICAL CO·Filed 2021·Application pending·0 cites
- 3342US10147632B2Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin waferSHINETSU CHEMICAL CO·Filed 2016·Granted Dec 4, 2018·0 cites·19 claims
- 3442US9887118B2Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin waferSHINETSU CHEMICAL CO·Filed 2015·Granted Feb 6, 2018·0 cites·20 claims
- 3536US2002146647A1Composition of photoresist remover effective against etching residue without damage to corrodible metal layer and process using the sameNEC CORP TOKYO OHKA KOGYO CO L·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →