Inventor · disambiguated record
Chih-Kuang Yang
Also filed as: YANG CHIH-KUANG
31 granted patents·17 pending applications·256 citations·filing 2006–2019
96Inventor score
Top patents by PatentIndex Score
48 records- 0196US9256209B2Wristwatch structure, electronic core for wristwatch, and method for manufacturing wristwatchPRINCO MIDDLE EAST FZE·Filed 2014·Granted Feb 9, 2016·79 cites·37 claims
- 0296US9223296B2Wristwatch structure, electronic crown for wristwatch, and wristwatch having displayPRINCO MIDDLE EAST FZE·Filed 2014·Granted Dec 29, 2015·111 cites·16 claims
- 0395US8014164B2Hybrid structure of multi-layer substrates and manufacture method thereofPRINCO CORP·Filed 2011·Granted Sep 6, 2011·21 cites·4 claims
- 0484US7545042B2Structure combining an IC integrated substrate and a carrier, and method of manufacturing such structurePRINCO CORP·Filed 2006·Granted Jun 9, 2009·8 cites·11 claims
- 0579US10451654B2Probe card devicePRINCO CORP·Filed 2017·Granted Oct 22, 2019·3 cites·16 claims
- 0679US9182443B2Testing device and testing method thereofPRINCO MIDDLE EAST FZE·Filed 2013·Granted Nov 10, 2015·4 cites·28 claims
- 0776US10534219B2Array of point light sources contained within segmented reflective partitionsCORETRONIC CORP·Filed 2018·Granted Jan 14, 2020·1 cites·12 claims
- 0874US9379089B2Electrical system and core module thereofPRINCO MIDDLE EAST FZE·Filed 2014·Granted Jun 28, 2016·4 cites·46 claims
- 0974US9117792B2Chip thermal dissipation structurePRINCO MIDDLE EAST FZE·Filed 2013·Granted Aug 25, 2015·3 cites·10 claims
- 1073US8288246B2Structure combining an IC integrated substrate and a carrier, and method of manufacturing such structureYANG CHIH-KUANG·Filed 2011·Granted Oct 16, 2012·2 cites·12 claims
- 1171US8405223B2Multi-layer via structureYANG CHIH-KUANG·Filed 2011·Granted Mar 26, 2013·3 cites·16 claims
- 1269US7687312B2Method of manufacturing hybrid structure of multi-layer substratesPRINCO CORP·Filed 2007·Granted Mar 30, 2010·4 cites·16 claims
- 1368US8373070B2Metal structure of flexible multi-layer substrate and manufacturing method thereofPRINCO MIDDLE EAST FZE·Filed 2010·Granted Feb 12, 2013·2 cites·11 claims
- 1468US7993973B2Structure combining an IC integrated substrate and a carrier, and method of manufacturing such structurePRINCO CORP·Filed 2008·Granted Aug 9, 2011·2 cites·16 claims
- 1566US7948079B2Method of manufacturing hybrid structure of multi-layer substrates and hybrid structure thereofPRINCO CORP·Filed 2009·Granted May 24, 2011·2 cites·18 claims
- 1665US8023282B2Hybrid structure of multi-layer substrates and manufacture method thereofPRINCO CORP·Filed 2007·Granted Sep 20, 2011·2 cites·15 claims
- 1761US9107315B2Via structure in multi-layer substrateYANG CHIH-KUANG·Filed 2009·Granted Aug 11, 2015·1 cites·9 claims
- 1861US8278562B2Multi-layer substrate and manufacturing method thereofYANG CHIH-KUANG·Filed 2007·Granted Oct 2, 2012·1 cites·8 claims
- 1960US10622332B1Substrate separation system and methodPRINCO CORP·Filed 2019·Granted Apr 14, 2020·0 cites·10 claims
- 2058US8294039B2Surface finish structure of multi-layer substrate and manufacturing method thereofYANG CHIH-KUANG·Filed 2007·Granted Oct 23, 2012·3 cites·22 claims
- 2158US7931973B2Manufacturing method of metal structure in multi-layer substrate and structure thereofPRINCO CORP·Filed 2009·Granted Apr 26, 2011·0 cites·4 claims
- 2257US7947573B2Structure combining an IC integrated substrate and a carrier, and method of manufacturing such structurePRINCO CORP·Filed 2008·Granted May 24, 2011·0 cites·19 claims
- 2356US9398704B2Manufacturing method of metal structure of flexible multi-layer substrateYANG CHIH-KUANG·Filed 2012·Granted Jul 19, 2016·0 cites·10 claims
- 2455US7656679B2Multi-layer substrate and manufacture method thereofPRINCO CORP·Filed 2008·Granted Feb 2, 2010·0 cites·6 claims
- 2555US2009181496A1Multi-layer substrate and manufacture method thereofPRINCO CORP·Filed 2008·Application pending·0 cites
- 2653US9501153B2Time adjusting method and system for wristwatchPRINCO MIDDLE EAST FZE·Filed 2014·Granted Nov 22, 2016·0 cites·17 claims
- 2753US2008292892A1Manufacturing method of metal structure in multi-layer substrate and structure thereofPRINCO CORP·Filed 2007·Application pending·0 cites
- 2852US2008023811A1Structure combining an ic integrated substrate and a carrier, and method of manufacturing such structurePRINCO CORP·Filed 2006·Application pending·0 cites
- 2950US8111519B2Hybrid structure of multi-layer substrates and manufacture method thereofYANG CHIH-KUANG·Filed 2011·Granted Feb 7, 2012·0 cites·11 claims
- 3050US2015360447A1Barrier structureLIU TAJO·Filed 2013·Application pending·0 cites
- 3150US2015361249A1Barrier structureLIU TA-JO·Filed 2013·Application pending·0 cites
- 3249US8266797B2Method of manufacturing a multi-layer substrateYANG CHIH-KUANG·Filed 2011·Granted Sep 18, 2012·0 cites·9 claims
- 3349US2009208712A1Method to decrease warpage of multi-layer substrate and structure thereofPRINCO CORP·Filed 2008·Application pending·0 cites
- 3448US11221351B2Probe card devicePRINCO CORP·Filed 2019·Granted Jan 11, 2022·0 cites·10 claims
- 3548US2012107745A1Via structure in multi-layer substrate and manufacturing method thereofYANG CHIH-KUANG·Filed 2012·Application pending·0 cites
- 3646US9362199B2Chip thermal dissipation structurePRINCO MIDDLE EAST FZE·Filed 2015·Granted Jun 7, 2016·0 cites·8 claims
- 3745US8051557B2Substrate with multi-layer interconnection structure and method of manufacturing the samePRINCO CORP·Filed 2008·Granted Nov 8, 2011·0 cites·13 claims
- 3845US2007145587A1Substrate with multi-layer interconnection structure and method of manufacturing the samePRINCO CORP·Filed 2006·Application pending·0 cites
- 3945US2010104889A1Method to decrease warpage of multi-layer substrate and structure thereofPRINCO CORP·Filed 2010·Application pending·0 cites
- 4044US2011212307A1Method to decrease warpage of a multi-layer substrate and structure thereofPRINCO CORP·Filed 2011·Application pending·0 cites
- 4144US2011212257A1Method to decrease warpage of a multi-layer substrate and structure thereofPRINCO CORP·Filed 2011·Application pending·0 cites
- 4243US8815333B2Manufacturing method of metal structure in multi-layer substrateYANG CHIH-KUANG·Filed 2012·Granted Aug 26, 2014·0 cites·21 claims
- 4341US2014167255A1Package structure and package methodPRINCO MIDDLE EAST FZE·Filed 2013·Application pending·0 cites
- 4440US2010027869A1Optical Carriage Structure of Inspection Apparatus and its Inspection MethodSHANGHAI MICROTEK TECHNOLOGY C·Filed 2008·Application pending·0 cites
- 4539US2017060268A1Device for integrating position, attitude, and wireless transmissionPRINCO CORP·Filed 2016·Application pending·0 cites
- 4638US2015323906A1Timepiece and power saving method thereofPRINCO MIDDLE EAST FZE·Filed 2015·Application pending·0 cites
- 4737US2016091864A1Wristwatch structure with physical hands and method for offering communication function to wristwatchPRINCO MIDDLE EAST FZE·Filed 2015·Application pending·0 cites
- 4835US2016126110A1Method for manufacturing three-dimensional integrated circuitPRINCO CORP·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →