Inventor · disambiguated record
Ludwig Heitzer
Also filed as: HEITZER LUDWIG
22 granted patents·8 pending applications·137 citations·filing 2006–2025
93Inventor score
Files withINFINEON TECHNOLOGIES AG20BAUER MICHAEL4INFINEON TECHNOLOGIES AUSTRIA AG2MEYER THORSTEN2CYPRESS SEMICONDUCTOR CORP1
Top patents by PatentIndex Score
30 records- 0198US10043768B2Semiconductor device and method of manufacture thereofINFINEON TECHNOLOGIES AG·Filed 2015·Granted Aug 7, 2018·46 cites·17 claims
- 0296US7683460B2Module with a shielding and/or heat dissipating elementINFINEON TECHNOLOGIES AG·Filed 2006·Granted Mar 23, 2010·54 cites·29 claims
- 0394US12158448B2Radiation source deviceINFINEON TECHNOLOGIES AG·Filed 2022·Granted Dec 3, 2024·2 cites·20 claims
- 0488US8421226B2Device including an encapsulated semiconductor chip and manufacturing method thereofMEYER THORSTEN·Filed 2010·Granted Apr 16, 2013·10 cites·24 claims
- 0581US9881909B2Method for attaching a semiconductor die to a carrierINFINEON TECHNOLOGIES AG·Filed 2015·Granted Jan 30, 2018·4 cites·10 claims
- 0681US2025060338A1Radiation source deviceINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0778US7714416B2Electronic circuit in a package-in-package configuration and production methodINFINEON TECHNOLOGIES AG·Filed 2007·Granted May 11, 2010·8 cites·19 claims
- 0873US8173488B2Electronic device and method of manufacturing sameBAUER MICHAEL·Filed 2008·Granted May 8, 2012·6 cites·16 claims
- 0972US12405202B2Semiconductor device for particle measurement and method for operating the semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2023·Granted Sep 2, 2025·0 cites·18 claims
- 1063US9030019B2Semiconductor device and method of manufacture thereofMEYER THORSTEN·Filed 2010·Granted May 12, 2015·1 cites·21 claims
- 1162US7547645B2Method for coating a structure comprising semiconductor chipsINFINEON TECHNOLOGIES AG·Filed 2006·Granted Jun 16, 2009·2 cites·16 claims
- 1261US7470601B2Semiconductor device with semiconductor chip and adhesive film and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2006·Granted Dec 30, 2008·3 cites·6 claims
- 1357US8330260B2Electronic component of VQFN design and method for producing the sameBAUER MICHAEL·Filed 2007·Granted Dec 11, 2012·1 cites·23 claims
- 1457US2025329546A1Lead frame and clip frame for molded semiconductor packages, and related methods of manufacturingINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 1555US2024413094A1Semiconductor die shielding structureCYPRESS SEMICONDUCTOR CORP·Filed 2023·Application pending·0 cites
- 1654US2024030200A1Semiconductor package and methodINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Application pending·0 cites
- 1753US12283538B2Molded semiconductor package having an embedded inlayINFINEON TECHNOLOGIES AG·Filed 2022·Granted Apr 22, 2025·0 cites·17 claims
- 1851US9576935B2Method for fabricating a semiconductor package and semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2014·Granted Feb 21, 2017·0 cites·12 claims
- 1951US7749864B2Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chipINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jul 6, 2010·0 cites·22 claims
- 2050US7294916B2Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chipINFINEON TECHNOLOGIES AG·Filed 2006·Granted Nov 13, 2007·0 cites·11 claims
- 2150US2025343153A1Transistor package with areal internal interconnectINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2025·Application pending·0 cites
- 2249US7834460B2Method for manufacturing an electronic component and corresponding electronic componentINFINEON TECHNOLOGIES AG·Filed 2007·Granted Nov 16, 2010·0 cites·9 claims
- 2348US7662664B2Electronic circuit in a package-on-package configuration and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted Feb 16, 2010·0 cites·13 claims
- 2446US10424819B2Semiconductor battery and semiconductor device including a semiconductor batteryINFINEON TECH DRESDEN GMBH & CO KG·Filed 2017·Granted Sep 24, 2019·0 cites·13 claims
- 2545US7592236B2Method for applying a structure of joining material to the back surfaces of semiconductor chipsINFINEON TECHNOLOGIES AG·Filed 2006·Granted Sep 22, 2009·0 cites·14 claims
- 2644US2008029865A1Electronic Device and Method For Producing the SameINFINEON TECHNOLOGIES AG·Filed 2007·Application pending·0 cites
- 2742US2008079175A1Layer for chip contact elementBAUER MICHAEL·Filed 2006·Application pending·0 cites
- 2842US2008054451A1Multi-chip assemblyBAUER MICHAEL·Filed 2006·Application pending·0 cites
- 2941US7919857B2Plastic housing and semiconductor component with said plastic housingINFINEON TECHNOLOGIES AG·Filed 2007·Granted Apr 5, 2011·0 cites·16 claims
- 3040US10571682B2Tilted chip assembly for optical devicesINFINEON TECHNOLOGIES AG·Filed 2017·Granted Feb 25, 2020·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →