Inventor · disambiguated record
David L. Questad
Also filed as: QUESTAD DAVID · QUESTAD DAVID L · QUESTAD DAVID LEE
68 granted patents·5 pending applications·517 citations·filing 1995–2019
99Inventor score
Top patents by PatentIndex Score
73 records- 0196US8522430B2Clustered stacked vias for reliable electronic substratesKACKER KARAN·Filed 2012·Granted Sep 3, 2013·37 cites·8 claims
- 0296US8508043B2Metal pad structure for thickness enhancement of polymer used in electrical interconnection of semiconductor die to semiconductor chip package substrate with solder bumpDAUBENSPECK TIMOTHY H·Filed 2011·Granted Aug 13, 2013·24 cites·19 claims
- 0390US8227918B2Robust FBEOL and UBM structure of C4 interconnectsLU MINHUA·Filed 2009·Granted Jul 24, 2012·21 cites·4 claims
- 0490US7812438B2Via offsetting to reduce stress under the first level interconnect (FLI) in microelectronics packagingIBM·Filed 2008·Granted Oct 12, 2010·21 cites·11 claims
- 0590US7439170B1Design structure for final via designs for chip stress reductionIBM·Filed 2008·Granted Oct 21, 2008·16 cites·1 claims
- 0689US8637392B2Solder interconnect with non-wettable sidewall pillars and methods of manufactureARVIN CHARLES L·Filed 2010·Granted Jan 28, 2014·9 cites·23 claims
- 0788US8198133B2Structures and methods to improve lead-free C4 interconnect reliabilityDAUBENSPECK TIMOTHY H·Filed 2009·Granted Jun 12, 2012·16 cites·12 claims
- 0888US7795724B2Sandwiched organic LGA structureIBM·Filed 2007·Granted Sep 14, 2010·16 cites·12 claims
- 0988US6979782B1Apparatus and method for mechanical coupling of land grid array applicationsIBM·Filed 2005·Granted Dec 27, 2005·15 cites·19 claims
- 1087US9883612B2Heat sink attachment on existing heat sinksIBM·Filed 2015·Granted Jan 30, 2018·5 cites·17 claims
- 1186US7859122B2Final via structures for bond pad-solder ball interconnectionsIBM·Filed 2008·Granted Dec 28, 2010·14 cites·14 claims
- 1286US7256503B2Chip underfill in flip-chip technologiesIBM·Filed 2006·Granted Aug 14, 2007·14 cites·20 claims
- 1385US6650010B2Unique feature design enabling structural integrity for advanced low K semiconductor chipsIBM·Filed 2002·Granted Nov 18, 2003·42 cites·13 claims
- 1484US6074895AMethod of forming a flip chip assemblyIBM·Filed 1997·Granted Jun 13, 2000·63 cites·14 claims
- 1583US8927334B2Overcoming chip warping to enhance wetting of solder bumps and flip chip attaches in a flip chip packageIBM·Filed 2012·Granted Jan 6, 2015·7 cites·8 claims
- 1682US8338286B2Dimensionally decoupled ball limiting metalurgyPERFECTO ERIC DAVID·Filed 2010·Granted Dec 25, 2012·10 cites·15 claims
- 1782US8054630B2Electronic components on trenched substrates and method of forming sameIBM·Filed 2008·Granted Nov 8, 2011·6 cites·12 claims
- 1881US7875502B2Semiconductor chips with crack stop regions for reducing crack propagation from chip edges/cornersIBM·Filed 2010·Granted Jan 25, 2011·5 cites·9 claims
- 1980US9627784B1Method and apparatus for strain relieving surface mount attached connectorsIBM·Filed 2015·Granted Apr 18, 2017·2 cites·10 claims
- 2080US8450849B2Robust FBEOL and UBM structure of C4 interconnectsLU MINHUA·Filed 2012·Granted May 28, 2013·5 cites·24 claims
- 2180US7319591B2Optimized thermally conductive plate and attachment method for enhanced thermal performance and reliability of flip chip organic packagesIBM·Filed 2005·Granted Jan 15, 2008·7 cites·10 claims
- 2279US10342160B2Heat sink attachment on existing heat sinksIBM·Filed 2017·Granted Jul 2, 2019·2 cites·20 claims
- 2379US7855430B2Electronic components on trenched substrates and method of forming sameIBM·Filed 2008·Granted Dec 21, 2010·4 cites·6 claims
- 2479US7777301B2Electronic components on trenched substrates and method of forming sameIBM·Filed 2008·Granted Aug 17, 2010·4 cites·9 claims
- 2579US7545050B1Design structure for final via designs for chip stress reductionINTERNAT BUSINESS MACHIENS COR·Filed 2008·Granted Jun 9, 2009·7 cites·1 claims
- 2678US8957531B2Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivityBERNIER WILLIAM E·Filed 2011·Granted Feb 17, 2015·4 cites·17 claims
- 2777US7732894B2Electronic components on trenched substrates and method of forming sameIBM·Filed 2008·Granted Jun 8, 2010·4 cites·20 claims
- 2876US8298929B2Offset solder vias, methods of manufacturing and design structuresDAUBENSPECK TIMOTHY H·Filed 2010·Granted Oct 30, 2012·4 cites·6 claims
- 2975US7059049B2Electronic package with optimized lamination processIBM·Filed 2002·Granted Jun 13, 2006·15 cites·14 claims
- 3072US8659119B2Electronic components on trenched substrates and method of forming sameKHARMA VIJAYESHWAR D·Filed 2010·Granted Feb 25, 2014·3 cites·20 claims
- 3171US9018760B2Solder interconnect with non-wettable sidewall pillars and methods of manufactureIBM·Filed 2013·Granted Apr 28, 2015·2 cites·13 claims
- 3270US10014273B2Fixture to constrain laminate and method of assemblyIBM·Filed 2016·Granted Jul 3, 2018·1 cites·20 claims
- 3369US8242593B2Clustered stacked vias for reliable electronic substratesKACKER KARAN·Filed 2008·Granted Aug 14, 2012·4 cites·8 claims
- 3466US10368441B2Method and apparatus for strain relieving surface mount attached connectorsIBM·Filed 2018·Granted Jul 30, 2019·1 cites·20 claims
- 3566US8037594B2Method of forming a flip-chip packageIBM·Filed 2008·Granted Oct 18, 2011·2 cites·14 claims
- 3666US7489512B2Optimized thermally conductive plate and attachment method for enhanced thermal performance and reliability of flip chip organic packagesIBM·Filed 2007·Granted Feb 10, 2009·2 cites·13 claims
- 3766US6815346B2Unique feature design enabling structural integrity for advanced low k semiconductor chipsIBM·Filed 2003·Granted Nov 9, 2004·13 cites·7 claims
- 3866US6306683B1Method of forming a flip chip assembly, and a flip chip assembly formed by the methodIBM·Filed 2000·Granted Oct 23, 2001·16 cites·42 claims
- 3962US7868459B2Semiconductor package having non-aligned active viasIBM·Filed 2006·Granted Jan 11, 2011·2 cites·7 claims
- 4062US7329816B2Electronic package with optimized lamination processIBM·Filed 2005·Granted Feb 12, 2008·2 cites·9 claims
- 4161US7312523B2Enhanced via structure for organic module performanceIBM·Filed 2005·Granted Dec 25, 2007·2 cites·20 claims
- 4260US7732932B2Semiconductor chips with crack stop regions for reducing crack propagation from chip edges/cornersIBM·Filed 2007·Granted Jun 8, 2010·1 cites·31 claims
- 4359US9974179B2Method and apparatus for strain relieving surface mount attached connectorsIBM·Filed 2017·Granted May 15, 2018·0 cites·6 claims
- 4459US9508789B2Electronic components on trenched substrates and method of forming sameGLOBALFOUNDRIES INC·Filed 2014·Granted Nov 29, 2016·0 cites·20 claims
- 4559US6226187B1Integrated circuit packageIBM·Filed 1999·Granted May 1, 2001·21 cites·16 claims
- 4658US9899279B2Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivityIBM·Filed 2014·Granted Feb 20, 2018·0 cites·10 claims
- 4758US7674637B2Monitoring cool-down stress in a flip chip process using monitor solder bump structuresIBM·Filed 2007·Granted Mar 9, 2010·1 cites·12 claims
- 4858US6348738B1Flip chip assemblyIBM·Filed 1999·Granted Feb 19, 2002·17 cites·7 claims
- 4957US9455234B2Fixture to constrain laminate and method of assemblyIBM·Filed 2014·Granted Sep 27, 2016·0 cites·17 claims
- 5057US9099458B2Construction of reliable stacked via in electronic substrates—vertical stiffness control methodKACKER KARAN·Filed 2012·Granted Aug 4, 2015·0 cites·13 claims
Showing the top 50 of 73 patent records by PatentIndex Score.
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