Assignee
KACKER KARAN
US·6 granted patents·42 citations·filing 2008–2012
Top patents by PatentIndex Score
6 records- 0196US8522430B2Clustered stacked vias for reliable electronic substratesKACKER KARAN·Filed 2012·Granted Sep 3, 2013·37 cites·8 claims
- 0269US8242593B2Clustered stacked vias for reliable electronic substratesKACKER KARAN·Filed 2008·Granted Aug 14, 2012·4 cites·8 claims
- 0357US9099458B2Construction of reliable stacked via in electronic substrates—vertical stiffness control methodKACKER KARAN·Filed 2012·Granted Aug 4, 2015·0 cites·13 claims
- 0457US8866026B2Construction of reliable stacked via in electronic substrates—vertical stiffness control methodKACKER KARAN·Filed 2012·Granted Oct 21, 2014·0 cites·11 claims
- 0555US8258410B2Construction of reliable stacked via in electronic substrates—vertical stiffness control methodKACKER KARAN·Filed 2008·Granted Sep 4, 2012·0 cites·4 claims
- 0655US8206160B2Compliant off-chip interconnects for use in electronic packagesKACKER KARAN·Filed 2008·Granted Jun 26, 2012·1 cites·15 claims
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