Inventor · disambiguated record
Mohammad Khan
Also filed as: KHAN MOHAMMAD · KHAN MOHAMMAD Z · KHAN MOHAMMAD ZUBAIR
21 granted patents·1 pending application·242 citations·filing 1993–2010
95Inventor score
Files withADVANCED MICRO DEVICES INC16LIGHTWAVE MICROSYSTEMS CORP2INTEL CORP1KHAN MOHAMMAD1LIM KEVIN W1
Top patents by PatentIndex Score
22 records- 0187US7544542B2Reduction of damage to thermal interface material due to asymmetrical loadADVANCED MICRO DEVICES INC·Filed 2006·Granted Jun 9, 2009·16 cites·18 claims
- 0283US7513035B2Method of integrated circuit packagingADVANCED MICRO DEVICES INC·Filed 2006·Granted Apr 7, 2009·13 cites·16 claims
- 0377US6382500B1Solder reflow furnace with flux effluent collector and method of preventing flux contaminationADVANCED MICRO DEVICES INC·Filed 2000·Granted May 7, 2002·33 cites·22 claims
- 0476US7633151B2Integrated circuit package lid with a wetting filmADVANCED MICRO DEVICES INC·Filed 2007·Granted Dec 15, 2009·7 cites·42 claims
- 0572US6417563B1Spring frame for protecting packaged electronic devicesADVANCED MICRO DEVICES INC·Filed 2000·Granted Jul 9, 2002·19 cites·25 claims
- 0668US6671450B2Apparatus and method to metallize, reinforce, and hermetically seal multiple optical fibersLIGHTWAVE MICROSYSTEMS CORP·Filed 2001·Granted Dec 30, 2003·14 cites·44 claims
- 0764US8232138B2Circuit board with notched stiffener frameLIM KEVIN W·Filed 2010·Granted Jul 31, 2012·2 cites·20 claims
- 0864US6617195B1Method of reflowing organic packages using no-clean fluxADVANCED MICRO DEVICES INC·Filed 2000·Granted Sep 9, 2003·12 cites·14 claims
- 0964US6409070B1Minimizing flux residue by controlling amount of moisture during reflowADVANCED MICRO DEVICES INC·Filed 2000·Granted Jun 25, 2002·14 cites·14 claims
- 1062US7923850B2Semiconductor chip with solder joint protection ringADVANCED MICRO DEVICES INC·Filed 2008·Granted Apr 12, 2011·2 cites·23 claims
- 1157US6103549ANo clean flux for flip chip assemblyADVANCED MICRO DEVICES INC·Filed 1998·Granted Aug 15, 2000·23 cites·6 claims
- 1257US5572692AMemory configuration decoding system having automatic row base address generation mechanism for variable memory devices with row access interleavingINTEL CORP·Filed 1993·Granted Nov 5, 1996·31 cites·9 claims
- 1356US6857790B2Apparatus and method to vertically route and connect multiple optical fibersLIGHTWAVE MICROSYSTEMS CORP·Filed 2001·Granted Feb 22, 2005·5 cites·38 claims
- 1455US6371310B1Boat for land grid array packagesADVANCED MICRO DEVICES INC·Filed 2000·Granted Apr 16, 2002·7 cites·16 claims
- 1555US5988485AFlux cleaning for flip chip technology using environmentally friendly solventsADVANCED MICRO DEVICES INC·Filed 1998·Granted Nov 23, 1999·21 cites·5 claims
- 1653US6722553B2Controlled and programmed deposition of flux on a flip-chip die by sprayingADVANCED MICRO DEVICES INC·Filed 2001·Granted Apr 20, 2004·5 cites·10 claims
- 1752US6488158B1Boat for organic and ceramic flip chip package assemblyADVANCED MICRO DEVICES INC·Filed 2000·Granted Dec 3, 2002·5 cites·16 claims
- 1850US8297986B2Integrated circuit socketTOO SEAH SUN·Filed 2007·Granted Oct 30, 2012·3 cites·28 claims
- 1944US2010015762A1Solder InterconnectKHAN MOHAMMAD·Filed 2008·Application pending·0 cites
- 2036US6812570B2Organic packages having low tin solder connectionsADVANCED MICRO DEVICES INC·Filed 2002·Granted Nov 2, 2004·0 cites·17 claims
- 2136US6208027B1Temporary interconnect for semiconductor devicesADVANCED MICRO DEVICES INC·Filed 1999·Granted Mar 27, 2001·5 cites·10 claims
- 2235US6098867AAutomated brush fluxing system for application of controlled amount of flux to packagesADVANCED MICRO DEVICES INC·Filed 1998·Granted Aug 8, 2000·5 cites·7 claims
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