Inventor · disambiguated record
Cheng-Feng Liao
Also filed as: LIAO CHENG-FENG
7 granted patents·7 pending applications·13 citations·filing 2011–2019
72Inventor score
Files withHEWLETT PACKARD DEVELOPMENT CO11HEWLETT PACKARD DEVELOPMENT CO LP1IND TECH RES INST1LIAO SHENG-JU1
Top patents by PatentIndex Score
14 records- 0191US10234905B2Hinge for foldable componentsHEWLETT PACKARD DEVELOPMENT CO·Filed 2015·Granted Mar 19, 2019·13 cites·14 claims
- 0256US2013231421A1Starch-based thermoplastic compositesIND TECH RES INST·Filed 2013·Application pending·0 cites
- 0354US10401911B2Ceramic housingHEWLETT PACKARD DEVELOPMENT CO·Filed 2014·Granted Sep 3, 2019·0 cites·27 claims
- 0453US11046058B2Composite materialHEWLETT PACKARD DEVELOPMENT CO·Filed 2015·Granted Jun 29, 2021·0 cites·10 claims
- 0553US2021394233A1Printed foam panels for electronic devicesHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Application pending·0 cites
- 0652US10462920B2Polymer fiber compositeHEWLETT PACKARD DEVELOPMENT CO·Filed 2014·Granted Oct 29, 2019·0 cites·14 claims
- 0751US2017182737A1Opaque-plastic film on a fiber surfaceHEWLETT PACKARD DEVELOPMENT CO LP·Filed 2014·Application pending·0 cites
- 0849US2012059097A1Starch-based thermoplastic compositesLIAO SHENG-JU·Filed 2011·Application pending·0 cites
- 0948US11090909B2Forming metal compositesHEWLETT PACKARD DEVELOPMENT CO·Filed 2015·Granted Aug 17, 2021·0 cites·15 claims
- 1045US11301004B2Reducing degradation of Wi-Fi signals for computersHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Apr 12, 2022·0 cites·19 claims
- 1142US2020409437A1Heat dissipating elementsHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Application pending·0 cites
- 1241US10331165B2Hinge assembly including an elastomer memberHEWLETT PACKARD DEVELOPMENT CO·Filed 2014·Granted Jun 25, 2019·0 cites·10 claims
- 1339US2021126308A1Electronic device(s)HEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Application pending·0 cites
- 1434US2018327925A1Anodization involving a lubricantHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →