Inventor · disambiguated record
Jurgen Burggraf
Also filed as: BURGGRAF JUERGEN · BURGGRAF JURGEN · BURGGRAF JÜRGEN
27 granted patents·15 pending applications·60 citations·filing 2010–2024
94Inventor score
Top patents by PatentIndex Score
42 records- 0192US9381732B2Device for stripping a product substrate from a carrier substrateEV GROUP GMBH·Filed 2014·Granted Jul 5, 2016·9 cites·4 claims
- 0292US9296193B2Bendable carrier mount, device and method for releasing a carrier substrateBURGGRAF JÜRGEN·Filed 2011·Granted Mar 29, 2016·22 cites·22 claims
- 0390US10468286B2Method for the bonding and debonding of substratesEV GROUP E THALLNER GMBH·Filed 2016·Granted Nov 5, 2019·8 cites·6 claims
- 0481US8918989B2Device for aligning and pre-fixing a waferBURGGRAF JÜRGEN·Filed 2010·Granted Dec 30, 2014·6 cites·8 claims
- 0580US12103787B2Method and device for transferring componentsEV GROUP E THALLNER GMBH·Filed 2020·Granted Oct 1, 2024·1 cites·13 claims
- 0679US8894807B2Device and method for detaching a semiconductor wafer from a substrateLINDNER FRIEDRICH PAUL·Filed 2010·Granted Nov 25, 2014·3 cites·13 claims
- 0777US9272501B2Device for detaching a product substrate off a carrier substrateBURGGRAF JÜRGEN·Filed 2011·Granted Mar 1, 2016·3 cites·20 claims
- 0876US2025151481A1Shape-adaptive display assemblyGOOGLE LLC·Filed 2024·Application pending·0 cites
- 0975US2024417189A1Method and device for transferring componentsEV GROUP E THALLNER GMBH·Filed 2024·Application pending·0 cites
- 1073US11024530B2Method for the bonding and debonding of substratesEV GROUP E THALLNER GMBH·Filed 2019·Granted Jun 1, 2021·1 cites·7 claims
- 1173US2025280627A1Methods for led transfer in micro-led displaysGOOGLE LLC·Filed 2024·Application pending·0 cites
- 1270US12087726B2Device and method for joining substratesEV GROUP E THALLNER GMBH·Filed 2019·Granted Sep 10, 2024·1 cites·12 claims
- 1366US9806054B2Flexible substrate holder, device and method for detaching a first substrateWIMPLINGER MARKUS·Filed 2011·Granted Oct 31, 2017·2 cites·20 claims
- 1466US9390956B2Method for the temporary connection of a product substrate to a carrier substrateEV GROUP E THALLNER GMBH·Filed 2013·Granted Jul 12, 2016·2 cites·8 claims
- 1563US9278433B2Receiving device for receiving semiconductor substratesTIEFENBÖCK HERBERT·Filed 2010·Granted Mar 8, 2016·2 cites·10 claims
- 1661US9186877B2Method for stripping a product substrate from a carrier substrateEV GROUP GMBH·Filed 2014·Granted Nov 17, 2015·0 cites·18 claims
- 1760US9929124B2Method for bonding substratesEV GROUP E THALLNER GMBH·Filed 2014·Granted Mar 27, 2018·0 cites·6 claims
- 1858US8986496B2Device and method for stripping a product substrate from a carrier substrateEV GROUP GMBH·Filed 2013·Granted Mar 24, 2015·0 cites·6 claims
- 1956US9381729B2Device for detaching a product substrate off a carrier substrateEV GROUP GMBH·Filed 2013·Granted Jul 5, 2016·0 cites·7 claims
- 2055US12482678B2Apparatus with deformable heater and method for heating a substrate thereofEV GROUP E THALLNER GMBH·Filed 2019·Granted Nov 25, 2025·0 cites·20 claims
- 2155US2017145176A1Method for application of a silicon dioxide layerEV GROUP E THALLNER GMBH·Filed 2014·Application pending·0 cites
- 2254US9449863B2Device for aligning and pre-fixing a waferEV GROUP GMBH·Filed 2014·Granted Sep 20, 2016·0 cites·10 claims
- 2353US9457552B2Method for detaching a product substrate off a carrier substrateEV GROUP GMBH·Filed 2015·Granted Oct 4, 2016·0 cites·42 claims
- 2452US2023347637A1Carrier substrate, method for producing a carrier substrate, and method for transferring a transfer layer from a carrier substrate to a product substrateEV GROUP E THALLNER GMBH·Filed 2020·Application pending·0 cites
- 2551US2024395576A1Method and device for transferring and preparing componentsEV GROUP E THALLNER GMBH·Filed 2021·Application pending·0 cites
- 2649US2024387270A1Method and device for producing and preparing electronic componentsEV GROUP E THALLNER GMBH·Filed 2021·Application pending·0 cites
- 2749US2025153481A1Method and substrate system for the separation of carrier substratesEV GROUP E THALLNER GMBH·Filed 2022·Application pending·0 cites
- 2848US2025125152A1Method and device for compensating for distortionsEV GROUP E THALLNER GMBH·Filed 2021·Application pending·0 cites
- 2947US10943810B2Device and method for bondingEV GROUP E THALLNER GMBH·Filed 2013·Granted Mar 9, 2021·0 cites·18 claims
- 3047US10272660B2Bendable carrier mount, device and method for releasing a carrier substrateEV GROUP E THALLNER GMBH·Filed 2015·Granted Apr 30, 2019·0 cites·10 claims
- 3146US9245869B2Method for fastening chips with a contact element onto a substrate provided with a functional layer having openings for the chip contact elementsEV GROUP E THALLNER GMBH·Filed 2013·Granted Jan 26, 2016·0 cites·21 claims
- 3243US2015047784A1Method for applying a temporary bonding layerEV GROUP E THALLNER GMBH·Filed 2013·Application pending·0 cites
- 3341US2018169907A1Method for producing of structures on a substrate surfaceEV GROUP E THALLNER GMBH·Filed 2015·Application pending·0 cites
- 3440US9362154B2Method for treatment of a temporarily bonded product waferBURGGRAF JÜRGEN·Filed 2010·Granted Jun 7, 2016·0 cites·15 claims
- 3539US9984942B2Method and device for leveling a substrate stackEV GROUP E THALLNER GMBH·Filed 2015·Granted May 29, 2018·0 cites·19 claims
- 3638US2014360666A1Method and device for bonding of substratesBURGGRAF JÜRGEN·Filed 2011·Application pending·0 cites
- 3737US9500541B2Method and device for determining the pressure distribution for bondingREBHAN BERNHARD·Filed 2011·Granted Nov 22, 2016·0 cites·13 claims
- 3835US9224630B2Method for producing a wafer provided with chipsBURGGRAF JÜRGEN·Filed 2010·Granted Dec 29, 2015·0 cites·19 claims
- 3933US2018022079A1Method and device for detaching a substrate from a substrate stackEV GROUP E THALLNER GMBH·Filed 2015·Application pending·0 cites
- 4032US10497601B2Device and method for coating of a carrier waferBURGGRAF JUERGEN·Filed 2011·Granted Dec 3, 2019·0 cites·5 claims
- 4130US2013288454A1Method for separating a product substrate from a carrier substrateBURGGRAF JUERGEN·Filed 2011·Application pending·0 cites
- 4229US2015047783A1Pressure transfer plate for pressure transfer of a bonding pressureBURGGRAF JURGEN·Filed 2012·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →