Inventor · disambiguated record
Hideki Yuzawa
Also filed as: YUZAWA HIDEKI
18 granted patents·9 pending applications·201 citations·filing 1997–2010
93Inventor score
Top patents by PatentIndex Score
27 records- 0191US6335568B1Semiconductor device and method of fabrication thereof, circuit board, and electronic equipmentSEIKO EPSON CORP·Filed 1999·Granted Jan 1, 2002·114 cites·20 claims
- 0286US7230338B2Semiconductor device that improves electrical connection reliabilitySEIKO EPSON CORP·Filed 2005·Granted Jun 12, 2007·14 cites·7 claims
- 0377US7872358B2Semiconductor chip and semiconductor device, and method for manufacturing semiconductor deviceSEIKO EPSON CORP·Filed 2010·Granted Jan 18, 2011·3 cites·1 claims
- 0471US7081590B2Wiring board and method of fabricating tape-like wiring substrateSEIKO EPSON CORP·Filed 2003·Granted Jul 25, 2006·18 cites·8 claims
- 0571US6551918B2Semiconductor device and method of fabrication thereof, circuit board, and electronic equipmentSEIKO EPSON CORP·Filed 2001·Granted Apr 22, 2003·15 cites·22 claims
- 0670US7525200B2Semiconductor chip and semiconductor device, and method for manufacturing semiconductor deviceSEIKO EPSON CORP·Filed 2006·Granted Apr 28, 2009·3 cites·1 claims
- 0764US7144758B2Manufacturing method of semiconductor device, including differently spaced bump electrode arraysSEIKO EPSON CORP·Filed 2004·Granted Dec 5, 2006·12 cites·2 claims
- 0862US7560814B2Semiconductor device that improves electrical connection reliabilitySEIKO EPSON CORP·Filed 2007·Granted Jul 14, 2009·2 cites·12 claims
- 0955US7786598B2Semiconductor chip and semiconductor device, and method for manufacturing semiconductor deviceSEIKO EPSON CORP·Filed 2009·Granted Aug 31, 2010·0 cites·1 claims
- 1054US6905915B2Semiconductor device and method of manufacturing the same, and electronic instrumentSEIKO EPSON CORP·Filed 2003·Granted Jun 14, 2005·6 cites·20 claims
- 1153US7598730B2Semiconductor wafer examination method and semiconductor chip manufacturing methodSEIKO EPSON CORP·Filed 2007·Granted Oct 6, 2009·0 cites·30 claims
- 1253US7573256B2Semiconductor wafer examination method and semiconductor chip manufacturing methodSEIKO EPSON CORP·Filed 2007·Granted Aug 11, 2009·0 cites·29 claims
- 1353US6731511B2Wiring board, method of manufacturing the same, electronic component, and electronic instrumentSEIKO EPSON CORP·Filed 2003·Granted May 4, 2004·4 cites·14 claims
- 1452US7279794B2Semiconductor device and electronic device, and methods for manufacturing thereofSEIKO EPSON CORP·Filed 2004·Granted Oct 9, 2007·5 cites·18 claims
- 1550US2007018675A1Semiconductor wafer examination method and semiconductor chip manufacturing methodSEIKO EPSON CORP·Filed 2006·Application pending·0 cites
- 1649US2009035929A1Method of manufacturing semiconductor deviceSEIKO EPSON CORP·Filed 2007·Application pending·0 cites
- 1746US7208840B2Semiconductor module, electronic device and electronic equipment, and method for manufacturing semiconductor moduleSEIKO EPSON CORP·Filed 2004·Granted Apr 24, 2007·2 cites·12 claims
- 1846US7154187B2Semiconductor chip and semiconductor device, and method for manufacturing semiconductor deviceSEIKO EPSON CORP·Filed 2004·Granted Dec 26, 2006·1 cites·1 claims
- 1945US2005272243A1Method of manufacturing semiconductor deviceSEIKO EPSON CORP·Filed 2005·Application pending·0 cites
- 2044US8338965B2Semiconductor chip and semiconductor device, and method for manufacturing semiconductor deviceYUZAWA HIDEKI·Filed 2010·Granted Dec 25, 2012·0 cites·2 claims
- 2138US2003145947A1Semiconductor device, method of manufacturing the same, manufacturing apparatus for the same, and electronic instrumentSEIKO EPSON CORP·Filed 2003·Application pending·0 cites
- 2238US2005127522A1Semiconductor device and electronic device, as well as method for manufacturing the sameFiled 2004·Application pending·0 cites
- 2338US2005011068A1Semiconductor manufacturing apparatus, and method for manufacturing semiconductor deviceFiled 2004·Application pending·0 cites
- 2437US2005012224A1Semiconductor device, semiconductor module, electronic device and electronic equipment, and method for manufacturing semiconductor moduleFiled 2004·Application pending·0 cites
- 2537US2003159282A1Wiring board and method of fabricating the same, semiconductor device, and electronic instrumentSEIKO EPSON CORP·Filed 2003·Application pending·0 cites
- 2637US2005006791A1Semiconductor device, manufacturing method thereof, electronic device, electronic equipmentFiled 2004·Application pending·0 cites
- 2731US6040093AMethod and transferring conductor patterns to a film carrier, and masks and film carriers to be used thereforSEIKO EPSON CORP·Filed 1997·Granted Mar 21, 2000·2 cites·20 claims
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