Inventor · disambiguated record
Paul Forderhase
Also filed as: FORDERHASE PAUL · FORDERHASE PAUL F
15 granted patents·15 pending applications·1,551 citations·filing 1991–2022
95Inventor score
Files withACCRETECH USA INC8DTM CORP6APPLIED MATERIALS INC5VARIAN SEMICONDUCTOR EQUIPMENT3VARIAN SEMICONDUCTOR EQUIPMENT ASS INC3
Top patents by PatentIndex Score
30 records- 0198US6136948ASinterable semi-crystalline powder and near-fully dense article formed therewithDTM CORP·Filed 1997·Granted Oct 24, 2000·314 cites·30 claims
- 0298US5648450ASinterable semi-crystalline powder and near-fully dense article formed thereinDTM CORP·Filed 1996·Granted Jul 15, 1997·209 cites·70 claims
- 0396US5733497ASelective laser sintering with composite plastic materialDTM CORP·Filed 1995·Granted Mar 31, 1998·197 cites·34 claims
- 0496US5527877ASinterable semi-crystalline powder and near-fully dense article formed therewithDTM CORP·Filed 1994·Granted Jun 18, 1996·180 cites·9 claims
- 0595US5252264AApparatus and method for producing parts with multi-directional powder deliveryDTM CORP·Filed 1991·Granted Oct 12, 1993·432 cites·26 claims
- 0694US5817206ASelective laser sintering of polymer powder of controlled particle size distributionDTM CORP·Filed 1996·Granted Oct 6, 1998·105 cites·9 claims
- 0793US7508504B2Automatic wafer edge inspection and review systemACCRETECH USA INC·Filed 2007·Granted Mar 24, 2009·44 cites·25 claims
- 0883US8814239B2Techniques for handling media arraysFORDERHASE PAUL·Filed 2012·Granted Aug 26, 2014·8 cites·20 claims
- 0978US11183418B2Two axis goniometer to accomplish fine, permanent, calibration of lift pin hoop orientationAPPLIED MATERIALS INC·Filed 2018·Granted Nov 23, 2021·2 cites·19 claims
- 1073USRE39354ESinterable semi-crystalline powder and near-fully dense article formed therewith3D SYSTEMS INC·Filed 2002·Granted Oct 17, 2006·44 cites·42 claims
- 1166US9415519B2Composite end effector and method of making a composite end effectorVARIAN SEMICONDUCTOR EQUIPMENT ASS INC·Filed 2014·Granted Aug 16, 2016·1 cites·13 claims
- 1261US7207584B2Motorized bicycle drive system using a standard freewheel and left-crank driveFORDERHASE PAUL F·Filed 2004·Granted Apr 24, 2007·15 cites·3 claims
- 1359US12464605B2Active cooling of quartz enveloped heaters in vacuumAPPLIED MATERIALS INC·Filed 2022·Granted Nov 4, 2025·0 cites·10 claims
- 1453US2015290815A1Planar end effector and method of making a planar end effectorVARIAN SEMICONDUCTOR EQUIPMENT·Filed 2014·Application pending·0 cites
- 1550US2017157909A1Planar end effector and method of making a planar end effectorVARIAN SEMICONDUCTOR EQUIPMENT ASS INC·Filed 2017·Application pending·0 cites
- 1647US2009122304A1Apparatus and Method for Wafer Edge Exclusion MeasurementACCRETECH USA INC·Filed 2008·Application pending·0 cites
- 1747US2009116727A1Apparatus and Method for Wafer Edge Defects DetectionACCRETECH USA INC·Filed 2008·Application pending·0 cites
- 1845US10446710B2Transfer chamber and method of using a transfer chamberVARIAN SEMICONDUCTOR EQUIPMENT ASS INC·Filed 2013·Granted Oct 15, 2019·0 cites·3 claims
- 1944US2014265394A1Composite end effectorsVARIAN SEMICONDUCTOR EQUIPMENT·Filed 2014·Application pending·0 cites
- 2044US2008011421A1Processing chamber having labyrinth sealACCRETECH USA INC·Filed 2007·Application pending·0 cites
- 2144US2007258085A1Substrate illumination and inspection systemROBBINS MICHAEL D·Filed 2006·Application pending·0 cites
- 2244US2008017316A1Clean ignition system for wafer substrate processingACCRETECH USA INC·Filed 2007·Application pending·0 cites
- 2344US2008190558A1Wafer processing apparatus and methodACCRETECH USA INC·Filed 2007·Application pending·0 cites
- 2444US2008010845A1Apparatus for cleaning a wafer substrateACCRETECH USA INC·Filed 2007·Application pending·0 cites
- 2544US2008011332A1Method and apparatus for cleaning a wafer substrateACCRETECH USA INC·Filed 2007·Application pending·0 cites
- 2643US2019326138A1Ceramic wafer heater with integrated pressurized helium coolingAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 2743US2019326139A1Ceramic wafer heater having cooling channels with minimum fluid dragAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 2842US2015060433A1High temperature platen power contactVARIAN SEMICONDUCTOR EQUIPMENT·Filed 2013·Application pending·0 cites
- 2937US2007062647A1Method and apparatus for isolative substrate edge area processingBAILEY JOEL B·Filed 2005·Application pending·0 cites
- 3028USD938373SSubstrate transfer structureAPPLIED MATERIALS INC·Filed 2019·Granted Dec 14, 2021·0 cites·1 claims
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